公开(公告)号：US20180230300A1

公开(公告)日：2018-08-16

申请号：US15952715

申请日：2018-04-13

Applicant: X-Card Holdings, LLC

Inventor： Mark A. Cox

IPC: C08L33/14 ,  C08L75/06 ,  B32B3/08 ,  C08L75/04 ,  G06K19/077 ,  H05K1/18 ,  B32B27/08 ,  B32B37/06 ,  B32B27/20 ,  B32B37/08 ,  B32B37/10 ,  H05K1/03 ,  B32B3/26 ,  C08L27/06 ,  C08L75/14 ,  C08L75/16

CPC classification number: C08L33/14 ,  B32B3/08 ,  B32B3/26 ,  B32B27/08 ,  B32B27/20 ,  B32B37/06 ,  B32B37/08 ,  B32B37/10 ,  B32B2250/40 ,  B32B2264/02 ,  B32B2307/748 ,  B32B2307/75 ,  B32B2425/00 ,  B32B2457/00 ,  B32B2457/08 ,  C08L27/06 ,  C08L75/04 ,  C08L75/06 ,  C08L75/14 ,  C08L75/16 ,  C08L2203/206 ,  G06K19/07722 ,  G06K19/07745 ,  H01L2924/0002 ,  H05K1/0313 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/10037 ,  Y10T29/49126 ,  Y10T428/24612 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31598 ,  Y10T428/31605 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31692 ,  Y10T428/31699 ,  H01L2924/00

Abstract: The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

公开(公告)号：US20180228039A1

公开(公告)日：2018-08-09

申请号：US15872238

申请日：2018-01-16

Applicant: Google LLC

Inventor： David Kyungtag Lim ,  Jason Edward Jordan

IPC: H05K5/00 ,  H04N5/225 ,  H05K7/14 ,  H05K1/14 ,  H05K1/02 ,  H04R3/00 ,  H04R1/02

CPC classification number: H05K5/0086 ,  G06F1/1635 ,  G06F1/184 ,  H04M1/0262 ,  H04M1/0274 ,  H04M1/0277 ,  H04N5/2256 ,  H04N5/2257 ,  H04R1/025 ,  H04R3/00 ,  H04R2499/11 ,  H05K1/028 ,  H05K1/14 ,  H05K1/148 ,  H05K7/1427 ,  H05K2201/04 ,  H05K2201/10037 ,  H05K2201/10189

Abstract: An electronic device is provided. In some embodiments, the electronic device includes an electronic device housing having a major planar face, first and second circuit boards oriented parallel to the major planar face, a third circuit board electrically connected with the first and second circuit boards, and a battery partially surrounded by the first, second, and third circuit boards. At least a portion of the third circuit board is oriented perpendicular to the major planar face between the first and second circuit boards.

公开(公告)号：US09972599B2

公开(公告)日：2018-05-15

申请号：US14558955

申请日：2014-12-03

Applicant: PHOENIX PIONEER TECHNOLOGY CO., LTD.

Inventor： Shih-Ping Hsu ,  Chao-Chung Tseng

IPC: H05K1/18 ,  H01L25/065 ,  H01L23/00 ,  H01L21/683 ,  H01L25/16 ,  H01L25/00 ,  H01L23/538 ,  H05K3/46 ,  H01L23/28 ,  H01L23/29 ,  H05K3/00 ,  H01L23/498 ,  H01L21/48 ,  H05K1/16 ,  H05K3/28 ,  H01L23/50 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/16112 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2924/15153 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/162 ,  H05K1/183 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/284 ,  H05K3/3431 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/10 ,  H05K2201/10007 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10545 ,  Y10T29/49131 ,  H01L2924/014

Abstract: A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming up plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure.

