公开(公告)号：US20100048061A1

公开(公告)日：2010-02-25

申请号：US12516098

申请日：2007-11-23

Applicant: Christian Helmig ,  Matthias Bergmann ,  Jens Koester

Inventor： Christian Helmig ,  Matthias Bergmann ,  Jens Koester

IPC: H01R13/66

CPC classification number: H01R13/6466 ,  H01R9/031 ,  H01R24/86 ,  H05K1/0228 ,  H05K1/162 ,  H05K1/184 ,  H05K2201/09018 ,  H05K2201/10189 ,  H05K2201/10295 ,  Y10S439/941

Abstract: A connector includes an inner structure divided into first, second, and third components. The first component includes plug contacts disposed so as to form a circular plug face configured for connection to a mating connector. The second component includes a connection block having connection contacts configured for connection of a data line connection. The third component includes a printed circuit board configured to provide an adaptable connecting element between the connection block and the plug contacts. The printed circuit board includes a plurality of layers in a sandwich configuration, the plurality of layers including layers having conductive trace alternating with layers having a dielectric. A first layer having a dielectric is disposed between two layers having conductive trace so as to form a first parallel plate capacitor. A second layer having a dielectric is disposed between two layers having trace so as to form a second parallel plate capacitor. A third layer having a dielectric is disposed between the first and second parallel plate capacitors. At least one of the first and second layers is thinner than the third layer

Abstract translation: 连接器包括分为第一，第二和第三部件的内部结构。 第一部件包括布置成形成用于连接到配合连接器的圆形插头面的插头触头。 第二组件包括具有被配置为连接数据线连接的连接触点的连接块。 第三组件包括印刷电路板，其被配置为在连接块和插头触点之间提供适应性连接元件。 印刷电路板包括夹层结构的多个层，多个层包括具有与具有电介质的层交替的导电迹线的层。 具有电介质的第一层设置在具有导电迹线的两层之间，以形成第一平行板电容器。 具有电介质的第二层设置在具有迹线的两层之间，以形成第二平行板电容器。 具有电介质的第三层设置在第一和第二平行板电容器之间。 第一层和第二层中的至少一层比第三层薄

公开(公告)号：US07559137B2

公开(公告)日：2009-07-14

申请号：US11487387

申请日：2006-07-17

Applicant: Lawrence P. Beer ,  Michael Adelstein ,  C. Paul Christensen

Inventor： Lawrence P. Beer ,  Michael Adelstein ,  C. Paul Christensen

IPC: H01R43/00 ,  B32B15/00

CPC classification number: A61L29/14 ,  A61L29/085 ,  A61M25/0009 ,  A61M25/0013 ,  H05K1/0284 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/09018 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917

Abstract: A method for forming electrically conductive patterns to provide an electrically conductive path on a polymer tube is provided. The method includes the steps of establishing a polymer tube and mounting such in a displaceable and rotatable mounting that is adapted to provide both axial and rotational motion. This is followed by forming at least one channel having a predetermined pattern in the polymer tube with a focused energy beam, the channel then being filled with an electrically conductive paste or electrically conductive slurry material. The polymer tube is then heated to temperatures less than 250° C. to cure the electrically conductive paste or electrically conductive slurry material. The electrically conductive paste or electrically conductive slurry material is then covered with a polymer layer.

Abstract translation: 提供一种用于形成导电图案以在聚合物管上提供导电路径的方法。 该方法包括以下步骤：建立聚合物管并将其安装成适于提供轴向和旋转运动的位移和可旋转安装。 随后在聚合物管中用聚焦能量束形成具有预定图案的至少一个通道，然后该通道用导电浆料或导电浆料材料填充。 然后将聚合物管加热至低于250℃的温度以固化导电浆料或导电浆料。 然后用聚合物层覆盖导电膏或导电浆料。

公开(公告)号：US20090002973A1

公开(公告)日：2009-01-01

申请号：US12093496

申请日：2006-11-08

Applicant: Shinji Watanabe ,  Nobuhiro Mikami ,  Junya Sato ,  Kenichiro Fujii ,  Katsumi Abe ,  Atsumasa Sawada

Inventor： Shinji Watanabe ,  Nobuhiro Mikami ,  Junya Sato ,  Kenichiro Fujii ,  Katsumi Abe ,  Atsumasa Sawada

IPC: H05K7/00

CPC classification number: H05K1/18 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1515 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/023 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/32 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09436 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1469 ,  H05K2203/302 ,  Y02P70/611 ,  H01L2924/00

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

Abstract translation: 本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。 在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。 弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。 基座部分13a由绝缘材料形成。 半导体封装20安装在焊盘部分15a上。

