公开(公告)号：US20090231819A1

公开(公告)日：2009-09-17

申请号：US12331769

申请日：2008-12-10

Applicant: Yoshiaki SATAKE ,  Taihei Nakada

Inventor： Yoshiaki SATAKE ,  Taihei Nakada

IPC: H05K1/18

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K1/025 ,  H05K3/429 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09627 ,  H05K2201/09845 ,  H05K2201/09972

Abstract: A multilayer substrate has a 1st strip line, a 2nd strip line and the 3rd strip line, and those characteristic impedances are different each other. The third strip line has a strip conductor of which length is equivalent to ¼ wavelength of an operating frequency. A strip conductor of the third strip line is the same conductor as a strip conductor of the first strip line, and is a different conductor layer from a strip conductor of the second strip line. Ground conductors of the 3rd strip line are formed of the same conductor layer as one of a ground conductor of the 1st strip line, and the same conductor layer as one of a ground conductor of the 2nd strip line. The strip conductor of the second strip line and the strip conductor of the third strip line are connected through via hole arranged in the multilayer substrate.

Abstract translation: 多层基板具有第一带状线，第二带状线和第三带状线，并且那些特性阻抗彼此不同。 第三带状线具有条形导体，其长度等于工作频率的1/4波长。 第三带状线的带状导体是与第一带状线的带状导体相同的导体，并且是与第二带状线的带状导体不同的导体层。 第三带状线的接地导体由与第一带状线的接地导体中的一个相同的导体层和与第二带状线的接地导体之一相同的导体层形成。 第二带状带的带状导体和第三条带的带状导体通过设置在多层基板中的通孔连接。

公开(公告)号：US20090229876A1

公开(公告)日：2009-09-17

申请号：US12401141

申请日：2009-03-10

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K9/00 ,  H05K1/00 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.

Abstract translation: 柔性布线板包括：形成有导体图案的第一柔性基底材料，邻近第一柔性基底材料设置的第二柔性基底材料和覆盖第一柔性基底材料和第二柔性基底材料的绝缘层。 绝缘层暴露第一柔性基材的至少一部分。 在绝缘层上形成导体图案，并且在绝缘层上连接第一柔性基底材料的导体图形和导体图案的镀层。

公开(公告)号：US07573541B2

公开(公告)日：2009-08-11

申请号：US11399717

申请日：2006-04-07

Applicant: Hyoung-hak Kim

Inventor： Hyoung-hak Kim

IPC: G02F1/1333 ,  G09G3/30

CPC classification number: H05K1/0215 ,  G02F1/13452 ,  G02F2001/133334 ,  H05K3/361 ,  H05K2201/0715 ,  H05K2201/09354

Abstract: An LCD comprising an LCD panel on which an electrode pad is provided; a light source irradiating light to a portion of the LCD panel; a bottom chassis accommodating the light source; a driving part connected to the electrode pad and applying a driving signal to the LCD panel; a driving circuit part controlling the driving part and comprising a first driving circuit board connected to the driving part and disposed on a lateral side of the bottom chassis and a second driving circuit board connected to the first driving circuit board and disposed on portion of the bottom chassis; and an FPC connecting the first driving circuit board to the second driving circuit board and comprising a ground member electrically connected to the bottom chassis, and exposed to the outside. Accordingly, the present invention provides a liquid crystal display decreasing an EMI level of the FPC.

Abstract translation: 一种LCD，包括设置有电极焊盘的LCD面板; 将光照射到所述LCD面板的一部分的光源; 容纳所述光源的底架; 连接到电极焊盘并将驱动信号施加到LCD面板的驱动部分; 驱动电路部分，其控制所述驱动部分，并且包括连接到所述驱动部分并且设置在所述底部机架的侧面上的第一驱动电路板，以及连接到所述第一驱动电路板并设置在所述底部的一部分上的第二驱动电路板 机壳; 以及FPC，其将所述第一驱动电路板连接到所述第二驱动电路板，并且包括电连接到所述底部底盘并且暴露于外部的接地构件。 因此，本发明提供了降低FPC的EMI电平的液晶显示器。

公开(公告)号：US20090190322A1

公开(公告)日：2009-07-30

申请号：US12064432

申请日：2006-08-23

Applicant: Takuya Kojima

Inventor： Takuya Kojima

IPC: H02B1/20

CPC classification number: H01Q9/28 ,  H01Q1/243 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0265 ,  H05K1/0393 ,  H05K1/148 ,  H05K2201/0715 ,  H05K2201/09727

Abstract: A portable wireless device such as a foldable portable telephone is provided.A feeder line 7 is arranged between an upper printed board 4 and a lower printed board 5 to feed power, the upper printed board 4 and the lower printed board 5 constitute radiating elements, respectively, to allow a portable wireless device main body to operate as a dipole antenna, and an upper-to-lower circuit connecting unit 6 connecting the upper printed board 4 to the lower printed board 5 is configured to include a feeder line 7 and signal lines 10 connecting a circuit unit of the upper printed board 4 to a circuit unit of the lower printed board 5 to cause a receiver, a display 8, a microphone, an external interface and the like to operate. It is thereby possible to prevent the feeder line 7 and the signal lines 10 from rubbing against each other to damage the signal lines 10 when the foldable portable wireless device is open or closed, and to realize downsizing of the foldable portable wireless device.

