公开(公告)号：US05998239A

公开(公告)日：1999-12-07

申请号：US162003

申请日：1998-09-28

Applicant: Hisao Tomizawa

Inventor： Hisao Tomizawa

IPC: H01L23/367 ,  H01L29/06 ,  H05K1/02 ,  H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/31 ,  H01L23/367 ,  H05K3/341 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/48 ,  H01L29/0657 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/10158 ,  H05K1/0203 ,  H05K2201/0373 ,  H05K2201/066 ,  H05K2201/10568 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/613

Abstract: A method of manufacturing a semiconductor device with a mount 2 secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with an electrode 4 on the circuit board 1 to form at least a dent 14. The mount 2 also has an inclined surface 8 formed at the periphery which faces the electrode 4. Solder 9 is filled in the dent 14 between the legs 7, 12 and in the flaring area 13 between the circuit board 1 and the inclined surface 8 of the mount 2 to prevent exfoliation or detachment of the mount from the electrode 4.

Abstract translation: 一种制造半导体器件的方法，其具有固定在电路板1上以将二极管芯片3支撑在其上的安装件2。 形成在安装件2上的多个支脚7,12与电路板1上的电极4接触以形成至少凹陷14.支架2还具有形成在周边的与电极4相对的倾斜表面8 焊料9填充在支腿7,12之间的凹陷14和电路板1与安装件2的倾斜表面8之间的扩口区域13中，以防止支架从电极4剥离或脱离。

公开(公告)号：US5986337A

公开(公告)日：1999-11-16

申请号：US138562

申请日：1998-08-24

Applicant: Shinichi Takagi ,  Akinobu Suzuki

Inventor： Shinichi Takagi ,  Akinobu Suzuki

IPC: G02B6/42 ,  H01L23/02 ,  H01L23/04 ,  H01L23/495 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48

CPC classification number: H05K3/3447 ,  H01L23/49562 ,  H05K3/3426 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K3/303 ,  H05K3/306 ,  Y02P70/613

Abstract: A semiconductor element module includes a package, a semiconductor element arranged on the package, and a plurality of leads provided on sides of the package so that an opening end of each the lead is oriented to the side of a package attaching plane, and serving to connect the semiconductor element to an external circuit; wherein a level differences is provided on the side of the package attaching plane of each of package sides so that a space is formed from each the plurality of leads.

Abstract translation: 半导体元件模块包括封装，布置在封装上的半导体元件和设置在封装侧面的多个引线，使得每个引线的开口端定向到封装附接平面的侧面，并且用于 将半导体元件连接到外部电路; 其中，在每个封装侧的封装安装平面的一侧设置有电平差，使得从多个引线中的每一个形成空间。

公开(公告)号：US5975920A

公开(公告)日：1999-11-02

申请号：US648667

申请日：1996-05-16

Applicant: Reinhard Oberstarr

Inventor： Reinhard Oberstarr

IPC: H01C1/14 ,  H01R4/02 ,  H01R12/55 ,  H01R12/57 ,  H05K3/34 ,  H01R9/09

CPC classification number: H05K3/3421 ,  H01R12/57 ,  H01R12/714 ,  H05K2201/10189 ,  H05K2201/10568 ,  Y02P70/613 ,  Y10S439/91

Abstract: An electronic component for mounting on a PCB by a reflow soldering method has a conductor element mounted on an insulating component body, the conductor element having a contact region exposed on the exterior of the component body to connect the component to the PCB. In order to increase the numerical mounting density of such electronic components on the PCB a window is provided in the body of the component, which allows IR radiation to pass through the component body to the contact region of the conductor element.