公开(公告)号：US20080272983A1

公开(公告)日：2008-11-06

申请号：US12093506

申请日：2006-10-24

Applicant: Christian Desagulier

Inventor： Christian Desagulier

IPC: H01Q15/14 ,  H05K3/00

CPC classification number: H05K1/00 ,  C25D5/02 ,  C25D5/06 ,  H01Q15/141 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/027 ,  H05K3/125 ,  H05K3/241 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/09018 ,  H05K2203/013 ,  H05K2203/0195 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: The invention relates to a method for producing a non-developable surface printed circuit and to the thus obtained printed circuit. According to said invention, each electrically conductive pattern (7) of a printed circuit (2) comprises a base (7E), which is arranged on the non-developable surface (6) and obtained by projecting an electrically conductive varnish, and a coating (7R), which is arranged on said base (7E) and made of an electrically well conductive material by means of buffer electrolysis.

Abstract translation: 本发明涉及一种用于制造不可显影的表面印刷电路的方法以及由此获得的印刷电路。 根据所述发明，印刷电路（2）的每个导电图案（7）包括设置在不可显影表面（6）上并通过突出导电清漆而获得的基座（7E），并且 涂布（7R），其通过缓冲电解设置在所述基底（7A）上并由导电材料制成。

公开(公告)号：US20080210456A1

公开(公告)日：2008-09-04

申请号：US11815447

申请日：2006-02-20

Applicant: Christian Desagulier ,  Alain Lacombe ,  Bruno Esmiller

Inventor： Christian Desagulier ,  Alain Lacombe ,  Bruno Esmiller

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/061 ,  H01Q15/141 ,  H05K1/0284 ,  H05K3/0032 ,  H05K3/0082 ,  H05K2201/09018 ,  H05K2203/107 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The invention concerns a method for producing electrically conductive patterns on a non-developable surface of an insulating substrate, and the resulting device. The invention is characterized in that it consists in: coating the non-developable surface (6) uniformly with a layer of electrically conductive material (9), which is in turn coated with a layer of protective material (10), and then, using a mobile laser head, eliminating by laser ablation the portions of said protective substance layer (10) which do not cover said electrically conductive patterns, then eliminating the portions of said electrically conductive material (9) exposed by the elimination of said portions of said protective material layer (10).

Abstract translation: 本发明涉及一种用于在绝缘基板的不可显影表面上制造导电图案的方法，以及所得到的器件。 本发明的特征在于，它包括：用一层导电材料（9）均匀地涂覆不可显影的表面（6），导电材料层（9）又被涂覆有一层保护材料（10），然后使用 移动激光头，通过激光烧蚀消除所述保护物质层（10）的不覆盖所述导电图案的部分，然后消除通过消除所述保护性物品的所述部分暴露的部分所述导电材料（9） 材料层（10）。

公开(公告)号：US20080125754A1

公开(公告)日：2008-05-29

申请号：US11487387

申请日：2006-07-17

Applicant: Lawrence P. Beer ,  Michael Adelstein ,  C. Paul Christensen

Inventor： Lawrence P. Beer ,  Michael Adelstein ,  C. Paul Christensen

IPC: A61M25/098 ,  A61L33/00

CPC classification number: A61L29/14 ,  A61L29/085 ,  A61M25/0009 ,  A61M25/0013 ,  H05K1/0284 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/09018 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/24917

Abstract: A method for forming electrically conductive patterns to provide an electrically conductive path on a polymer tube is provided. The method includes the steps of establishing a polymer tube and mounting such in a displaceable and rotatable mounting that is adapted to provide both axial and rotational motion. This is followed by forming at least one channel having a predetermined pattern in the polymer tube with a focused energy beam, the channel then being filled with an electrically conductive paste or electrically conductive slurry material. The polymer tube is then heated to temperatures less than 250° C. to cure the electrically conductive paste or electrically conductive slurry material. The electrically conductive paste or electrically conductive slurry material is then covered with a polymer layer.

Abstract translation: 提供一种用于形成导电图案以在聚合物管上提供导电路径的方法。 该方法包括以下步骤：建立聚合物管并将其安装成适于提供轴向和旋转运动的位移和可旋转安装。 随后在聚合物管中用聚焦能量束形成具有预定图案的至少一个通道，然后该通道用导电浆料或导电浆料材料填充。 然后将聚合物管加热至低于250℃的温度以固化导电浆料或导电浆料。 然后用聚合物层覆盖导电膏或导电浆料。

公开(公告)号：US20080028956A1

公开(公告)日：2008-02-07

申请号：US11458307

申请日：2006-07-18

Applicant: Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

Inventor： Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

IPC: B41M1/12

CPC classification number: H05K3/1216 ,  H01Q1/42 ,  H05K1/0284 ,  H05K3/0091 ,  H05K3/4664 ,  H05K2201/09018 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1554

Abstract: An electric circuit is applied to an object having a curved surface. The curved surface of the object is divided into sections, and the circuit is applied one section at a time. The circuit is formed between layers of dielectric material. The dielectric is applied by a computer-controlled device, which controls the position of a spray head and the rotation of the object, such that the spray head is held substantially perpendicular to the surface of the object at all times, and such that a controlled thickness of dielectric material can be deposited. The fine-featured circuits formed by the invention are rugged, and can be used on objects intended to be exposed to harsh environments.

