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    Contact bridge arrangement for conductively interconnecting circuit boards
    131.
    发明授权
    Contact bridge arrangement for conductively interconnecting circuit boards 失效
    用于导电互连电路板的接触桥布置

    公开(公告)号：US06188583B1

    公开(公告)日：2001-02-13

    申请号：US09211459

    申请日：1998-12-14

    Applicant: Guenter Fendt ,  Richard Baur ,  Michael Bischoff

    Inventor： Guenter Fendt ,  Richard Baur ,  Michael Bischoff

    IPC: H05K114

    CPC classification number: H05K7/142 ,  H01R12/52 ,  H05K1/142 ,  H05K1/144 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/2036 ,  H05K2203/167

    Abstract: A contact bridge arrangement in a housing of an electronic assembly provides a simplified electrical interconnection of circuit boards while avoiding the need of electrical plugs, sockets and connector cables for connecting the circuit boards. The contact bridge includes an insulating block provided on the floor of the housing, and a plurality of conducting connectors embedded in the insulating block. First electrical contacts, such as contact pads with holes therein, are provided on the circuit boards, and engage the second electrical contacts in the form of contact pins provided by the free ends of the conducting connectors protruding from the insulating block. Assembling the arrangement simply requires pressing the circuit boards onto the contact pins of the contact bridge. The insulating block of the contact bridge may have a step configuration providing two offset flat support surfaces on which two circuit boards may be supported one above the other with a spacing therebetween.

    Abstract translation: 在电子组件的壳体中的接触桥布置提供了电路板的简化的电互连，同时避免了用于连接电路板的电插头，插座和连接器电缆的需要。 接触桥包括设置在壳体的地板上的绝缘块和嵌入绝缘块中的多个导电连接器。 在电路板上设有第一电触头，例如具有孔的接触垫，并且以从绝缘块突出的导电连接器的自由端提供的接触销的形式接合第二电触点。 组装该装置只需要将电路板按压到接触桥的接触针上。 接触桥的绝缘块可以具有提供两个偏移的平坦支撑表面的台阶配置，其上两个电路板可以彼此之间以间隔一个地彼此支撑。

    Electronic control board assembly including embedded lead frames for electrically connecting the circuit boards of the assembly
    132.
    发明授权
    Electronic control board assembly including embedded lead frames for electrically connecting the circuit boards of the assembly 失效
    电子控制板组件，包括用于电连接组件的电路板的嵌入式引线框架

    公开(公告)号：US5699235A

    公开(公告)日：1997-12-16

    申请号：US507729

    申请日：1995-07-26

    Applicant: Osamu Tsurumiya ,  Hitoshi Suda ,  Kazuyuki Iwasaki ,  Naofumi Inomata

    Inventor： Osamu Tsurumiya ,  Hitoshi Suda ,  Kazuyuki Iwasaki ,  Naofumi Inomata

    IPC: H05K1/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/20 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36 ,  H05K5/00 ,  H05K7/14 ,  H01R9/09 ,  H01R23/68

    CPC classification number: H05K1/0265 ,  H05K1/141 ,  H05K5/0047 ,  H05K7/1432 ,  H05K1/144 ,  H05K2201/0352 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/09972 ,  H05K3/202 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/366 ,  H05K3/368

    Abstract: An electronic control board assembly has a large-current control unit and a small-current control unit connected to the large-current control unit. The large-current control unit has an insert-molded board with lead frames embedded therein. The insert-molded board has a first component mounting surface and a first component soldering surface facing away therefrom. A first group of components are mounted on the first component mounting surface and have leads extending through the insert-molded board and soldered to the lead frames. The small-current control unit has a printed wiring board which has a second component mounting surface and a second component soldering surface facing away therefrom. A second group of components are mounted on the second component mounting surface and have leads extending through the printed wiring board and soldered to interconnections patterned on the second component soldering surface. The lead frames have ends extending through the printed wiring board and soldered to the interconnections. The first component soldering surface and the second component soldering surface face outwardly.

    Abstract translation: 电子控制板组件具有连接到大电流控制单元的大电流控制单元和小电流控制单元。 大电流控制单元具有插入成型板，其中引入框架嵌入其中。 插入成型板具有第一部件安装表面和与其背离的第一部件焊接表面。 第一组部件安装在第一部件安装表面上，并且具有延伸穿过嵌入成型板并且焊接到引线框架的引线。 小电流控制单元具有印刷电路板，其具有第二部件安装表面和与其背离的第二部件焊接表面。 第二组部件安装在第二部件安装表面上，并具有延伸穿过印刷线路板的引线，并焊接到在第二部件焊接表面上图案化的互连。 引线框架的端部延伸穿过印刷电路板并焊接到互连。 第一部件焊接表面和第二部件焊接表面朝外。