Abstract translation: 用于通过回流焊接方式安装在PCB上的电子部件具有安装在绝缘部件主体上的导体元件，该导体元件具有暴露在部件主体的外部的接触区域，以将部件连接至PCB。 为了增加PCB上这种电子部件的数值安装密度，在部件的主体中设置一个窗口，这允许IR辐射通过部件主体到导体元件的接触区域。

公开(公告)号：US5967854A

公开(公告)日：1999-10-19

申请号：US902833

申请日：1997-07-30

Applicant: Peter Craig

Inventor： Peter Craig

IPC: H01R12/77 ,  H01R23/02

CPC classification number: H05K3/326 ,  H01R12/778 ,  H01R24/62 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/10189 ,  H05K2201/10393 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2203/167 ,  H05K3/0058

Abstract: An arrangement for connecting a printed circuit to a plug of the type having a plurality of parallel contacts located on the edge of an insertion block provided with a resilient detent, includes a housing containing the printed circuit, and an opening in the housing for retaining the insertion block therein. A flexible extension of the printed circuit has parallel contacts formed thereon. The flexible extension extends at an angle through the opening so that the parallel contacts thereon make contact with the parallel contacts on an insertion block retained in the opening.

Abstract translation: 用于将印刷电路连接到具有设置有弹性制动器的插入块的边缘上的多个平行触点的类型的插头的装置包括容纳印刷电路的壳体和用于保持 插入块。 印刷电路的柔性延伸部具有形成在其上的平行触点。 柔性延伸部以一定角度延伸通过开口，使得其上的平行接触件与保持在开口中的插入块上的平行触头接触。

公开(公告)号：US5923538A

公开(公告)日：1999-07-13

申请号：US646037

申请日：1996-05-07

Applicant: Emily Hawthorne

Inventor： Emily Hawthorne

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/495 ,  H05K1/02 ,  H01R5/09 ,  H05K7/02

CPC classification number: H01L23/3675 ,  H01L23/16 ,  H01L23/32 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/50 ,  H01L2924/14 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  Y10T29/49121 ,  Y10T29/4913

Abstract: A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and interconnected with inner leads of the leadframe. The TAB package is adhered to a support member having spacers that abut against the surface of a printed circuit board (PCB) on which the package is to be mounted and provide a predetermined spacing between the leadframe and the surface. Outer leads that protrude from the leadframe are bent into a shape so as extend, in their free state, toward the surface at least as far as the spacers. The package and support member assembly is placed on the PCB surface, and the combination of the weight of the assembly, the resilience of the leads and the preset standoff height enable the leads to resiliently deform so that the spacers abut against the surface and the leads conformably engage with the surface for soldering or other ohmic connection to conjugate bonding pads on the surface. The support member can be formed with lead retainers around which the leads extend to form loops that resiliently and conformably engage with the surface as the assembly is lowered thereon. The support member maintains coplanarity, adds weight to the package, pre-sets the standoff to protect the formed outer leads during surface mounting and enables the package to be shipped without a separate carrier.

Abstract translation: 胶带自动键合（TAB）封装包括支撑金属引线框架的弹性聚酰亚胺层。 微电子电路管芯安装在聚酰亚胺层的孔中并与引线框的内引线相互连接。 TAB封装被粘附到具有间隔件的支撑构件上，所述间隔件抵靠在其上将要安装封装件的印刷电路板（PCB）的表面，并且在引线框架和表面之间提供预定间隔。 从引线框突出的外引线弯曲成一种形状，以便在其自由状态下至少与间隔物一样延伸。 封装和支撑构件组件放置在PCB表面上，并且组件的重量，引线的弹性和预设的间隔高度的组合使得引线能够弹性变形，使得间隔件抵靠表面和引线 顺应地与表面接合以进行焊接或其他欧姆连接以在表面上共轭接合焊盘。 支撑构件可以形成有引线保持器，引线延伸到所述引线保持器，当所述组件降低时，所述引线延伸以形成与所述表面弹性和顺应地接合的环。 支撑构件保持共面性，增加了包装的重量，预先设定了间隔，以在表面安装期间保护形成的外引线，并使得包装在没有单独载体的情况下运输。

