公开(公告)号：US5375039A

公开(公告)日：1994-12-20

申请号：US127150

申请日：1993-09-27

Applicant: Thomas Wiesa

Inventor： Thomas Wiesa

IPC: H05K1/02 ,  H05K3/42 ,  H05K7/20 ,  H05H7/20

CPC classification number: H05K1/0206 ,  H05K7/205 ,  H05K1/0272 ,  H05K2201/0338 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K3/0061 ,  H05K3/42

Abstract: A circuit board layering arrangement is capable of dissipating, into a heat sink, the heat produced by power components mounted on the circuit board, without permitting the short circuiting of electricity between the power components and other components or the heat sink. The arrangement comprises a circuit board, at least one power component and a heat sink. A plurality of through contacts are introduced into the circuit board, and a plurality of conductive tracks are disposed on first and second surfaces of the circuit board. The plurality of conductive tracks include two large-surface conductive tracks, one on each surface of the circuit board. One or more power components are surface-mounted on a first surface of the circuit board on a first large-surface conductive track. The second large-surface conductive track is thermally coupled to the first large-surface conductive track and to the heat sink. A layer of metal, preferably copper, may be disposed between the second large-surface conductive track and the heat sink, and a layer of glass cloth may be disposed between the second large-surface conductive track and the layer of metal.

Abstract translation: 电路板层叠装置能够将安装在电路板上的功率部件产生的热量散发到散热器中，而不会使功率部件和其它部件或散热器之间的电短路。 该装置包括电路板，至少一个功率部件和散热器。 多个贯通接点被引入到电路板中，并且多个导电轨道设置在电路板的第一和第二表面上。 多个导电轨道包括两个大表面导电轨道，一个在电路板的每个表面上。 一个或多个功率部件被表面安装在第一大表面导电轨道上的电路板的第一表面上。 第二大表面导电轨道热耦合到第一大表面导电轨道和散热器。 可以在第二大表面导电轨道和散热器之间设置金属层，优选铜层，并且可以在第二大表面导电轨道和金属层之间设置一层玻璃布。

公开(公告)号：US4794489A

公开(公告)日：1988-12-27

申请号：US99352

申请日：1987-09-21

Applicant: Vernon L. Brown

Inventor： Vernon L. Brown

IPC: H01M2/10 ,  H04B1/38 ,  H04M1/02 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K9/00

CPC classification number: H04M1/0262 ,  H01M2/1022 ,  H04B1/3883 ,  H05K1/0215 ,  H05K3/341 ,  H05K3/4084 ,  H05K1/0237 ,  H05K1/144 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/10969 ,  H05K3/0061 ,  H05K3/4038 ,  H05K3/44 ,  Y02P70/613

Abstract: A unique housing (104) of a portable radio transceiver (100) is described that takes advantage of the heat sinking, electrical shielding and structural characteristics of a battery. The unique electronic circuitry housing (104) includes a battery as a structural element thereof. In one illustrated housing (104), a stick battery (210) is attached to the side of a transmitter printed circuit panel (213). A logic printed circuit panel (212) and a receiver printed circuit panel (214) are positioned above and below the transmitter printed circuit panel (213), respectively, and are held together by interlocking side rails (206,207). The electronic circuitry housing of the present invention may be advantageously utilized in a variety of applications where electronic circuitry is operated from a battery.

Abstract translation: 描述了利用电池的散热，电屏蔽和结构特征的便携式无线电收发器（100）的独特外壳（104）。 独特的电子电路壳体（104）包括作为其结构元件的电池。 在一个示出的壳体（104）中，粘贴电池（210）附接到发射器印刷电路板（213）的侧面。 逻辑印刷电路板（212）和接收器印刷电路板（214）分别位于发射机印刷电路板（213）的上方和下方，并通过互锁的侧轨（206,207）保持在一起。 本发明的电子电路外壳可有利地用于电池从电池操作的各种应用中。

