公开(公告)号：US07303932B2

公开(公告)日：2007-12-04

申请号：US10974889

申请日：2004-10-28

Applicant: Kensho Sakano

Inventor： Kensho Sakano

IPC: H01L21/66 ,  H05K11/14 ,  H05K1/00

CPC classification number: H01L33/62 ,  H01L23/49805 ,  H01L24/45 ,  H01L33/486 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/284 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device comprises a semiconductor element and a support body made of a stack of ceramic layers having a recess in which electrical conductors are electrically connected with the semiconductor element, wherein at least a part of a top face of a recess side wall is covered by a resin, thereby providing a light emitting device.

Abstract translation: 半导体器件包括半导体元件和由堆叠的陶瓷层制成的支撑体，其具有凹部，电导体与半导体元件电连接，其中凹部侧壁的顶面的至少一部分被覆盖 树脂，从而提供发光器件。

公开(公告)号：US20070242441A1

公开(公告)日：2007-10-18

申请号：US11403840

申请日：2006-04-14

Applicant: Matthew Aldrich ,  Jack Rains

Inventor： Matthew Aldrich ,  Jack Rains

IPC: H05K7/00

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10651 ,  Y02P70/611

Abstract: Disclosed examples of printed circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts of an LED of a first structural type, e.g. from a first product line or manufacturer. The other pad set is configured to mate with contacts of an LED of a second type, e.g. from a different product line or manufacturer. The layout may enable an easy system re-design, e.g. to shift from one type of LED to another. Alternatively, the layout may enable one system to use LEDs of the two different types in a single LED set or array. Exemplary systems disclosed herein include an element for mixing light produced by LEDs mounted to the landing zones, such as an optical integrating cavity.

Abstract translation: 用于照明系统的印刷电路板的公开示例具有印刷在板上的相同的LED着陆区。 每个区域包括至少两组LED接触焊盘。 一个焊盘组被配置为与第一结构类型的LED的触点（例如， 从第一个产品线或制造商。 另一个焊盘组被配置为与第二类型的LED的触点配合，例如， 来自不同的产品线或制造商。 该布局可以实现简单的系统重新设计，例如。 从一种类型的LED转移到另一种类型的LED。 或者，布局可以使得一个系统能够在单个LED组或阵列中使用两种不同类型的LED。 本文公开的示例性系统包括用于混合由安装到着陆区域的LED产生的光的元件，例如光学积分腔。

公开(公告)号：US20070111595A1

公开(公告)日：2007-05-17

申请号：US11309280

申请日：2006-07-21

Applicant: Li Liu

Inventor： Li Liu

IPC: H01R13/60

CPC classification number: H05K3/005 ,  H01R12/57 ,  H05K1/0295 ,  H05K1/116 ,  H05K2201/0382 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A printed circuit board includes a mounting hole for receiving a connector pin of either of a first SMC and a second SMC, and a signal line. The signal line is electrically connected to the mounting hole by a conductive layer arranged in and about the mounting hole.

Abstract translation: 印刷电路板包括用于接收第一SMC和第二SMC中的任一个的连接器引脚的安装孔和信号线。 信号线通过布置在安装孔内和周围的导电层电连接到安装孔。

公开(公告)号：US20060279375A1

公开(公告)日：2006-12-14

申请号：US11275454

申请日：2006-01-05

Applicant: Joseph Martine

Inventor： Joseph Martine

IPC: H01P1/22

CPC classification number: H05K3/301 ,  H01R31/06 ,  H05K2201/09954 ,  H05K2201/10121 ,  H05K2201/10325 ,  H05K2201/10598

Abstract: An attenuator pad adapter for utilizing a replacement attenuator pad in place of another attenuator pad intended for use on a printed circuit board. The attenuator pad adapter has a body portion with a plurality of pins extending from one of its ends that correspond with pins of the originally intended attenuator pad. A slot in an opposite end is configured to detachably receive an end of the replacement attenuator pad. Openings in the slot receive pins on an end of the replacement attenuator pad. The pins of the replacement attenuator pad electrically interconnect connect with the pins extending from the body portion of the attenuator pad adapter. The pins of the replacement attenuator pad are arranged differently than the pins extending from either the body portion or the originally intended attenuator pad.