公开(公告)号：US5872333A

公开(公告)日：1999-02-16

申请号：US789129

申请日：1997-01-28

Applicant: Kouichi Uezono ,  Yasuhito Suzuki

Inventor： Kouichi Uezono ,  Yasuhito Suzuki

IPC: H01R9/24 ,  H05K3/30 ,  H05K5/00 ,  H01H9/02

CPC classification number: H05K5/0069 ,  H01R12/58 ,  H01R9/2491 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/10189 ,  H05K2201/10568

Abstract: In a connector fixing construction, connectors are mounted on a printed circuit board, and wall portions, covering peripheral surfaces of the connectors, respectively, are formed on a cover covering the printed circuit board. Therefore, even if a lateral external force acts on the connector when a mating connector is inserted into and removed from the connector, the connector is prevented from being moved laterally, thereby certainly preventing damage, such as a crack, to solder portions by which terminals of the connector are connected to a circuit pattern.

Abstract translation: 在连接器固定结构中，连接器安装在印刷电路板上，分别覆盖连接器的周边表面的壁部分形成在覆盖印刷电路板的盖上。 因此，即使当配合连接器插入连接器并从连接器移除时侧向外力作用在连接器上时，也可以防止连接器横向移动，从而可以防止诸如裂纹等的焊接部件的端子 的连接器连接到电路图案。

公开(公告)号：US5861669A

公开(公告)日：1999-01-19

申请号：US488673

申请日：1995-06-07

Applicant: Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

Inventor： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

IPC: H01L23/482 ,  H01L23/495 ,  H01L23/58 ,  H05K3/30 ,  H05K3/34 ,  H01L29/41

CPC classification number: H05K3/303 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

Abstract: A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Abstract translation: 具有单列直插式封装的半导体器件包括：半导体芯片;封装体，其容纳半导体芯片并由一对相对的主表面限定;多个互连引线，其由所述封装主体保持，以基本上延伸 垂直于底面。 每个互连引线由位于封装主体内部的内引线部分和位于封装主体外部的外引线部分组成，外引线部分在内部与外部之间的边界处侧向弯曲，在第一 以及彼此相对并且基本上垂直于包装主体的相对主表面的第二方向。 多个支撑腿在包装体的底表面处横向延伸，用于当将半导体器件放置在基底上时支撑包装体直立。

公开(公告)号：US5855732A

公开(公告)日：1999-01-05

申请号：US560632

申请日：1995-11-20

Applicant: Yuichi Yoshida

Inventor： Yuichi Yoshida

IPC: H01L21/60 ,  H01L21/00 ,  H01L21/607 ,  H05K3/30 ,  H05K3/34 ,  H05K3/32

CPC classification number: H01L21/67144 ,  H01L24/80 ,  H05K3/303 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2203/0195 ,  H05K2203/082 ,  H05K2203/104 ,  H05K2203/167 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T156/1702 ,  Y10T156/1705 ,  Y10T29/53183

Abstract: The invention provides an outer lead bonding apparatus for bonding a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, the apparatus including (a) a bonding-aid member having a central portion and a marginal portion, the semiconductor chip being to be adhered to a lower surface of the central portion of the bonding-aid member, the bonding-aid member being to be adhered at the marginal portion thereof to the substrate, the bonding-aid member being formed with an opening for exposing distal ends of the leads at which the leads are to be bonded to the bonding pads, (b) a device for ascertaining whether the leads align with the bonding pads, and (c) a bonding tool having compressing portions for compressing the leads to the bonding pads, the compressing portions having a cross-section to be able to pass through the opening of the bonding-aid member. The invention makes it possible to avoid misalignment of the leads of a semiconductor chip to the bonding pads by simpler arrangement than prior apparatuses.

