公开(公告)号：US09736938B2

公开(公告)日：2017-08-15

申请号：US15189441

申请日：2016-06-22

Applicant: LG Display Co., Ltd.

Inventor： KyoungSeok Park ,  Chan Park ,  JongChul Lee ,  Heungju Jo

IPC: H05K1/09 ,  G02F1/1333 ,  H05K3/28

CPC classification number: H05K1/092 ,  G02F1/1333 ,  G02F1/133308 ,  G02F1/13338 ,  G02F2001/133334 ,  H05K3/285 ,  H05K2201/0108 ,  H05K2201/0154 ,  H05K2201/10128 ,  H05K2203/085 ,  H05K2203/1131

Abstract: A conductive ink path on a peripheral portion of one surface of a substrate is provided. The conductive ink path comprises a body portion located along an edge of the peripheral portion of the substrate; and at least one extension portion protruded in a direction toward the edge of the substrate, wherein the extension portion includes at least one first segment extended in a first direction and at least two second segments neighboring on the first segment, the first segment includes a connector portion for receiving an electrical signal from the outside, and the first segment is located between the second segments in order to disperse ink in the first segment to the second segments during a manufacturing process.

公开(公告)号：US20170212620A1

公开(公告)日：2017-07-27

申请号：US15483247

申请日：2017-04-10

Applicant: Japan Display Inc.

Inventor： Hayato Kurasawa ,  Keisuke Asada ,  Tatsuya Ide ,  Koji Ishizaki

IPC: G06F3/044 ,  H05K1/02 ,  H05K1/14 ,  G06F3/041

CPC classification number: G06F3/044 ,  G02F1/13338 ,  G06F3/0412 ,  G06F2203/04108 ,  G06F2203/04112 ,  H05K1/028 ,  H05K1/117 ,  H05K1/147 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/10128

Abstract: According to one embodiment, a detection device includes a substrate, detection electrode, terminal formed of a metal material, lead, coating layer, conductive adhesion layer, and circuit board. The lead connects the electrode and the terminal. The coating layer covers the electrode and the lead, and partly covers the terminal. The adhesion layer covers a part of the terminal exposed from the coating layer and covers a part of the coating layer. The circuit board is connected to the terminal with the adhesion layer interposed therebetween. At least in an overlapping area where the adhesion layer covers the coating layer, an area of the metal material per unit area is smaller than that of the other area of the terminal.

公开(公告)号：US09706646B2

公开(公告)日：2017-07-11

申请号：US14761209

申请日：2014-01-15

Applicant: Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

Inventor： Hanqing Jiang ,  Hongyu Yu ,  Goran Konjevod ,  Yong Xu

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H01M2/20 ,  H01M10/04 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/42 ,  H01M6/40 ,  H01M6/42 ,  H01G11/78

CPC classification number: H05K1/028 ,  H01G11/78 ,  H01M2/204 ,  H01M6/40 ,  H01M6/42 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0583 ,  H01M10/0585 ,  H01M10/425 ,  H05K1/0272 ,  H05K1/0278 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/148 ,  H05K1/181 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10113 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2203/085 ,  H05K2203/087 ,  H05K2203/09 ,  H05K2203/1184 ,  H05K2203/302

Abstract: An origami enabled manufacturing system. The system uses origami design principles to create functional materials, structures, devices and/or systems having an adjustable size and/or shape. An operational device can be coupled to a planar substrate shaped and sized to correspond to a desired origami shape of an origami pattern. A plurality of planar substrates can be coupled together by a plurality of connection members that corresponds to one or more crease of the origami pattern. An array of planar substrates can be formed that convert into a three dimensional structure with origami shape. The resulting three-dimensional structure provides smaller projection area, higher portability and deformability.

公开(公告)号：US09703322B2

公开(公告)日：2017-07-11

申请号：US14467065

申请日：2014-08-25

Applicant: HTC Corporation

Inventor： Yi-Pang Lin

IPC: G06F1/16 ,  A44C5/00 ,  A44C5/12 ,  H05K1/18

CPC classification number: G06F1/163 ,  A44C5/0053 ,  A44C5/12 ,  H04M19/047 ,  H05K1/189 ,  H05K2201/10128

Abstract: A wearable device adapted to be worn on a user's wrist is provided. The wearable device includes a first bracket, a second bracket, a shaft structure, and a soft covering material. The shaft structure is connected to the one side of the first bracket, also to the one side of the second bracket for forming a wristband. The other side of the first bracket and the other side of the second bracket are configured to be departed from each other, and the first bracket and the second bracket are pivoted with each other through the shaft structure. Furthermore, the first bracket, the second bracket, and the shaft structure are covered by the soft covering material.