Abstract translation: 提供诸如可折叠便携式电话的便携式无线设备。 馈电线7设置在上印刷电路板4和下印刷电路板5之间以供电，上印刷电路板4和下印刷电路板5分别构成辐射元件，以便便携式无线装置主体作为 偶极天线和将上印刷电路板4连接到下印刷电路板5的上下电路连接单元6被配置为包括馈线7和连接上印刷电路板4的电路单元的信号线10 下部印刷电路板5的电路单元，用于使接收器，显示器8，麦克风，外部接口等工作。 因此，可以防止馈线7和信号线10彼此摩擦，从而在可折叠便携式无线装置打开或关闭时损坏信号线10，并实现可折叠便携式无线装置的小型化。

公开(公告)号：US20090133906A1

公开(公告)日：2009-05-28

申请号：US12273634

申请日：2008-11-19

Applicant: Jae Myung BAEK

Inventor： Jae Myung BAEK

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K1/0218 ,  H05K1/0259 ,  H05K1/0393 ,  H05K3/281 ,  H05K2201/0715 ,  H05K2201/09109 ,  H05K2201/09236 ,  H05K2201/09481 ,  Y10T29/49126

Abstract: A flexible printed circuit board (FPCB) and FPCB manufacturing method that improves a signal transfer characteristic at a high speed. The FPCB includes an insulating layer having a signal pattern that transfers signals, a cover layer formed on the signal pattern, and a shielding layer formed at a position opposite to the signal pattern. The shielding layer faces at least one of the insulating layer and the cover layer across anspace formed there between.

Abstract translation: 一种柔性印刷电路板（FPCB）和FPCB制造方法，其高速地改善信号传递特性。 FPCB包括具有传递信号的信号图案的绝缘层，形成在信号图案上的覆盖层，以及形成在与信号图案相对的位置处的屏蔽层。 屏蔽层面对绝缘层和覆盖层中的至少一个穿过其间形成的空间。

公开(公告)号：US20090123116A1

公开(公告)日：2009-05-14

申请号：US12289034

申请日：2008-10-17

Applicant: Keiji Tanaka ,  Kenichiro Uchida

Inventor： Keiji Tanaka ,  Kenichiro Uchida

IPC: G02B6/36

CPC classification number: G02B6/4201 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/147 ,  H05K1/162 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/10121 ,  H05K2201/10575

Abstract: A technique is disclosed for an optical transceiver, where the frame ground is electrically isolated from the signal ground in a low frequency region and is conducted in a high frequency region, without applying a capacitor as a substantial circuit component. The transceiver includes a TOSA whose housing is grounded with the FG and connected with the driver with a FPC board. On the FPC board is formed with a parallel plate capacitor, one conductive pattern on the one surface is connected with the housing of the TOSA, while the other pattern in the opposite surface is connected with the SG. This parallel plate capacitor isolates the FG from the SG in low frequencies, while conducts the FG with the SG in high frequencies.

Abstract translation: 公开了一种用于光收发器的技术，其中框架地与低频区域中的信号地电隔离并且在高频区域中传导，而不施加电容器作为实质电路部件。 收发器包括TOSA，其外壳与FG接地，并与FPC板与驱动器连接。 在FPC基板上形成有平行平板电容器，一个表面上的一个导体图案与TOSA的外壳相连，而相反表面的另一个图案与SG连接。 这种平行电容器将FG与SG在低频下隔离，同时以高频率将SG与SG进行导通。

公开(公告)号：US07528788B2

公开(公告)日：2009-05-05

申请号：US12174960

申请日：2008-07-17

Applicant: Gregory J. Dunn ,  Robert T. Croswell ,  George H. Kumpf ,  John A. Svigelj

Inventor： Gregory J. Dunn ,  Robert T. Croswell ,  George H. Kumpf ,  John A. Svigelj

IPC: H01Q3/40

CPC classification number: H01Q15/006 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2201/09609

Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between at least two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, wherein the dielectric material (328) has a relative dielectric constant greater than 6, and (b) a mezzanine capacitor embedded within the printed circuit board (302).