Abstract translation: 一个衰减器垫适配器，用于代替另一个用于印刷电路板的衰减器垫的替换衰减器垫。 衰减器垫适配器具有主体部分，其具有从其端部之一延伸的多个销，其对应于原始预期的衰减器焊盘的引脚。 相对端的狭槽被配置为可拆卸地接收替换衰减器垫的一端。 插槽中的开口接收更换衰减器垫一端的引脚。 替换衰减器垫的引脚电互连连接到从衰减器垫适配器的主体部分延伸的引脚。 替换衰减器垫的引脚布置成不同于从主体部分或原始预期的衰减器垫延伸的引脚。

公开(公告)号：US20060245164A1

公开(公告)日：2006-11-02

申请号：US10908122

申请日：2005-04-28

Applicant: Yen-Ming Chen

Inventor： Yen-Ming Chen

IPC: H05K7/20

CPC classification number: H05K1/181 ,  H05K3/3421 ,  H05K2201/09954 ,  H05K2201/10166 ,  H05K2201/10522 ,  Y02P70/611

Abstract: A 6-pin electronic package includes a first side including a pair of first outer pins and a first middle pin, and a second side including a pair of second outer pins and a second middle pin. The first outer pins and the second middle pin are operatively coupled to a first circuit to provide a first function. The second outer pins and the first middle pin are operatively coupled to a second circuit to provide a second function. The 6-pin electronic package can be replaced on a circuit substrate with a first electronic package and a second electronic package that collectively include at least six pins. The 6-pin electronic package and the first and second electronic packages can be interchangeably used on a circuit substrate of an electronic device. The circuit substrate may include any one of the 6-pin electronic package mountable to the circuit substrate, and the first and second electronic packages. The first electronic package is mountable on the circuit substrate on a same footprint as the 6-pin electronic package. The second electronic package is mountable on the circuit substrate adjacent the first electronic package such that six pins of the first and second electronic packages share the same footprint as the pins of the 6-pin electronic package.

Abstract translation: 6引脚电子封装包括包括一对第一外部引脚和第一中间引脚的第一侧和包括一对第二外部引脚和第二中间引脚的第二侧。 第一外部引脚和第二中间引脚可操作地耦合到第一电路以提供第一功能。 第二外部引脚和第一中间引脚可操作地耦合到第二电路以提供第二功能。 6针电子封装可以在具有第一电子封装的电路基板上被替换，而第二电子封装共同包括至少六个引脚。 6针电子封装以及第一和第二电子封装可以互换地用于电子设备的电路基板上。 电路基板可以包括可安装到电路基板的6针电子封装以及第一和第二电子封装中的任何一个。 第一个电子封装以与6针电子封装相同的占位面安装在电路基板上。 第二电子封装可安装在邻近第一电子封装的电路基板上，使得第一和第二电子封装的六个引脚与6针电子封装的引脚共用相同的封装。

公开(公告)号：US20060195804A1

公开(公告)日：2006-08-31

申请号：US11231642

申请日：2005-09-21

Applicant: Norman Rogers ,  John Hoffman ,  Jun Feng ,  Charles Krauter

Inventor： Norman Rogers ,  John Hoffman ,  Jun Feng ,  Charles Krauter

IPC: G06F17/50

CPC classification number: G06F17/5068 ,  H05K1/0206 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/111 ,  H05K1/114 ,  H05K3/0005 ,  H05K3/0064 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09418 ,  H05K2201/09454 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2203/173 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124

Abstract: A method and apparatus for configurable circuitry have been disclosed.

Abstract translation: 已经公开了可配置电路的方法和装置。

公开(公告)号：US07053472B2

公开(公告)日：2006-05-30

申请号：US10308466

申请日：2002-12-02

Applicant: Chung-Shin Mou ,  Nan-Tsung Huang ,  Young-Tarng Lin

Inventor： Chung-Shin Mou ,  Nan-Tsung Huang ,  Young-Tarng Lin

IPC: H01L21/00

CPC classification number: H05K3/3442 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/30107 ,  H05K3/3436 ,  H05K2201/09954 ,  H05K2201/10121 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optical package structure (2) includes a cover (21) defining an aperture (212) in a top portion for transmission of optical signals, a lens part (22) secured to the cover, and a base member (23) combining with the cover to define a closed space in which to package optical components. A plurality of solder pads (2311–2314, 2391–2394, 2391′, 2392′) is provided on both a top and a bottom surfaces (2321, 2342) of the base member, and a plurality of inner conductive traces (236, 239) extends through the base member and provides an electrical connection of the solder pads on the top surface to the solder pads on the bottom surface. All the solder pads on the top surface are connected to a complementary solder pad located along a first side edge of the bottom surface, and at least one of the solder pads on the top surface is electrically connected to one of the solder pads on the bottom surface which is not located along the first side edge.