公开(公告)号：US4546406A

公开(公告)日：1985-10-08

申请号：US602792

申请日：1984-05-07

Applicant: Thomas S. Spinelli ,  William G. Manns ,  Donald F. Weirauch

Inventor： Thomas S. Spinelli ,  William G. Manns ,  Donald F. Weirauch

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/20 ,  H05K3/42 ,  H05K3/46

CPC classification number: C03C29/00 ,  C03C8/02 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/538 ,  H05K1/0207 ,  H05K1/053 ,  H05K3/202 ,  H05K3/4629 ,  H05K3/4641 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K1/0206 ,  H05K1/0306 ,  H05K2201/068 ,  H05K2201/09054 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/10969 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/1476 ,  H05K3/429 ,  H05K3/4611 ,  Y10T428/12528

Abstract: An electronic circuit interconnection system provides high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.

Abstract translation: 电子电路互连系统提供高密度安装陶瓷芯片载体集成电路器件或其他射束引线，双列直插（DIP），带自动键合（TAB），倒装芯片或直接安装的直流 在具有高散热特性的经济，尺寸稳定的互连基板上具有引线接合互连件的装置等。 衬底具有熔合到蚀刻金属图案上并且相对于金属图案成比例的玻璃成分，使得衬底的热膨胀特性对应于直流电的那些。 保持i.c.之间的债券完整性的设备。 引线和电路路径，使基板具有足够的散热特性，以允许高密度直流电。 安装。 这些基板在被选择厚度的多金属层压金属板中的蚀刻图案中包含电路路径，器件安装焊盘，边缘端子，引脚安装孔和其它典型的衬底特征，其在一侧或两侧上用与玻璃板熔合的玻璃料一起涂覆。 在需要多于一层的基材的情况下，玻璃涂覆的板堆叠，销钉安装孔等对齐，并且玻璃涂层熔合在一起。 金属通孔在需要时延伸穿过玻璃涂层以互连基底的金属层。

公开(公告)号：US4472762A

公开(公告)日：1984-09-18

申请号：US438137

申请日：1982-11-01

Applicant: Thomas S. Spinelli ,  William G. Manns ,  Donald F. Weirauch

Inventor： Thomas S. Spinelli ,  William G. Manns ,  Donald F. Weirauch

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/20 ,  H05K3/42 ,  H05K3/46 ,  H05K1/09

CPC classification number: H05K3/4629 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/538 ,  H05K1/0207 ,  H05K1/053 ,  H05K3/202 ,  H05K3/4641 ,  H01L2224/49171 ,  H01L2924/09701 ,  H05K1/0206 ,  H05K1/0306 ,  H05K2201/068 ,  H05K2201/09054 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/10969 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/1476 ,  H05K3/429 ,  H05K3/4611

Abstract: An electronic circuit interconnection system provides high density mounting on ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.

Abstract translation: 电子电路互连系统提供高密度安装在陶瓷芯片载体集成电路器件或其他射束引线，双列直插式（DIP），带自动键合（TAB），倒装芯片或直接安装的直流电。 在具有高散热特性的经济，尺寸稳定的互连基板上具有引线接合互连件的装置等。 衬底具有熔合到蚀刻金属图案上并且相对于金属图案成比例的玻璃成分，使得衬底的热膨胀特性对应于直流电的那些。 保持i.c.之间的债券完整性的设备。 引线和电路路径，使基板具有足够的散热特性，以允许高密度直流电。 安装。 这些基板在被选择厚度的多金属层压金属板中的蚀刻图案中包含电路路径，器件安装焊盘，边缘端子，引脚安装孔和其它典型的衬底特征，其在一侧或两侧上用与玻璃板熔合的玻璃料一起涂覆。 在需要多于一层的基材的情况下，玻璃涂覆的板堆叠，销钉安装孔等对齐，并且玻璃涂层熔合在一起。 金属通孔在需要时延伸穿过玻璃涂层以互连基底的金属层。

