公开(公告)号：US06914200B2

公开(公告)日：2005-07-05

申请号：US10832436

申请日：2004-04-27

Applicant: Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K1/00 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4632 ,  H05K1/0393 ,  H05K3/244 ,  H05K3/246 ,  H05K3/247 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

Abstract translation: 一种多层布线基板组合体，多层布线基板组装部件及其制造方法，其中可以容易地将具有高封装密度的柔性FPC通过通孔通孔和芯片通孔层叠在一起。 通过层叠多个多层布线板组装部件来层叠多层布线基板组件，该多个多层布线基板组装部件通过制备由镀铜树脂膜制成的镀铜树脂膜10，该镀铜树脂膜由具有粘合性的树脂膜制成，该树脂膜具有 在其一个表面上结合有铜箔，其中通过所述铜箔和所述树脂膜打开通孔，以及通过丝网印刷嵌入所述镀铜树脂膜的所述铜箔的所述铜箔的通孔中的导电糊状填料， 所述导电浆料填充物的前端从所述树脂膜突出。

公开(公告)号：US06914199B2

公开(公告)日：2005-07-05

申请号：US10920185

申请日：2004-08-18

Applicant: Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K1/00 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11 ,  H01R12/04

CPC classification number: H05K3/4635 ,  H05K1/0393 ,  H05K3/246 ,  H05K3/247 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/249996

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the copper foil, resin film, and the adhesive layer, filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.

Abstract translation: 多层布线基板组件，多层布线基板组装部件及其制造方法。 多层布线基板组合体是将具有柔性树脂薄膜的多个多层布线基板组件与铜箔结合在一个表面上而形成的粘合剂层，并且在该镀铜树脂中开孔 通过铜箔，树脂膜和粘合剂层，用从粘合剂层突出的导电膏填充通孔，并横向延伸超过铜箔的开孔。

公开(公告)号：US20050016765A1

公开(公告)日：2005-01-27

申请号：US10920185

申请日：2004-08-18

Applicant: Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

Inventor： Reiji Higuchi ,  Shouji Itou ,  Osamu Nakao

IPC: H05K1/00 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K3/4635 ,  H05K1/0393 ,  H05K3/246 ,  H05K3/247 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/249996

Abstract: A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the cooper foil, resin film, and the adhesive layer, and filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.

Abstract translation: 多层布线基板组件，多层布线基板组装部件及其制造方法。 多层布线基板组合体是将具有柔性树脂薄膜的多个多层布线基板组件与铜箔结合在一个表面上而形成的粘合剂层，并且在该镀铜树脂中开孔 通过铜箔，树脂膜和粘合剂层形成膜，并且用从粘合剂层突出并且横向延伸超过铜箔的开孔的导电膏填充通孔。

公开(公告)号：US06800935B2

公开(公告)日：2004-10-05

申请号：US10256692

申请日：2002-09-27

Applicant: Toshiharu Yoneda

Inventor： Toshiharu Yoneda

IPC: H01L2941

CPC classification number: H05K1/0243 ,  H05K3/3421 ,  H05K2201/09481 ,  H05K2201/10174 ,  H05K2201/10969

Abstract: A switching circuit includes an insulating substrate including two signal transmission lines; a switching diode mounted, in series between the two signal transmission lines, on the insulating substrate, wherein an anode terminal and a cathode terminal are connected to the two signal transmission lines, and the switching diode is turned on or off; and a conductive pattern formed, below the switching diode, on a mounting face of the insulating substrate on which the switching diode is mounted, wherein the conductive pattern is grounded. There are stray capacitances between the anode terminal and the conductive pattern and between the cathode terminal and the conductive pattern.

Abstract translation: 开关电路包括：绝缘基板，包括两条信号传输线; 串联在两个信号传输线之间的绝缘基板上的开关二极管，其中阳极端子和阴极端子连接到两个信号传输线，并且开关二极管导通或关断; 以及在开关二极管的下方形成在其上安装有开关二极管的绝缘基板的安装面上的导电图案，其中导电图案接地。 在阳极端子和导电图案之间以及阴极端子和导电图案之间存在杂散电容。

公开(公告)号：US20040045737A1

公开(公告)日：2004-03-11

申请号：US10640272

申请日：2003-08-14

Applicant: SONY CHEMICALS CORP.

Inventor： Hiroyuki Hishinuma ,  Hideyuki Kurita ,  Ryo Ito ,  Masayuki Nakamura

IPC: H05K001/00

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0759 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16.

Abstract translation: 根据本发明的制造柔性布线板的方法包括使用通过光刻图案化的掩模膜生长金属凸块16。 可以精确地形成精细的开口，因此，由于激光束不用于在聚酰亚胺膜中形成开口，所以可以以高精度形成精细的金属凸块16。 在形成金属凸块16之后，去除掩模膜并施加液态树脂材料并干燥以形成涂层，然后将其固化成树脂膜。 可以在涂覆阶段期间在表面部分蚀刻涂层以暴露金属凸块16的顶部。

公开(公告)号：US06650203B2

公开(公告)日：2003-11-18

申请号：US09812433

申请日：2001-03-20

Applicant: Bruno Gerstenberg ,  Hans-Joachim Michling ,  Helmut Messmer

Inventor： Bruno Gerstenberg ,  Hans-Joachim Michling ,  Helmut Messmer

IPC: H03H701

CPC classification number: H05K1/0233 ,  H03H2001/0014 ,  H05K1/0216 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/162 ,  H05K2201/0715 ,  H05K2201/09481 ,  H05K2201/09627 ,  H05K2201/09672 ,  H05K2201/09972 ,  H05K2201/1003

Abstract: The invention relates to a filter arrangement for separating radio frequency energy from signal energy in a signal line. The signal line extends at least partly in a first layer of a multi-layer printed circuit board. A grounded surface is arranged in a second layer of the printed circuit board. The signal line to be filtered is interrupted in the first layer in the filter region and continued in a third layer, the second and the third layers being located on opposite sides of the first layer. Due to the skin effect the radio frequency energy will be concentrated on the side of the signal line facing the grounded surface. The side of the signal line remote from the grounded surface is then to a large extent decoupled from radio frequency energy, such that the actual signal path can be continued without being disturbed by radio frequency energy.