Abstract translation: 电路被施加到具有曲面的物体上。 物体的曲面被分成几部分，电路一次应用一个部分。 该电路形成在介电材料层之间。 电介质通过计算机控制的装置施加，其控制喷头的位置和物体的旋转，使得喷头始终保持基本上垂直于物体的表面，并且使得受控的 介电材料的厚度可以沉积。 由本发明形成的精细电路是坚固的，并且可以用于旨在暴露于恶劣环境的物体上。

公开(公告)号：US20080012140A1

公开(公告)日：2008-01-17

申请号：US11822599

申请日：2007-07-09

Applicant: Jun Tsukano ,  Kenta Ogawa ,  Takehiko Maeda ,  Shintaro Yamamichi ,  Katsumi Kikuchi

Inventor： Jun Tsukano ,  Kenta Ogawa ,  Takehiko Maeda ,  Shintaro Yamamichi ,  Katsumi Kikuchi

IPC: H01L23/52 ,  H01L21/4763

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/09018 ,  H05K2201/09481 ,  H05K2201/09781 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via hole formed in the base insulating film, and a second interconnection provided on a bottom surface side of the base insulating film, the second interconnection being connected to the first interconnection via the via conductor. The wiring substrate includes divided-substrate-unit regions, in each of which the first interconnection, the via conductor, and the second interconnection are formed. The wiring substrate includes a warpage-controlling pattern on the base insulating film, and has a warped shape such that when the wiring substrate is left at rest on a horizontal plate, at least a central part of each side of a plane surface of the substrate contacts the horizontal plate, with both ends of the side raised, where each of the sides extends along a second direction perpendicular to a first direction in the plane surface of the substrate.

Abstract translation: 布线基板包括基底绝缘膜，形成在基底绝缘膜的上表面侧上的第一互连，设置在形成在基底绝缘膜中的通孔中的通孔导体，以及设置在基底绝缘膜的底面侧的第二互连 基底绝缘膜，第二互连件经由通孔导体连接到第一互连件。 布线基板包括分割的基板单元区域，其中形成有第一互连，通孔导体和第二互连。 布线基板包括在基底绝缘膜上的翘曲控制图案，并且具有翘曲形状，使得当布线基板静止在水平板上时，基板的平面的每一侧的至少中心部分 接触水平板，其侧面的两端被凸起，其中每个侧面沿着垂直于基板的平面表面中的第一方向的第二方向延伸。

公开(公告)号：US20070072450A1

公开(公告)日：2007-03-29

申请号：US11234985

申请日：2005-09-26

Applicant: Michael McAllister ,  Harald Pross ,  Gerhard Ruehle ,  Wolfgang Scholz ,  Gerhard Schoor

Inventor： Michael McAllister ,  Harald Pross ,  Gerhard Ruehle ,  Wolfgang Scholz ,  Gerhard Schoor

IPC: H01R12/00

CPC classification number: H05K3/0061 ,  H05K3/325 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2201/10598 ,  H05K2201/10719

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

公开(公告)号：US07015869B2

公开(公告)日：2006-03-21

申请号：US10298434

申请日：2002-11-18

Applicant: C. Allen Marlow ,  Jay DeAvis Baker ,  Lawrence Leroy Kneisel ,  Rosa Lynda Nuño ,  William David Hopfe

Inventor： C. Allen Marlow ,  Jay DeAvis Baker ,  Lawrence Leroy Kneisel ,  Rosa Lynda Nuño ,  William David Hopfe

IPC: H01Q19/00

CPC classification number: H01P5/184 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H05K1/0272 ,  H05K1/0284 ,  H05K1/115 ,  H05K2201/09018 ,  H05K2201/09836

Abstract: The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.

Abstract translation: 本发明由包括三维基板和附接到其上的多个电气装置的电气通信装置组成。 基板优选为电介质。 电气设备优选地是进行高频通信所需的类型，例如微波天线和光子接收器和发射器。 在由串联通孔和一个基板表面的交叉点所描述的连接点处将电气装置附接到基板。 电气设备以多种方式附着到基板上，包括焊料，翻转的芯片球接合，引线接合或金螺柱组件。 特别地，金螺柱组件用于将天线附接到基板，从而在其间提供预定的气隙。