公开(公告)号：US4385202A

公开(公告)日：1983-05-24

申请号：US191039

申请日：1980-09-25

Applicant: Thomas S. Spinelli ,  William G. Manns ,  Donald F. Weirauch

Inventor： Thomas S. Spinelli ,  William G. Manns ,  Donald F. Weirauch

IPC: H05K1/18 ,  H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/06 ,  H05K3/20 ,  H05K3/42 ,  H05K3/46 ,  H05K1/09

CPC classification number: H05K3/4641 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/538 ,  H01L23/5383 ,  H05K1/0207 ,  H05K1/053 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4629 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/09701 ,  H05K1/0206 ,  H05K1/0306 ,  H05K2201/068 ,  H05K2201/09054 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/10969 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/1476 ,  H05K3/429 ,  H05K3/4611

Abstract: An electronic circuit interconnection system permitting high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like has economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.

Abstract translation: 一种电子电路互连系统，允许陶瓷芯片载体集成电路器件或其他射束引线，双列直插（DIP），带自动键合（TAB），倒装芯片或直接安装的直流安装的高密度安装。 具有导线接合互连件的装置等具有经济的尺寸稳定的互连基板，其具有高的散热性能。 衬底具有熔合到蚀刻金属图案上并且相对于金属图案成比例的玻璃成分，使得衬底的热膨胀特性对应于直流电的那些。 保持i.c.之间的债券完整性的设备。 引线和电路路径，使基板具有足够的散热特性，以允许高密度直流电。 安装。 这些基板在被选择厚度的多金属层压金属板中的蚀刻图案中包含电路路径，器件安装焊盘，边缘端子，引脚安装孔和其它典型的衬底特征，其在一侧或两侧上用与玻璃板熔合的玻璃料一起涂覆。 在需要多于一层的基材的情况下，玻璃涂覆的板堆叠，销钉安装孔等对齐，并且玻璃涂层熔合在一起。 金属通孔在需要时延伸穿过玻璃涂层以互连基底的金属层。

公开(公告)号：US20190254157A1

公开(公告)日：2019-08-15

申请号：US16341997

申请日：2017-10-12

Applicant: CPT GROUP GMBH

Inventor： AURELIAN KOTLAR

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K7/205 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/09054

Abstract: A mounting assembly includes an electronic component mounted on an upper surface of a circuit board and having at least one electrical connector and a thermal pad provided on a lower surface of the component. The circuit board is mounted on a heatsink and provided with an opening beneath the thermal pad of the component. The heatsink has a heatsink extension which extends through the circuit board and is spatially separated therefrom. A thermal interface material is provided to ensure an electrically insulating thermal connection between the thermal pad and the heatsink extension.

公开(公告)号：US20180324947A1

公开(公告)日：2018-11-08

申请号：US15966223

申请日：2018-04-30

Applicant: UNIVERSITY-INDUSTRY FOUNDATION (UIF), YONSEI UNIVERSITY

Inventor： Dahl-Young Khang ,  Sung-Soo Yoon

IPC: H05K1/02 ,  G02B6/10 ,  H05K3/38

CPC classification number: H05K1/0296 ,  B23K28/00 ,  B82Y30/00 ,  B82Y40/00 ,  C22C2200/04 ,  G02B6/107 ,  H05K3/382 ,  H05K2201/0338 ,  H05K2201/09054 ,  H05K2203/0307

Abstract: The present invention relates to a metallic nano structure including a plurality of metallic nano materials; and a junction locally disposed in a region where the metallic nano materials adjacent to each other among the plurality of metallic nano materials are in contact with each other in order to bond the adjacent metallic nano materials.

公开(公告)号：US09942976B2

公开(公告)日：2018-04-10

申请号：US15039492

申请日：2014-11-25

Applicant: Guangzhou Fastprint Circuit Tech Co., Ltd ,  Shenzhen Fastprint Circuit Tech Co., Ltd. ,  Yixing Silicon Valley Electronics Technology Co., Ltd.

