公开(公告)号：US20130249089A1

公开(公告)日：2013-09-26

申请号：US13893623

申请日：2013-05-14

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Cheng-Hung Shih ,  Yung-Wei Hsieh ,  Shu-Chen Lin ,  Cheng-Fan Lin ,  Hua-An Dai

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/05666 ,  H01L2224/11472 ,  H01L2224/11906 ,  H01L2224/13007 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2224/05552

Abstract: A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion.

Abstract translation: 制造细间距凸块的方法包括以下步骤：提供硅衬底; 在所述硅衬底上形成含钛金属层，其中所述含钛金属层包括多个第一区和多个第二区; 在含钛金属层上形成光致抗蚀剂层; 图案化光致抗蚀剂层以形成多个开口槽; 在开口槽处形成多个铜凸块，其中每个铜凸块包括第一顶表面和环表面; 加热光致抗蚀剂层以形成多个主体部分和多个可移除部分; 蚀刻光致抗蚀剂层; 以及移除所述第二区域以使得所述第一区域中的每一个能够形成具有轴承部分和延伸部分的凸起下金属层。

公开(公告)号：US20130065388A1

公开(公告)日：2013-03-14

申请号：US13644882

申请日：2012-10-04

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chin-Tang Hsieh

IPC: H01L21/60

CPC classification number: H01L24/14 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05562 ,  H01L2224/11618 ,  H01L2224/1182 ,  H01L2224/13013 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13027 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/13541 ,  H01L2224/13551 ,  H01L2224/13562 ,  H01L2224/13566 ,  H01L2224/136 ,  H01L2224/1411 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/11 ,  H05K3/4007 ,  H05K2201/0367 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A substrate structure with compliant bump comprises a substrate, a plurality of bumps, and a metallic layer, wherein the substrate comprises a surface, a trace layer, and a protective layer. The trace layer comprises a plurality of conductive pads, and each of the conductive pads comprises an upper surface. The protective layer comprises a plurality of openings. The bumps are formed on the surface, and each of the bumps comprises a top surface, an inner surface and an outer surface and defines a first body and a second body. The first body is located on the surface. The second body is located on top of the first body. The metallic layer is formed on the top surface, the inner surface, and the upper surface.

Abstract translation: 具有柔顺凸块的衬底结构包括衬底，多个凸块和金属层，其中衬底包括表面，迹线层和保护层。 迹线层包括多个导电焊盘，并且每个导电焊盘包括上表面。 保护层包括多个开口。 凸起形成在表面上，并且每个凸起包括顶表面，内表面和外表面，并且限定第一主体和第二主体。 第一个身体位于表面。 第二个身体位于第一个身体的顶部。 金属层形成在顶表面，内表面和上表面上。

公开(公告)号：US20130027172A1

公开(公告)日：2013-01-31

申请号：US13644964

申请日：2012-10-04

Applicant: Chipbond Technology Corporation

Inventor： Chih-Ming Kuo ,  You-Ming Hsu

IPC: H01F5/00

CPC classification number: H01F5/00 ,  H01F5/003 ,  H05K1/165 ,  H05K3/465 ,  H05K2201/097 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49155

Abstract: A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots.

Abstract translation: 一种制造具有三维电感器的载体的方法包括以下步骤：提供具有保护层的衬底; 在保护层上形成第一光致抗蚀剂层; 图案化第一光致抗蚀剂层以形成第二开口和多个布置槽; 在第二开口中形成第一金属层并设置槽; 去除第一光致抗蚀剂层; 在所述保护层上形成第一介电层; 在所述第一介电层上形成第二光致抗蚀剂层; 图案化第二光致抗蚀剂层以形成多个槽; 在槽中形成第二金属层以形成多个感应部分; 去除所述第二光致抗蚀剂层; 在所述第一电介质层上形成第二电介质层; 在所述第二介电层上形成第三光致抗蚀剂层; 图案化第三光致抗蚀剂层以形成多个狭缝; 以及在槽中形成第三金属层。

公开(公告)号：US20030203209A1

公开(公告)日：2003-10-30

申请号：US10442129

申请日：2003-05-21

Applicant: Chipbond Technology Corporation

Inventor： Lu-Chen Hwan ,  Dang-Cheng Yiu

IPC: B32B001/00

CPC classification number: H01L21/78 ,  B23K26/3576 ,  Y10S438/964 ,  Y10S438/974 ,  Y10T428/31

Abstract: A laser sintering system is provided for sintering a die having a serrate edge. The laser sintering system comprises a laser generator for generating a laser beam and a movable carriage for carrying said die. The laser beam sinters the serrate edge of said die into a smooth edge. A method of sintering a die, the die having a serrate edge, comprises the following steps of providing a die and using a laser beam sintering the serrate edge of said die into a smooth edge. A die has a smooth edge sintered by a laser beam.

公开(公告)号：US20020180064A1

公开(公告)日：2002-12-05

申请号：US10107219

申请日：2002-03-28

Applicant: Chipbond Technology Corporation

Inventor： Lu-Chen Hwan ,  Fei-Jain Wu

IPC: H01L023/495

CPC classification number: H01L24/10 ,  H01L23/29 ,  H01L23/4334 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171

Abstract: The present invention relates to a wafer level package structure with a metal protection layer, and more particularly, to a wafer level package structure with a metal protection layer which is made of titanium, nickel, chromium or alloy thereof. The metal protection layer is adopted to prevent the substrate from being damaged by metal solder bumps. The metal protection layer also contributes to heat conduction and heat dissipation. Moreover, the metal protection layer is acid and alkali resistant and electromagnetic interference (EMI) resistant. The present invention improves the reliability of the IC component effectively.

Abstract translation: 本发明涉及具有金属保护层的晶片级封装结构，更具体地，涉及一种具有由钛，镍，铬或其合金制成的金属保护层的晶片级封装结构。 采用金属保护层，防止金属焊料凸起损坏基板。 金属保护层也有助于热传导和散热。 此外，金属保护层耐酸碱，抗电磁干扰（EMI）。 本发明有效地提高了IC部件的可靠性。