    Electrically connectable module with embedded electrical connectors electrically connected to conductive traces
    133.
    发明授权
    Electrically connectable module with embedded electrical connectors electrically connected to conductive traces 失效
    电连接模块与嵌入式电连接器电连接导电迹线

    公开(公告)号：US5297969A

    公开(公告)日：1994-03-29

    申请号：US69465

    申请日：1993-06-01

    Applicant: David A. Mantell

    Inventor： David A. Mantell

    IPC: H01B5/14 ,  H01L21/48 ,  H01L23/498 ,  H01R11/01 ,  H01R13/03 ,  H01R29/00 ,  H01R43/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/00

    CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01R13/03 ,  H05K3/105 ,  H05K3/4092 ,  H01L2924/0002 ,  H01R29/00 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2203/107 ,  H05K2203/1136 ,  H05K3/403 ,  Y10S428/901 ,  Y10T29/49144 ,  Y10T29/49162 ,  Y10T29/49224

    Abstract: An electrically connectable module is manufactured from a substrate of an electrically insulating polymer matrix doped with an electrically insulating fibrous filler capable of heat conversion to an electrically conductive fibrous filler to form a fiber-doped substrate. One end of an electrical connector is embedded in the fiber-doped substrate to locate the one end adjacent the surface of the substrate while exposing an opposite end of the electrical connector. The surface of the fiber-doped substrate is locally heated preferably with a laser to form a conductive trace by the in-situ heat conversion of the electrically insulating fibrous filler, the localized heating including the one end of the electrical connector to electrically connect the electrical connector to the conductive trace. In another embodiment, a conductive material is electrodeposited on the conductive trace by applying a voltage to the opposite end of the electrical connector. The substrate is molded into a desired shape to form the module, and a plurality of electrical connectors can be embedded into the substrate in any one of several different standardized arrangements.

    Abstract translation: 可电连接的模块由掺杂有能够热转化成导电纤维填料的电绝缘纤维填料的电绝缘聚合物基体的基底制成，以形成纤维掺杂的基底。 电连接器的一端嵌入在光纤掺杂衬底中，以将一端邻近衬底的表面定位，同时露出电连接器的相对端。 纤维掺杂衬底的表面优选地通过激光局部加热，以通过电绝缘纤维填料的原位热转化形成导电迹线，局部加热包括电连接器的一端以将电气 连接器到导电迹线。 在另一个实施例中，通过向电连接器的相对端施加电压，将导电材料电沉积在导电迹线上。 将基板模制成所需的形状以形成模块，并且多个电连接器可以以几种不同的标准化布置中的任何一种嵌入到基板中。

    Method for producing a metallized pattern on a substrate
    136.
    发明授权
    Method for producing a metallized pattern on a substrate 失效
    在基板上制造金属化图案的方法

    公开(公告)号：US5091218A

    公开(公告)日：1992-02-25

    申请号：US569254

    申请日：1990-08-16

    Applicant: Leonard F. Altman ,  Dale W. Dorinski

    Inventor： Leonard F. Altman ,  Dale W. Dorinski

    IPC: C23C14/04 ,  H01L21/48 ,  H01P11/00 ,  H05K1/11 ,  H05K3/14 ,  H05K3/40

    CPC classification number: H05K3/4092 ,  C23C14/04 ,  H01L21/4846 ,  H01P11/003 ,  H01P11/008 ,  H05K3/146 ,  H05K1/119 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/09809

    Abstract: A method of producing a metallized pattern on a substrate includes the steps of providing a substrate having a high aspect ratio groove defining a desired metallization pattern and applying metallization to the substrate. The high aspect ratio groove is utilized to prevent metallization across the groove boundary thereby producing electrically isolated areas. The substrate can be a circuit board, hybrid module or other component carrying structure. Also the substrate can be a resonator or a stripline device in which the groove is used to electrially isolate a lead or wire extending from the substrate in the ground plane portion of the structure.

    Abstract translation: 在衬底上制造金属化图案的方法包括以下步骤：提供具有限定期望的金属化图案的高纵横比凹槽的衬底并将金属化应用于衬底。 高纵横比凹槽用于防止跨越沟槽边界的金属化，从而产生电隔离的区域。 基板可以是电路板，混合模块或其他部件承载结构。 此外，衬底可以是谐振器或带状线器件，其中沟槽用于电气隔离在结构的接地平面部分中从衬底延伸的引线或线。

    Circuit board for mounting electronic components
    139.
    发明授权
    Circuit board for mounting electronic components 失效
    用于安装电子元件的电路板