公开(公告)号：US20180103536A1

公开(公告)日：2018-04-12

申请号：US15289426

申请日：2016-10-10

Applicant: Nidec Motor Corporation

Inventor： William Pickering ,  Bruce A. Nielsen

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  H05K1/18 ,  H05K5/00 ,  H01L25/07 ,  H05K1/03 ,  H01M10/42

CPC classification number: H05K1/0206 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/49827 ,  H01L23/49844 ,  H01L25/072 ,  H01M10/425 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K5/0008 ,  H05K5/0026 ,  H05K7/1432 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/10037 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10295

Abstract: An electrical device configuration enables heat to be dissipated from a multi-layer printed circuit board (PCB) while handling electrical currents in excess of 200 amps. The semiconductor devices that convert input DC current to output AC current are mounted to a side of the PCB that is opposite the side of the PCB that receives the input DC current. A base plate that acts as a heat sink includes recessed areas to receive the semiconductor devices and enable the PCB to be positioned close to the base plate. Thermal vias are provided in the PCB to conductive heat from the semiconductor devices to the side of the PCB that receives the input current. Also, the busbars for receiving the input current are positioned to provide short resistive paths to the current to reduce the generation of heat by the current flowing in the PCB.

公开(公告)号：US09910478B2

公开(公告)日：2018-03-06

申请号：US14787848

申请日：2014-05-14

Applicant: NEC Corporation

Inventor： Toshiyuki Isshiki

IPC: H04L29/06 ,  G06F1/32 ,  G06F3/00 ,  H01L23/538 ,  H04L9/30 ,  G06F13/40 ,  H05K1/02 ,  H05K1/14

CPC classification number: G06F1/3212 ,  G06F3/00 ,  G06F13/40 ,  H01L23/5382 ,  H01L2924/0002 ,  H04L9/3093 ,  H04L63/0442 ,  H04L2209/24 ,  H05K1/029 ,  H05K1/142 ,  H05K2201/10037 ,  H05K2201/10212 ,  Y02D10/174 ,  H01L2924/00

Abstract: A collation system includes a first node, a second node and a third node. The first node includes: an encryption unit; a distance calculation unit t; and a collation data generation unit. The second node includes: a key generation unit; and a collation unit. The third node includes: a storage unit; and a collation information generation unit.

公开(公告)号：US09900999B1

公开(公告)日：2018-02-20

申请号：US15424466

申请日：2017-02-03

Applicant: Google Inc.

Inventor： David Kyungtag Lim ,  Jason Edward Jordan

IPC: H05K1/00 ,  H05K5/00 ,  H05K1/14 ,  H05K1/02 ,  H05K7/14 ,  H04R1/02 ,  H04R3/00 ,  H04N5/225

CPC classification number: H05K5/0086 ,  G06F1/1635 ,  G06F1/184 ,  H04M1/0262 ,  H04M1/0274 ,  H04M1/0277 ,  H04N5/2256 ,  H04N5/2257 ,  H04R1/025 ,  H04R3/00 ,  H04R2499/11 ,  H05K1/028 ,  H05K1/14 ,  H05K1/148 ,  H05K7/1427 ,  H05K2201/04 ,  H05K2201/10037 ,  H05K2201/10189

Abstract: An electronic device is provided. In some embodiments, the electronic device includes an electronic device housing having a major planar face, first and second circuit boards oriented parallel to the major planar face, a third circuit board electrically connected with the first and second circuit boards, and a battery partially surrounded by the first, second, and third circuit boards. At least a portion of the third circuit board is oriented perpendicular to the major planar face between the first and second circuit boards.

公开(公告)号：US09877389B2

公开(公告)日：2018-01-23

申请号：US14928410

申请日：2015-10-30

Applicant: LG ELECTRONICS INC.

Inventor： Kyungsu Yoo ,  Bohyoung Lee

IPC: H05K1/11 ,  H04M1/02 ,  H05K3/36 ,  H05K1/18 ,  H01H13/70

CPC classification number: H05K1/11 ,  H01H13/7013 ,  H04M1/0254 ,  H04M1/0274 ,  H04M1/0277 ,  H05K1/118 ,  H05K1/182 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10037 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: Disclosed is a mobile terminal including a terminal body; a first module detachable from a back surface of the terminal body; and a printed circuit board, wherein the back surface of the terminal body includes a first recess to receive the first module, and wherein the first module includes a contact terminal configured to contact the printed circuit board through a connector having one or more electrode regions such that the first module is electrically connected to the printed circuit board when the first module is received in the first recess.

公开(公告)号：US20170256771A1

公开(公告)日：2017-09-07

申请号：US15060381

申请日：2016-03-03

Applicant: Faraday&Future Inc.