Abstract translation: 一种光学封装结构（2）包括：盖（21），其在顶部部分限定用于光信号传输的孔（212）;固定到盖的透镜部分（22）和与该盖 盖以限定其中封装光学部件的封闭空间。 多个焊盘（2311-2314,2391-2394,2391'，2392'）设置在基底构件的顶表面和底表面（2321,2342）上，并且多个内导电迹线（236， 239）延伸穿过基底构件并且提供顶表面上的焊盘与底表面上的焊盘的电连接。 顶表面上的所有焊盘都连接到沿着底表面的第一侧边缘定位的互补焊盘，并且顶表面上的焊盘中的至少一个与底部的焊盘之一电连接 该表面不沿着第一侧边缘定位。

公开(公告)号：US07032827B2

公开(公告)日：2006-04-25

申请号：US10871741

申请日：2004-06-18

Applicant: Kuang-Yu Wang ,  Jim Ni ,  Sun-Teck See

Inventor： Kuang-Yu Wang ,  Jim Ni ,  Sun-Teck See

IPC: G06K19/06

CPC classification number: G06K19/07732 ,  G06K19/077 ,  H05K1/0295 ,  H05K1/117 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09954

Abstract: A memory card including a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The housing includes an enlarged window (or windows) that exposes two or more contact pads in each of the multiple rows, thereby facilitating slidable insertion of the memory card into a socket of a host system. Alignment notches are formed in the side edges of the PCB, and/or alignment pins are utilized for properly aligning the PCBA within the housing.

Abstract translation: 包括与现有13焊盘MMC机械外形尺寸一致的PCB组件的存储卡，以及与SD机械外形尺寸一致的外壳，从而提供单个PCBA和外壳布置，可用于生产MMC和 SD存储卡。 十三个接触垫支持所有MMC和SD接触焊盘图案，但是被修改以便于写保护开关。 壳体包括在多行中的每一行中暴露两个或更多个接触垫的放大窗口（或窗户），从而有助于存储卡可滑动地插入到主机系统的插座中。 对准凹口形成在PCB的侧边缘中，和/或对准销用于使PCBA在壳体内正确对准。

公开(公告)号：US06982490B1

公开(公告)日：2006-01-03

申请号：US10666085

申请日：2003-09-19

Applicant: Thomas E. Dewey

Inventor： Thomas E. Dewey

IPC: H01L23/48

CPC classification number: H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: An interface device having a video BIOS component. The device includes a substrate for implementing a mother board connection and implementing a GPU (graphics processor unit) connection. A video BIOS component is mounted on the substrate for providing video BIOS functions for the computer system.

Abstract translation: 具有视频BIOS组件的接口设备。 该装置包括用于实现母板连接并实现GPU（图形处理器单元）连接的基板。 视频BIOS组件安装在基板上，用于为计算机系统提供视频BIOS功能。

公开(公告)号：US20050264924A1

公开(公告)日：2005-12-01

申请号：US11138395

申请日：2005-05-27

Applicant: Akihiro Kimura ,  Kazuhito Shimomura

Inventor： Akihiro Kimura ,  Kazuhito Shimomura

IPC: G11B25/04 ,  G11B5/012 ,  G11B5/02 ,  G11B17/00 ,  G11B33/00 ,  G11B33/12 ,  H05K1/00 ,  H05K1/11 ,  H05K3/36

CPC classification number: G11B33/122 ,  G11B5/012 ,  G11B25/043 ,  H05K1/0281 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09781 ,  H05K2201/09954 ,  H05K2201/2009

Abstract: A control circuit board is opposed to an outer surface of a case in the form of a rectangular box, and an connector cable, which has connector terminals connectable with an external device, extends from the circuit board. The control circuit board has a plurality of first connector pads with a first property and a plurality of second connector pads with a second property different from the first property, the first and second connector pads being arranged side by side on the control circuit board. The connector cable has a proximal end portion connected to at least one type, among the first and second connector pads, and the connector terminals including a plurality of connector terminals connecting with the at least one type of connector pads to which the proximal end portion is connected.

Abstract translation: 控制电路板与矩形盒形式的外壳的外表面相对，并且具有可与外部装置连接的连接器端子的连接器电缆从电路板延伸。 控制电路板具有多个具有第一特性的第一连接器焊盘和具有与第一特性不同的第二特性的多个第二连接器焊盘，第一和第二连接器焊盘并排布置在控制电路板上。 所述连接器电缆具有连接到所述第一和第二连接器焊盘中的至少一种类型的近端部分，并且所述连接器端子包括多个连接器端子，所述连接器端子与所述至少一种类型的连接器焊盘相连，所述连接器端子的近端部分 连接的。