    公开(公告)号：US4949225A

    公开(公告)日：1990-08-14

    申请号：US237385

    申请日：1988-08-29

    Applicant: Katsumi Sagisaka ,  Sadahisa Furuhashi

    Inventor： Katsumi Sagisaka ,  Sadahisa Furuhashi

    IPC: H01L25/00 ,  H01L23/12 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K5/00

    CPC classification number: H05K3/4092 ,  H01R12/523 ,  H05K3/202 ,  H05K3/4641 ,  H05K5/0091 ,  H01L2224/16 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K3/429 ,  H05K3/4611

    Abstract: In a circuit board wherein a plurality of leads 21 electrically independent of one another protrude from a base member 10, and the respective leads 21 are electrically connected with connection portions 31 of an electronic component 30 mounted on the base member 10; an electronic component mounting circuit board 100 characterized in that internal connection portions 22 are unitarily formed on inner sides of metal members 20 constructing said respective leads 21, that the base members 10 are integrally disposed on both surfaces of said internal connection portions 22, that the electronic components 30 are mounted on said base members 10, and that said electronic components 30 and said internal connection portions 22 are electrically connected. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting circuit board which facilitates the design of circuits, which dispenses with the resin molding of the connected portions between the electronic components and the respective leads and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic components is excellent.

    Abstract translation: 在彼此电独立的多个引线21从基体10突出的电路板中，各引线21与安装在基座部件10上的电子部件30的连接部31电连接。 一种电子部件安装电路板100，其特征在于，内部连接部22一体地形成在构成所述各个引线21的金属部件20的内侧，基部部件10一体地设置在所述内部连接部22的两个表面上， 电子部件30安装在所述基座部件10上，电子部件30和内部连接部22电连接。 因此，根据本发明，可以提供一种简单构造的电子部件安装电路板，其有助于电路的设计，其省去了电子部件和各个引线之间的连接部分的树脂模制，并且提供了良好的连接 可靠性，其可以容易地形成散热结构，并且其中与电子部件的热匹配是优异的。

    Component-carrying adapter for chip carrier socket
    140.
    发明授权
    Component-carrying adapter for chip carrier socket 失效
    用于芯片载体插座的组件承载适配器

    公开(公告)号：US4872844A

    公开(公告)日：1989-10-10

    申请号：US216927

    申请日：1988-07-08

    Applicant: Robert K. Grebe ,  John E. Lucius ,  David S. Szczesny

    Inventor： Robert K. Grebe ,  John E. Lucius ,  David S. Szczesny

    IPC: H01R12/71 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10

    CPC classification number: H05K7/1092 ,  H05K1/141 ,  H05K1/183 ,  H05K2201/09509 ,  H05K2201/09754 ,  H05K2201/10037 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K3/3447 ,  H05K3/368 ,  Y10S439/931

    Abstract: An adapter substrate (40) for carrying one or more electrical components (80,90), includes plated circuitry to which the components are connectable, to comprise a member securable between a chip carrier socket (20) and a printed circuit panel (14) and provide electrical interconnection therebetween. The electrical components are connected to selected ones of the interconnections between the socket and the panel in order to modify, effect or sense the selected interconnections. While the other interconnections are passed through the substrate such as by plated through-holes (44), the selected interconnections are interrupted by the dielectric material of the substrate (40) and are plated blind holes (46) connected by path segments (120) to be electrically connected to the one or more electrical components; completing the connection to the socket's contacts are plated through-holes (116) and path segments (128) to contact pads (52). Into the plated through-holes and plated blind holes alike can be inserted post members (42) matable with plated through-holes (16) of the panel; contact sections connectable with the socket's contacts (28 ) can be pads (52) for surface mounting. One such adapter can be used to fabricate an assured backup power supply (10) for an IC chip carried in the socket (20), when a battery (80) and a logic chip control circuit (90) therefor are the electrical components.

    Abstract translation: 用于承载一个或多个电气部件（80,90）的适配器基板（40）包括可连接部件的电镀电路，以包括可固定在芯片载体插座（20）和印刷电路板（14）之间的部件， 并在它们之间提供电互连。 电气部件连接到插座和面板之间的选定的互连中，以便修改，影响或感测所选择的互连。 当其它互连通过诸如电镀通孔（44）的衬底时，所选择的互连被衬底（40）的电介质材料中断，并且是由路径段（120）连接的电镀盲孔（46） 电连接到一个或多个电气部件; 完成与插座触点的连接是电镀通孔（116）和路径段（128）到接触垫（52）。 电镀通孔和电镀盲孔可以插入可与面板的电镀通孔（16）配合的柱构件（42）; 可与插座的触点（28）连接的接触部分可以是用于表面安装的垫（52）。 当电池（80）和其逻辑芯片控制电路（90）是电气部件时，可以使用一个这样的适配器来制造承载在插座（20）中的IC芯片的有保证的备用电源（10）。

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