Inventor： Kameron Fraige Saad Buckhout ,  William Alan Beverley ,  David Tarlau

IPC: H01M2/20 ,  H01M2/24 ,  H05K1/18 ,  H01M10/48 ,  H01M10/04 ,  H01M2/30 ,  H01M10/42

CPC classification number: H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M10/04 ,  H01M10/4257 ,  H01M10/482 ,  H01M2220/20 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/10037

Abstract: Disclosed herein are battery systems for electric vehicles. An electric vehicle may include a first battery. The first battery may be configured to power various low voltage systems. For example, the first battery may provide the power to start the vehicle. The vehicle may include a second battery. The second battery may be configured to power one or more electric motors for propelling the vehicle. The first battery may supply power necessary to engage and/or access the power stored in the second battery. The first battery may include a flexible circuit configured to electrically connect a plurality of battery cells in series and/or in parallel. The flexible circuit may be configured to contact each cell at a plurality of points to ensure that the cells remain connected during the operation of the vehicle.

公开(公告)号：US09755279B2

公开(公告)日：2017-09-05

申请号：US14595001

申请日：2015-01-12

Applicant: Samsung SDI Co., Ltd.

Inventor： Dae-Yon Moon

IPC: H01M10/052 ,  H01M10/42 ,  H01M2/10 ,  H01M2/34 ,  H01M2/30 ,  H05K3/40

CPC classification number: H01M10/425 ,  H01M2/1061 ,  H01M2/30 ,  H01M2/348 ,  H01M10/4207 ,  H01M2200/10 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09145 ,  H05K2201/10037

Abstract: A battery protection circuit module and battery pack including the same are disclosed. In one aspect, the battery pack includes a first battery cell including a pair of first electrode tabs, a battery protection circuit module, and a frame accommodating the first battery cell and the battery protection circuit module. The battery protection circuit module includes a printed circuit board (PCB) having a first recess formed in a first side thereof and a pair of first tabs that are separated from each other, wherein each of the first tabs at least partially overlaps the first recess. The battery protection circuit module also includes a first temperature protection device having one end thereof electrically connected to one of the first tabs and the other end thereof electrically connected to the other first tab and a pair of first connection units respectively electrically connected to the first electrode tabs.

公开(公告)号：US20170214093A1

公开(公告)日：2017-07-27

申请号：US15328403

申请日：2015-07-21

Applicant: REKRIX CO., LTD.

Inventor： Byung Hoon RYU ,  Jae Kyung KONG

IPC: H01M10/0585 ,  H01M10/0565 ,  H01L23/58 ,  H01M4/36 ,  H01M4/62 ,  H05K1/18 ,  H01M10/04 ,  H01M10/0562

CPC classification number: H01M10/054 ,  H01L23/58 ,  H01M2/0262 ,  H01M2/0277 ,  H01M2/1072 ,  H01M2/1077 ,  H01M2/206 ,  H01M4/133 ,  H01M4/136 ,  H01M4/366 ,  H01M4/58 ,  H01M4/583 ,  H01M4/625 ,  H01M4/661 ,  H01M4/667 ,  H01M4/668 ,  H01M4/74 ,  H01M4/80 ,  H01M4/808 ,  H01M6/40 ,  H01M10/0436 ,  H01M10/056 ,  H01M10/0562 ,  H01M10/0565 ,  H01M10/0585 ,  H01M10/36 ,  H01M10/425 ,  H01M2004/025 ,  H01M2004/029 ,  H01M2220/20 ,  H01M2220/30 ,  H01M2300/0071 ,  H01M2300/0082 ,  H01M2300/0085 ,  H05K1/181 ,  H05K2201/10037

Abstract: A solid silicon secondary battery, by substitutions of silicon for lithium, enables decreasing of preparations cost and minimizing of environmental pollutions. By laminate pressing multiple times a positive or negative electrode material, the present invention enables increasing of the density of a positive or negative electrode active material, thereby increasing current density and capacity. By having mesh plates equipped inside the positive electrode active material and the negative electrode active material, the present invention enables effective moving of electrons. By enabling common use of an electrode, of a silicon secondary battery, connected during a serial connections of the silicon secondary battery, the present invention enables decreasing of the thickness of a silicon secondary battery assembly and increasing of output voltage. By being integrally formed with a PCB or a chip and supplying a power source, the present invention plays the role of a backup power source for instant discharging.