公开(公告)号：US07505283B2

公开(公告)日：2009-03-17

申请号：US11864065

申请日：2007-09-28

Applicant: Fumikazu Naimi ,  Masami Takase ,  Akihisa Watanabe

Inventor： Fumikazu Naimi ,  Masami Takase ,  Akihisa Watanabe

IPC: H05K1/18

CPC classification number: H05K7/026 ,  H05K1/056 ,  H05K1/144 ,  H05K3/0064 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10598 ,  H05K2201/2036

Abstract: The metal-core-board reinforcing structure has a metal core board having a metal core and a resin plate having substantially the same extent as that of the metal core board and being fixedly attached to the metal core board substantially parallel to one side of the metal core board and spaced apart therefrom by a predetermined distance.

Abstract translation: 金属芯板加强结构具有金属芯板，该金属芯板具有与金属芯板大致相同程度的金属芯和树脂板，并且与金属芯板基本上平行于金属的一侧固定 并且与其隔开预定距离。

公开(公告)号：US20080275326A1

公开(公告)日：2008-11-06

申请号：US11742998

申请日：2007-05-01

Applicant: Joachim Kasielke ,  Ulrich Haueter ,  Ulrike Kamecke ,  Christian Hof ,  Matthew Reynolds ,  Timon Kasielke ,  Steven Gray ,  Harvey B. Buck ,  Michael Loukine ,  Fritz Hindelang

Inventor： Joachim Kasielke ,  Ulrich Haueter ,  Ulrike Kamecke ,  Christian Hof ,  Matthew Reynolds ,  Timon Kasielke ,  Steven Gray ,  Harvey B. Buck ,  Michael Loukine ,  Fritz Hindelang

IPC: A61B5/00

CPC classification number: A61B5/04 ,  A61B5/0002 ,  A61B5/05 ,  A61B5/1473 ,  A61B5/14865 ,  A61B5/6846 ,  A61B5/7405 ,  A61B5/742 ,  A61B5/7455 ,  A61B5/746 ,  H05K1/028 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/042 ,  H05K2201/10098 ,  H05K2201/10151

Abstract: A sensor may include a substrate having a sensing portion defining a sensor thereon and a circuit mounting portion defining at least one electrically conductive pad that is electrically connected to the sensor. The sensor may be configured to produce a signal indicative of a condition of the patient. An anisotropic medium may be disposed on the circuit mounting portion and may be electrically conductive in a direction through the medium and electrically insulating in directions along the medium. An electrical circuit may be mechanically mounted to the circuit mounting portion of the first substrate via the anisotropic medium with at least one electrically conductive terminal juxtaposed over the at least one electrically conductive pad. The anisotropic medium may establish local electrical contact between the at least one electrically conductive terminal and the at least one electrically conductive pad.

Abstract translation: 传感器可以包括具有在其上限定传感器的感测部分的基板和限定电连接到传感器的至少一个导电焊盘的电路安装部分。 传感器可以被配置为产生指示患者状况的信号。 各向异性介质可以设置在电路安装部分上，并且可以在通过介质的方向上导电并且沿着介质的方向电绝缘。 电路可以经由各向异性介质机械地安装到第一基板的电路安装部分，其中至少一个导电端子并置在至少一个导电焊盘上。 各向异性介质可以在至少一个导电端子和至少一个导电焊盘之间建立局部电接触。

公开(公告)号：US07432702B2

公开(公告)日：2008-10-07

申请号：US11321297

申请日：2005-12-22

Applicant: Sam Shiao ,  Robert P. Chen

Inventor： Sam Shiao ,  Robert P. Chen

IPC: G01R31/28

CPC classification number: H05K1/144 ,  H05K1/0271 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2045

Abstract: A circuit board damping assembly provides a damping node for a circuit board coupled in spaced relationship to another circuit board or chassis. The circuit board damping assembly includes a chassis or circuit board forming a base member; a circuit board coupled in spaced relationship to the base member; a first attachment member coupled to the base member; a second attachment member coupled to the circuit board; and a connector coupled between the first and second attachment members. The connector may be a wire coupled to the first and second attachment members.

Abstract translation: 电路板阻尼组件为与另一个电路板或底盘隔开关联的电路板提供阻尼节点。 电路板阻尼组件包括形成基座构件的底座或电路板; 电路板，其与所述基座部件间隔开地联接; 耦合到所述基座构件的第一附接构件; 耦合到所述电路板的第二附接构件; 以及连接在所述第一和第二附接构件之间的连接器。 连接器可以是联接到第一和第二附接构件的线。

公开(公告)号：US20080123312A1

公开(公告)日：2008-05-29

申请号：US11564675

申请日：2006-11-29

Applicant: Sun-Wen Cyrus Cheng ,  Carl Milton Wildrick ,  Jeffrey John Boylan

Inventor： Sun-Wen Cyrus Cheng ,  Carl Milton Wildrick ,  Jeffrey John Boylan

IPC: H01R12/16

CPC classification number: H05K7/1092 ,  H02M3/00 ,  H05K1/144 ,  H05K1/182 ,  H05K2201/042 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10318

Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.