Abstract translation: 高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319） 电路板（302）。 多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。 每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）至少一个电耦合在至少两个导电板（318）之间的电容器（320）。 电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）中的至少一个，其中介电材料（328）具有大于6的相对介电常数，以及（b）嵌入的夹层电容器 在印刷电路板（302）内。

公开(公告)号：US20090096082A1

公开(公告)日：2009-04-16

申请号：US12250510

申请日：2008-10-13

Applicant: ACHYUT KUMAR DUTTA

Inventor： ACHYUT KUMAR DUTTA

IPC: H01L23/12

CPC classification number: H01L23/66 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01P1/2005 ,  H01P3/08 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/024 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09681 ,  Y02P80/30 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A high speed electrical interconnection system is provided. The interconnection system comprises one or more electrical signal lines, or differential pairs of signal lines, and an inhomogeneous dielectric system. The dielectric system further comprises a homogeneous dielectric layer interposed between the electrical signal lines, and electrical conducting planes including a periodic array etched in the conducting material of the conducting plane. The inhomogeneous dielectric system exhibits a lower dielectric constant as compared to the dielectric constant of the homogeneous dielectric layer, resulting in lower microwave loss, reduced signal propagation delay, reduced signal skew, and increased signal bandwidth. The interconnection system may be implemented for connecting one or more high speed electron elements on-chip, off-chip, chip-chip connection on multilayer printed circuit boards, high speed die-package, high speed connectors, and high speed electric cables.

Abstract translation: 提供了一种高速电气互连系统。 互连系统包括一个或多个电信号线或信号线的差分对，以及不均匀的电介质系统。 电介质系统还包括介于电信号线之间的均匀介电层，以及包括在导电平面的导电材料中蚀刻的周期性阵列的导电平面。 与均匀介电层的介电常数相比，不均匀的介电系统表现出较低的介电常数，导致较低的微波损耗，降低的信号传播延迟，降低的信号偏移和增加的信号带宽。 互连系统可以实现用于连接多层印刷电路板上的一个或多个高速电子元件，片上芯片，片上芯片连接，高速模封装，高速连接器和高速电缆。

公开(公告)号：US07518884B2

公开(公告)日：2009-04-14

申请号：US11825153

申请日：2007-07-05

Applicant: Mitchel E. Wright

Inventor： Mitchel E. Wright

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09972

Abstract: An apparatus and method that permits signal traces of different widths and the same impedance to be placed on the same layer of a printed circuit board (PCB). Alternatively, signal traces of different impedances but the same width may be placed on the same layer of the PCB. Ground and power planes are paired on adjacent layers of the PCB with a portion of the power plane relative to the ground plane removed. Signal traces of the same width and different impedances or vice-versa can be placed on the same layer because each signal trace is referenced to different planes.

Abstract translation: 允许将不同宽度和相同阻抗的信号迹线放置在印刷电路板（PCB）的同一层上的装置和方法。 或者，可以将不同阻抗但相同宽度的信号迹线放置在PCB的同一层上。 地面和电力平面在PCB的相邻层上配对，电源平面相对于接地平面的一部分被去除。 相同宽度和不同阻抗或反之亦然的信号迹线可放置在同一层上，因为每个信号迹线都参照不同的平面。

公开(公告)号：US20090084583A1

公开(公告)日：2009-04-02

申请号：US12122211

申请日：2008-05-16

Applicant: Yukihiro UENO

Inventor： Yukihiro UENO

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/117 ,  H05K1/148 ,  H05K3/4652 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/2009 ,  Y10T29/49147

Abstract: Provided is a multilayer printed wiring board having a terminal portion of high quality. This multilayer printed wiring board has a flexible portion having flexibility, the flexible portion that can be bent when used, a rigid portion formed continuously with the flexible portion, the rigid portion having greater rigidity than the flexible portion, and a terminal portion formed continuously with the flexible portion at an end portion of the flexible portion. The rigid portion includes a rigid layer having insulation properties. The terminal portion includes an insulating layer formed of the same material as that for the rigid layer, the insulating layer having a conductive layer formed on the surface thereof, the conductive layer having a predetermined terminal pattern and serving as a connecting terminal.

Abstract translation: 提供一种具有高质量端子部分的多层印刷线路板。 该多层印刷布线板具有挠性部分，柔性部分可在使用时弯曲，柔性部分与柔性部分连续形成，刚性部分具有比挠性部分更大的刚性，以及连接部分形成的端部部分 柔性部分的柔性部分。 刚性部分包括具有绝缘性质的刚性层。 端子部分包括由与刚性层相同的材料形成的绝缘层，绝缘层在其表面上形成有导电层，导电层具有预定的端子图案并用作连接端子。