Abstract:
Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.
Abstract:
A resin sheet (100) is provided with a resin layer (120), and a passivation layer (110) laminated on one surface of the resin layer (120). The resin sheet (100) has a rectangular shape in a plan view. The periphery of the passivation layer (110) extends outward from the periphery of the resin layer (120). The resin layer (120) is provided with a flat section (121), and a slope section (122) wherein the thickness of the resin layer (120) gradually reduces toward the outside from the flat section (121). A difference between the resin thickness (d) of the boundary section (123) between the slope section (122) and the flat section (121) of the resin layer (120), and an average thickness (D) of the flat section (121) is 5% or less of the average thickness (D).
Abstract:
An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass fit, and reflects light from the LED chips.
Abstract:
In a many-up wiring substrate including a base substrate having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions, the plurality of wiring substrate regions being arranged in a matrix, when seen in a transparent plan view, dividing grooves of the main surface and dividing grooves of an opposite main surface are formed to be deviated in one direction of transverse direction or longitudinal direction, and a distance between bottoms of the dividing grooves of one main surface and bottoms of the dividing grooves of the opposite main surface is smaller than a distance between the bottoms of the dividing grooves of the one main surface and the opposite main surface and a distance between the bottoms of the dividing grooves of the opposite main surface and the one main surface.
Abstract:
A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.
Abstract:
A liquid crystal display module (LCDM) includes a liquid crystal panel; a backlight unit disposed under the liquid crystal panel and projecting light on the light crystal panel; a main frame surrounding a side of the backlight unit and a side of the liquid crystal panel; an integrated printed circuit board (PCB) connected to the liquid crystal panel and disposed at a side surface of the main frame, the integrated PCB including a data unit for providing a data driving signal to the liquid crystal panel, a signal generating unit for generating a data control signal, a gate control signal, and a power source signal and a timing control unit; a connector disposed on the integrated PCB and including a slot along the side surface of the main frame, the connector for receiving a signal from an external unit; a bottom frame under the backlight unit; a system board on a rear side of the bottom frame; a flexible cable connecting the connector and the system board; and a top frame covering edges of the liquid crystal panel and combined with the main frame and the bottom frame.
Abstract:
A resin sheet (100) is provided with a resin layer (120), and a passivation layer (110) laminated on one surface of the resin layer (120). The resin sheet (100) has a rectangular shape in a plan view. The periphery of the passivation layer (110) extends outward from the periphery of the resin layer (120). The resin layer (120) is provided with a flat section (121), and a slope section (122) wherein the thickness of the resin layer (120) gradually reduces toward the outside from the flat section (121). A difference between the resin thickness (d) of the boundary section (123) between the slope section (122) and the flat section (121) of the resin layer (120), and an average thickness (D) of the flat section (121) is 5% or less of the average thickness (D).
Abstract:
A liquid crystal display module (LCDM) includes a liquid crystal panel; a backlight unit disposed under the liquid crystal panel and projecting light on the light crystal panel; a main frame surrounding a side of the backlight unit and a side of the liquid crystal panel; an integrated printed circuit board (PCB) connected to the liquid crystal panel and disposed at a side surface of the main frame, the integrated PCB including a data unit for providing a data driving signal to the liquid crystal panel, a signal generating unit for generating a data control signal, a gate control signal, and a power source signal and a timing control unit; a connector disposed on the integrated PCB and including a slot along the side surface of the main frame, the connector for receiving a signal from an external unit; a bottom frame under the backlight unit; a system board on a rear side of the bottom frame; a flexible cable connecting the connector and the system board; and a top frame covering edges of the liquid crystal panel and combined with the main frame and the bottom frame.
Abstract:
A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.
Abstract:
A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.