Abstract translation: 本发明提供一种DC-DC电力转换器，其包括彼此并联并且不封装的两个或更多个印刷布线板（PWB）。 电子元件可以安装在每个电路板的两侧。 PWB的开放设计和平行方向允许安装在PWB上的组件的气流。 PWB优选由具有铜箔的FR-4制成，一个较厚的板由更多的铜层组成，其它板由较少的铜层组成。 在优选实施例中，功率处理元件容纳在较厚的PWB中，而较薄的板容纳控制电路。

公开(公告)号：US20080105963A1

公开(公告)日：2008-05-08

申请号：US11881743

申请日：2007-07-27

Applicant: William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

Inventor： William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

IPC: H01L23/02

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/162 ,  H01L2224/16 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10265 ,  H05K2201/2036

Abstract: A stackable chip assembly is disclosed, as are many different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend towards the other substrate and vice versa. The components of each substrate preferably extend between each other. In addition various connections between the substrates are disclosed, as well as methods of constructing such chip assemblies.

Abstract translation: 公开了可堆叠的芯片组件，与其相关的许多不同的实施例也是公开的。 芯片组件优选地包括至少两个具有安装在其上的部件的基板。 衬底优选地相对于彼此定位，使得一个衬底上的部件朝向另一个衬底延伸，反之亦然。 每个基板的部件优选彼此延伸。 此外，公开了基板之间的各种连接以及构造这种芯片组件的方法。

公开(公告)号：US20080100751A1

公开(公告)日：2008-05-01

申请号：US11857254

申请日：2007-09-18

Applicant: Yoshiaki NAKANO

Inventor： Yoshiaki NAKANO

IPC: H04N5/50

CPC classification number: H05K1/144 ,  H05K1/0237 ,  H05K1/0298 ,  H05K3/3436 ,  H05K2201/042 ,  H05K2201/096

Abstract: A reception apparatus (3) which can realize a compact size thereof includes: a tuner circuit portion (5); a digital demodulating portion (6) that converts a signal from the tuner circuit portion into a digital signal; and a digital circuit portion (7) that converts a digital signal from the digital demodulating portion into a digital video signal and digital audio signal, and the reception apparatus is characterized by that a first sub circuit board (30) on which the digital demodulating portion is mounted and a second sub circuit board (40) on which the tuner circuit portion is mounted are stacked on a main circuit board (20) on which the digital circuit portion is mounted, in this order, via solder balls (50, 60), so that the main circuit board, the first sub circuit board, and the second sub circuit board are connected to each other via the solder balls.

Abstract translation: 可实现其小型化的接收装置（3）包括：调谐器电路部分（5）; 数字解调部分（6），其将来自调谐器电路部分的信号转换成数字信号; 以及数字电路部分（7），其将来自数字解调部分的数字信号转换为数字视频信号和数字音频信号，并且接收装置的特征在于：第一子电路板（30），数字解调部分 并且其上安装有调谐器电路部分的第二子电路板（40）依次通过焊球（50,60）堆叠在其上安装数字电路部分的主电路板（20）上， 使得主电路板，第一子电路板和第二子电路板通过焊球相互连接。

公开(公告)号：US07322833B1

公开(公告)日：2008-01-29

申请号：US11554729

申请日：2006-10-31

Applicant: Martin Hakansson ,  Tommy Stening

Inventor： Martin Hakansson ,  Tommy Stening

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K1/147 ,  H01Q1/38 ,  H01R12/62 ,  H05K1/16 ,  H05K3/0058 ,  H05K3/365 ,  H05K2201/042 ,  H05K2201/2009 ,  Y10S439/916

Abstract: A flexible printed circuit (FPC) onto which an antenna has been formed is electrically connected to a printed circuit board (PCB) by sandwiching the FPC between the PCB and a resilient biasing member that is held in position relative to the PCB by a frame or retaining member. The biasing member may be a soft, flexible material that operates across a broad temperature range.