Abstract translation: 本发明提供一种用于将从半导体芯片向外延伸的多个引线接合到安装在基板上的接合焊盘的外部引线接合装置，该装置包括（a）具有中心部分和边缘部分的接合辅助部件，半导体 要粘附到接合辅助构件的中心部分的下表面上的粘合助剂构件将在其边缘部分附着到基底上，该粘合剂构件形成有用于暴露的开口 引线的末端要接合到接合焊盘，（b）用于确定引线是否与接合焊盘对准的装置，以及（c）具有用于将引线压缩到 接合焊盘，压缩部分具有能够通过接合辅助构件的开口的横截面。 本发明通过比现有技术的设备更简单的布置，可以避免半导体芯片的引线与焊盘的对准。

公开(公告)号：US5673479A

公开(公告)日：1997-10-07

申请号：US323817

申请日：1994-10-17

Applicant: Emily Hawthorne

Inventor： Emily Hawthorne

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/40 ,  H01L23/495 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K3/30 ,  H05K7/10 ,  H05K3/34

CPC classification number: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/49572 ,  H01L25/105 ,  H01L25/117 ,  H05K3/303 ,  H05K7/1061 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/49171 ,  H01L2225/1029 ,  H01L2225/1094 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/14 ,  H01L2924/1532 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10681 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and interconnected with inner leads of the leadframe. The TAB package is adhered to a support member having spacers that abut against the surface of a printed circuit board (PCB) on which the package is to be mounted and provide a predetermined spacing between the leadframe and the surface. Outer leads that protrude from the leadframe are bent into a shape so as extend, in their free state, toward the surface at least as far as the spacers. The package and support member assembly is placed on the PCB surface, and the combination of the weight of the assembly, the resilience of the leads and the preset standoff height enable the leads to resiliently deform so that the spacers abut against the surface and the leads conformably engage with the surface for soldering or other ohmic connection to conjugate bonding pads on the surface. The support member can be formed with lead retainers around which the leads extend to form loops that resiliently and conformably engage with the surface as the assembly is lowered thereon. The support member maintains coplanarity, adds weight to the package, pre-sets the standoff to protect the formed outer leads during surface mounting and enables the package to be shipped without a separate carrier.

Abstract translation: 胶带自动键合（TAB）封装包括支撑金属引线框架的弹性聚酰亚胺层。 微电子电路管芯安装在聚酰亚胺层的孔中并与引线框的内引线相互连接。 TAB封装被粘附到具有间隔件的支撑构件上，所述间隔件抵靠在其上将要安装封装件的印刷电路板（PCB）的表面，并且在引线框架和表面之间提供预定间隔。 从引线框突出的外引线弯曲成一种形状，以便在其自由状态下至少与间隔物一样延伸。 封装和支撑构件组件放置在PCB表面上，并且组件的重量，引线的弹性和预设的间隔高度的组合使得引线能够弹性变形，使得间隔件抵靠表面和引线 顺应地与表面接合以进行焊接或其他欧姆连接以在表面上共轭接合焊盘。 支撑构件可以形成有引线保持器，引线延伸到所述引线保持器，当所述组件降低时，所述引线延伸以形成与所述表面弹性和顺应地接合的环。 支撑构件保持共面性，增加了包装的重量，预先设定了间隔，以在表面安装期间保护形成的外引线，并使得包装在没有单独载体的情况下运输。

公开(公告)号：US5672542A

公开(公告)日：1997-09-30

申请号：US618226

申请日：1996-03-19

Applicant: Matthew K. Schwiebert ,  Donald T. Campbell ,  Matthew Heydinger ,  Robert E. Kraft ,  Hubert A. Vander Plas

Inventor： Matthew K. Schwiebert ,  Donald T. Campbell ,  Matthew Heydinger ,  Robert E. Kraft ,  Hubert A. Vander Plas

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/12 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L24/17 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/28 ,  H05K3/3436 ,  H05K3/3484 ,  H01L2224/11005 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/81193 ,  H01L2224/83102 ,  H01L2224/83136 ,  H01L2224/92125 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K3/1216 ,  H05K3/3463 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Abstract translation: 将焊料凸块模版到基板上，在低于400微米的间距处提供凸起的基板。 通过模板/掩模和糊剂法施加焊料; 然而，掩模在回流期间保持附着于基底。 也可以通过本发明获得大于400微米的间距。 本发明进一步提供均匀的可控体积金属球的产生。