Abstract translation: 本发明涉及一种用于将射频能量与信号线中的信号能分离的滤波器装置。 信号线至少部分地延伸到多层印刷电路板的第一层中。 接地表面布置在印刷电路板的第二层中。 要滤波的信号线在滤波器区域的第一层中断，并在第三层中继续，第二和第三层位于第一层的相对侧。 由于皮肤效应，射频能量将集中在面向接地表面的信号线的一侧。 远离接地表面的信号线的一侧在很大程度上与射频能量解耦，使得实际的信号路径可以继续而不受射频能量的干扰。

公开(公告)号：US06643923B1

公开(公告)日：2003-11-11

申请号：US09744572

申请日：2001-02-28

Applicant: Hiroyuki Hishinuma ,  Hideyuki Kurita ,  Ryo Ito ,  Masayuki Nakamura

Inventor： Hiroyuki Hishinuma ,  Hideyuki Kurita ,  Ryo Ito ,  Masayuki Nakamura

IPC: H05K302

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0759 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps (16) using a mask film patterned by photolithography. Fine openings are formed in a polyimide film with good precision allowing fine metal bumps (16) to be formed with good precision. After metal bumps (16) have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps (16).

Abstract translation: 根据本发明的柔性线路板的制造方法包括使用通过光刻图案化的掩模膜生长金属凸块（16）。 在聚酰亚胺膜中形成精细的开口，精度高，能够精确地形成精细的金属凸块（16）。 在形成金属凸块（16）之后，除去掩模膜并施加液体树脂材料并干燥以形成涂层，然后将其固化成树脂膜。 涂层可以在涂覆阶段在表面部分进行蚀刻以暴露金属凸块（16）的顶部。

公开(公告)号：US06629366B1

公开(公告)日：2003-10-07

申请号：US09548605

申请日：2000-04-13

Applicant: Kazutaka Kobayashi

Inventor： Kazutaka Kobayashi

IPC: H05K310

CPC classification number: H05K3/4647 ,  H01L2224/11 ,  H05K3/205 ,  H05K3/445 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multilayer wiring board having a core substrate and wiring line patterns formed on both faces of the core substrate, the core substrate having conducting members piercing through the core substrate, and members of the wiring line patterns on both faces of the core substrate being connected with each other through the conducting member piercing through the core substrate, wherein the core substrate comprises via columns and conductive structural members, which are formed by plating, and an insulating structural member, which electrically insulates the individual via columns and conductive structural members from each other, the via column piercing through the core substrate and serving as the conducting member for connecting the members of the wiring line patterns on both faces of the core substrate with each other. A method of producing such a multilayer wiring board is also disclosed.

Abstract translation: 一种多芯线基板，其具有在芯基板的两面上形成的芯基板和布线图案，芯基板具有贯穿芯基板的导电部件，芯基板的两面的布线图案的部件与 彼此通过导电构件穿过芯基板，其中芯基板包括通过电镀形成的通孔列和导电结构构件，以及绝缘结构构件，其将各个通孔列和导电结构构件彼此电绝缘 所述通孔柱穿过所述芯基板并且用作用于将所述芯基板的两个面上的布线图案的构件彼此连接的导电构件。 还公开了一种制造这种多层布线板的方法。

公开(公告)号：US06535012B1

公开(公告)日：2003-03-18

申请号：US09568707

申请日：2000-05-11

Applicant: Alan G. Wood ,  Tim J. Corbett

Inventor： Alan G. Wood ,  Tim J. Corbett

IPC: G01R3128

CPC classification number: H01L24/80 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0491 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2855 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2886 ,  G01R31/2889 ,  G01R31/2893 ,  H01L22/20 ,  H01L22/22 ,  H01L23/13 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723

Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

Abstract translation: 用于测试半导体晶片上的无引脚骰子的可重复使用的老化/测试夹具由两半组成。 测试夹具的前半部分是用于接收晶片的晶片腔板，第二半部分在晶片和电气测试设备之间建立电气连通。 刚性基板在其上具有与晶片电接触的导体。 在老化和电气测试完成之前，测试夹具不需要打开。 在老化应力和电气测试之后，可以将单个裸片或单独的封装裸片与封装裸片之间建立互为独立部件，阵列或簇的互连，或者作为单个部分或阵列。

公开(公告)号：US20030040139A1

公开(公告)日：2003-02-27

申请号：US09934175

申请日：2001-08-21

Inventor： Robert L. Canella

IPC: H01L021/48 ,  H01L021/44

CPC classification number: G01R1/0466 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/325 ,  H05K3/42 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2201/10265 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0242 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01004

Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pinout of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.

Abstract translation: 用于在IC器件的引线元件和衬底之间建立电接触的弹簧触点。 弹簧接触件通常包括接触部分和基部。 通常包括线圈型压缩弹簧的接触部分构造成与IC器件的引线元件接合并弹性偏压。 弹簧触点设置在形成在基板中的配合孔中。 弹簧触点的基部构造成将弹簧触头固定在配合孔内并与基底建立电接触。 多个这样的弹簧触点和配合孔可以以对应于IC器件的引脚排列的阵列布置在衬底上。 夹紧元件将IC器件固定到基板上，并使IC器件抵抗弹簧触点偏压。