Abstract translation: 在其上形成有天线的柔性印刷电路（FPC）通过将FPC夹在PCB和弹性偏置构件之间而将其电连接到印刷电路板（PCB），弹性偏置构件通过框架相对于PCB保持在适当位置， 保持构件。 偏置构件可以是在宽的温度范围内工作的柔软的柔性材料。

公开(公告)号：US20070290305A1

公开(公告)日：2007-12-20

申请号：US11762276

申请日：2007-06-13

Applicant: Kazuhiro Oyama ,  Mutsuhiro Mori ,  Katsuaki Saito ,  Yoshihiko Koike

Inventor： Kazuhiro Oyama ,  Mutsuhiro Mori ,  Katsuaki Saito ,  Yoshihiko Koike

IPC: H01L23/02

CPC classification number: H05K1/144 ,  H01L23/24 ,  H01L25/072 ,  H01L25/16 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/147 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/10287 ,  H05K2201/10318 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress may be escaped. On the other hand, the wires on which a high voltage is applied are patterned on respective printed boards. This serves to prevent discharge through the surface of the same printed board served as current passage. This design makes it possible to hermetically close the power module, prevent intrusion of moisture or contamination as well as displacement, transformation and crack of the cover plate.

Abstract translation: 设置弹性印刷电路板，使得由硅胶施加的应力被印刷板吸收。 此外，印刷板形成为如此狭窄，使得应力可能逸出。 另一方面，施加了高电压的电线在各自的印刷电路板上被图案化。 这用于防止通过作为当前通道的相同印刷电路板的表面的放电。 该设计使得可以密封电源模块，防止潮湿或污染的侵入以及盖板的位移，转换和裂纹。

公开(公告)号：US20070279890A1

公开(公告)日：2007-12-06

申请号：US11784736

申请日：2007-04-09

Applicant: Hiroyuki Motohara ,  You Kondoh ,  Mikio Nakamura ,  Takanori Sekido ,  Shinji Yasunaga

Inventor： Hiroyuki Motohara ,  You Kondoh ,  Mikio Nakamura ,  Takanori Sekido ,  Shinji Yasunaga

IPC: H05K7/00 ,  H05K3/36

CPC classification number: H05K1/144 ,  H01L2224/16 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4685 ,  H05K2201/042 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49126

Abstract: A stacked mounting structure includes a first substrate, a second substrate, and an intermediate substrate which has a space accommodating therein components to be mounted. A first contact (connecting) terminal and a second contact (connecting) terminal are formed on the first substrate and the second substrate, and have a wire which is formed on a side surface of the intermediate substrate. By formation of the intermediate substrate to be on an inner side than an edge surface of the substrates, a part of the two contact terminals respectively are exposed. One end of the wire is connected to an exposed portion of the first contact terminal, and the other end of the wire is connected to an exposed portion of the second contact terminal.

Abstract translation: 堆叠的安装结构包括第一基板，第二基板和中间基板，其具有容纳要安装的部件的空间。 第一接触（连接）端子和第二接触（连接）端子形成在第一基板和第二基板上，并且具有形成在中间基板的侧表面上的线。 通过形成位于比基板的边缘表面更内侧的中间基板，分别露出两个接触端子的一部分。 线的一端连接到第一接触端子的暴露部分，并且导线的另一端连接到第二接触端子的暴露部分。

公开(公告)号：US07252100B1

公开(公告)日：2007-08-07

申请号：US10402514

申请日：2003-03-28

Applicant: Stuart D. Downes ,  Deborah Fragoza ,  Eric Ren ,  Thomas E. Knight

Inventor： Stuart D. Downes ,  Deborah Fragoza ,  Eric Ren ,  Thomas E. Knight

IPC: B08B3/00

CPC classification number: H05K3/26 ,  H05K3/0097 ,  H05K2201/042 ,  H05K2203/0743 ,  H05K2203/1518

Abstract: A circuit board processing system includes a wash tank configured to contain cleaning fluid, and a positioning subsystem configured to immerse a set of circuit boards into the wash tank. The system further includes a flow control subsystem having (i) a first set of nozzles disposed within the wash tank, (ii) a second set of nozzles disposed within the wash tank, and (iii) a controller. The controller is configured to direct the cleaning fluid through the first set of nozzles to provide a flow of the cleaning fluid in a first direction relative to the set of circuit boards. The controller is further configured to direct the cleaning fluid through a second set of nozzles to provide a flow of the cleaning fluid in a second direction relative to the set of circuit boards after providing the flow of the cleaning fluid in the first direction.

Abstract translation: 电路板处理系统包括配置成容纳清洁流体的洗涤槽和配置成将一组电路板浸入洗涤槽中的定位子系统。 该系统还包括流控制子系统，其具有（i）设置在洗涤槽内的第一组喷嘴，（ii）设置在洗涤槽内的第二组喷嘴，和（iii）控制器。 控制器被配置为引导清洁流体穿过第一组喷嘴以提供相对于该组电路板的第一方向上的清洁流体的流动。 控制器进一步构造成引导清洁流体通过第二组喷嘴，以在提供清洁流体沿第一方向的流动之后，相对于该组电路板在第二方向上提供清洁流体的流动。