公开(公告)号：US09698308B2

公开(公告)日：2017-07-04

申请号：US14743919

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L33/38 ,  G09G3/32 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H05B33/08 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  H01L33/20 ,  H01L33/40 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13

CPC classification number: H01L33/385 ,  F21K9/50 ,  F21V9/08 ,  F21Y2101/025 ,  F21Y2105/003 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/405 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05B33/089 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US09690439B2

公开(公告)日：2017-06-27

申请号：US14431331

申请日：2013-05-17

Applicant: Sharp Kabushiki Kaisha

Inventor： Kazutoshi Kida ,  Shogo Hayashi

IPC: G06F3/047 ,  G06F3/041 ,  G06F3/044 ,  G09G5/00

CPC classification number: G06F3/047 ,  G06F3/0418 ,  G06F3/044 ,  G09G5/003 ,  G09G2300/0426 ,  H05K2201/052 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: An arrangement is provided that uses the differential approach to effectively remove noise contained in a signal in a line even in a touch panel that includes some lines that are separated from each other at a larger distance. The touch panel (2) includes: a touch panel substrate (22), a plurality of Y-direction electrodes (23) provided on the touch panel substrate (22); a plurality of lines (24, 34) electrically connected with the Y-direction electrodes (23); and a floating electrode (61) located within a predetermined distance from at least one of the lines (24, 34) and another line adjacent the at least one line such that noise produced in the at least one line can be propagated to reach the other line.

公开(公告)号：US20170177105A1

公开(公告)日：2017-06-22

申请号：US15129907

申请日：2015-07-10

Applicant: BOE Technology Group Co.. Ltd. ,  Hefei Xinsheng Optoelectronics Technology Co., Ltd

Inventor： Lingyan Wu ,  Lei Zhang ,  Taofeng Xie ,  Yang Liu

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/11 ,  H05K3/10 ,  H05K3/32

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/111 ,  H05K3/10 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/03 ,  H05K2201/10128

Abstract: A bezel structure of a touch screen is disclosed by the invention, including: a BM portion provided at an end on a back surface of the substrate; a bonding area arranged on the BM portion and provided with a plurality of metal leads and a plurality of transparent conductive solder pads, each of the plurality of transparent conductive solder pads being electrically connected with corresponding one metal lead of the plurality of metal leads; a first insulating photoresist layer arranged between the plurality of transparent conductive solder pads and the plurality of metal leads in a thickness direction of the substrate, the transparent conductive solder pads being electrically connected with corresponding metal leads via jumper holes provided in the first insulating photoresist layer; and a plurality of transparent conductive edge-routing wires arranged on the back surface of the substrate, at both lateral sides thereof, each of the plurality of transparent conductive edge-routing wires extending to the bonding area and being constructed at a terminal end thereof as corresponding one of the plurality of transparent conductive solder pads located within the bonding area. A touch screen having the bezel structure, a display device having the touch screen, and a method for manufacturing the bezel structure of the touch screen are also disclosed by the invention. Transparent conductive material is formed as edge-routing wires so as to realize a bezel-free technology, providing an improved user experience.

公开(公告)号：US09681555B2

公开(公告)日：2017-06-13

申请号：US14192401

申请日：2014-02-27

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kuang-Jung Chen

IPC: H05K5/06 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K3/284 ,  H05K1/189 ,  H05K2201/10128 ,  H05K2201/10136 ,  Y10T29/49126

Abstract: A package of an environmentally sensitive electronic device and a fabricating method thereof are provided, wherein the package may include a first substrate, a second substrate, the environmentally sensitive electronic device, a packaging body, and a filler. In one or more embodiments, the environmentally sensitive electronic device may be disposed on the first substrate and located between the first substrate and the second substrate. The filler is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device. The packaging body is sandwiched between the first substrate and the second substrate and encloses the environmentally sensitive electronic device and the filler. A material for the packaging body may include a bonding of transition metal and metalloid.

公开(公告)号：US20170142837A1

公开(公告)日：2017-05-18

申请号：US15230374

申请日：2016-08-06

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jihoon Kim ,  Yongmin Kim

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/02 ,  H05K7/20 ,  H01L51/52

CPC classification number: H05K1/181 ,  G06F1/16 ,  H01L27/32 ,  H01L51/5237 ,  H01L51/529 ,  H04M1/02 ,  H04M1/0266 ,  H04M1/0277 ,  H04M1/185 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K7/20963 ,  H05K2201/0323 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1316

Abstract: A display device includes a display panel, a printed circuit board under the display panel and having one surface on which a driving chip is mounted, a first reinforcing member between the display panel and the printed circuit board, and a second reinforcing member under the printed circuit board, configured to face the printed circuit board having the driving chip therebetween, the second reinforcing member having a recessed groove in one surface facing the driving chip and the driving chip being in the recessed groove.

公开(公告)号：US20170141091A1

公开(公告)日：2017-05-18

申请号：US15417015

申请日：2017-01-26

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: H01L25/16 ,  H01L31/0216 ,  G06F1/16 ,  H01L23/538 ,  H01L33/62 ,  H01L33/44 ,  H01L31/16 ,  H01L25/075

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.