Inventor： Bei Chen ,  Bo Xu ,  Xinman Mo

IPC: H05K3/20 ,  H05K1/02 ,  H05K3/46 ,  H05K1/05 ,  H05K3/44 ,  H05K3/00

CPC classification number: H05K1/0204 ,  H05K1/0207 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/05 ,  H05K3/0061 ,  H05K3/44 ,  H05K3/4691 ,  H05K2201/09054

Abstract: A boss-type metal-based sandwich rigid-flex board and preparation method thereof are disclosed. The boss-type metal-based sandwich rigid-flex board comprises a rigid sub-plate, a flexible sub-plate, a dielectric layer, and a metal core layer, wherein the metal core layer has front and back sides on which at least one metal boss and at least one heat dissipation area are arranged respectively, the dielectric layer, and the rigid sub-plate and/or the flexible sub-plate are sequentially stacked on the front and back sides of the metal core layer respectively, and each of the rigid sub-plate, the flexible sub-plate and the dielectric layer is provided with a first window area fit with the metal boss, and a second window area corresponding to the heat dissipation area. The boss-type metal-based sandwich rigid-flex board (with a metal boss and a heat dissipation area arranged on the front side) prepared according to the present disclosure uses a metal core layer for heat dissipation. In this way, not only the need of heat dissipation of the locally heating electronic components (through the metal boss) but also the heat dissipation of the high density wirings at work can be satisfied (through the metal core layer and the heat dissipation area) with good reliability.

公开(公告)号：US09930815B2

公开(公告)日：2018-03-27

申请号：US15358687

申请日：2016-11-22

Applicant: MDM Inc.

Inventor： Ku Yong Kim

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K7/209 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/303 ,  H05K3/4608 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10242

Abstract: The present disclosure relates to a layered structure of a multi-layer PCB, and more particularly, to a structure of a high-power multi-layer PCB which can use a high current by efficiently dissipating heat generated from the inside of the multi-layered PCB and heat generated from a power semiconductor module package mounted on the PCB, and a production method thereof. The multi-layer PCB includes: a conductive plate having a plurality of heat poles protruding from at least one of a top surface and a bottom surface thereof; PCBs which are disposed on the top surface and the bottom surface of the conductive plate, and have a plurality of penetrating holes formed therethrough to allow the heat poles of the conductive plate to be inserted thereinto; and an insulation layer which is attached between the conductive plate and the PCBs in order to electrically insulate.

公开(公告)号：US20160087326A1

公开(公告)日：2016-03-24

申请号：US14839323

申请日：2015-08-28

Applicant: Cambium Networks Limited

Inventor： Adam Wilkins ,  Carl Morrell ,  Paul Clark ,  Peter Spence ,  Nigel Jonathan Richard King

IPC: H01P5/08 ,  H01P3/08 ,  H01P11/00

CPC classification number: H01P5/085 ,  H01P3/08 ,  H01P5/028 ,  H01P11/003 ,  H05K1/0251 ,  H05K1/144 ,  H05K2201/09054 ,  H05K2201/10303

Abstract: A radio frequency transmission arrangement comprises a ground plate (8) having first and second opposite sides and a boss protruding from said second side of the ground plate (8), a first transmission line comprising a first elongate conductor (1) passing from the first side of the ground plate through an aperture (3) in the ground plate and the boss, and a second transmission line comprising a second elongate conductor (2) and a ground plane (6), the first elongate conductor (1) passing through the ground plane (6) to connect to the second elongate conductor. The boss has an end surface (4) disposed in a substantially parallel relationship with the ground plane (6) of the second transmission line, and there is a gap between the end surface of the boss and the ground plane.

Abstract translation: 射频传输装置包括具有第一和第二相对侧的接地板（8）和从接地板（8）的所述第二侧突出的凸台;第一传输线，包括从第一和第二侧面通过的第一细长导体（1） 接地板的一侧通过接地板和凸台中的孔（3）和包括第二细长导体（2）和接地平面（6）的第二传输线，第一细长导体（1）穿过接地板 接地平面（6）连接到第二细长导体。 凸台具有与第二传输线的接地面（6）大致平行的端面（4），并且在凸台的端面与接地面之间存在间隙。