公开(公告)号：US20150201513A1

公开(公告)日：2015-07-16

申请号：US14417464

申请日：2013-07-26

Applicant: ROSCH HOLDING UND CONSULTING GMBH

Inventor： Istvan Czobel ,  Robert Schneider

IPC: H05K5/06 ,  H05K7/14 ,  H05K5/03

CPC classification number: H05K5/065 ,  G06F21/87 ,  H05K1/0275 ,  H05K3/284 ,  H05K5/0208 ,  H05K5/03 ,  H05K7/1427 ,  H05K2201/09063

Abstract: A tamper-protected electronic module comprises a printed circuit board having a first side, on which electronic components of an electronic circuit including at least one microchip are located, and a housing cover that is facing the first side of the printed circuit board. The housing cover has, on the inside thereof, a sealed inner frame that extends to the first side of the printed circuit board and surrounds only a security-relevant portion of the electronic circuit including the microchip. The volume enclosed by the inner frame between the first side of the printed circuit board and the housing cover is filled with a casting resin under formation of a coherent casting compound.

Abstract translation: 防篡改电子模块包括印刷电路板，其具有第一侧，电子电路的至少一个微芯片的电子部件位于该第一侧上，以及面向印刷电路板的第一侧的外壳盖。 壳体的内部具有延伸到印刷电路板的第一侧的密封内框架，并且仅包括包括微芯片的电子电路的安全相关部分。 由印刷电路板的第一面和壳体盖之间的内部框架封闭的体积填充有形成相干铸塑料的铸塑树脂。

公开(公告)号：US20150173171A1

公开(公告)日：2015-06-18

申请号：US14295199

申请日：2014-06-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Tae-Eun Kim ,  Jong-Nam Lee

IPC: H05K1/02

CPC classification number: H05K1/028 ,  G06F1/1637 ,  G06F1/1652 ,  H05K1/0271 ,  H05K1/147 ,  H05K2201/09063 ,  H05K2201/10128

Abstract: A display device includes a display panel having a first surface and a second surface opposite the first surface, and a flexible circuit having a first end portion connected to the first surface of the display panel and a second end portion folded around the first end portion of the display panel and coupled the second surface of the display panel. The flexible circuit unit may include at least one slit having a width extending substantially parallel to the first end portion of the display panel and a height extending substantially perpendicular to the width, the height of the slit being greater than the width.

Abstract translation: 显示装置包括具有第一表面和与第一表面相对的第二表面的显示面板，以及柔性电路，其具有连接到显示面板的第一表面的第一端部和折叠在第一端部的第一端部 显示面板并且连接显示面板的第二表面。 柔性电路单元可以包括具有基本上平行于显示面板的第一端部延伸的宽度的至少一个狭缝和基本上垂直于宽度延伸的高度，狭缝的高度大于宽度。

公开(公告)号：US20150171574A1

公开(公告)日：2015-06-18

申请号：US14558732

申请日：2014-12-03

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： TERRANCE F. LITTLE ,  CHIH-PI CHENG ,  CHIEN-PING KAO ,  WEI-HAO SU ,  AN-JEN YANG ,  DE-CHENG ZOU ,  CHIH-HSIEN CHOU

IPC: H01R24/60 ,  H01R13/6591 ,  H01R12/72 ,  H01R24/30

CPC classification number: H01R24/60 ,  H01R12/724 ,  H01R13/642 ,  H01R13/6582 ,  H01R13/6658 ,  H01R24/28 ,  H01R2107/00 ,  H05K1/117 ,  H05K1/184 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A receptacle connector mounted to a PCB, includes an insulative housing defining a mating tongue and a metallic shell enclosing the housing to form a mating cavity in which said mating tongue forwardly extends. A metallic shielding plate is embedded within a mid-level of the mating tongue wherein a leg of the shielding plate and a tail of an outermost grounding contact share the same conductive grounding region on the PCB. A plug connector mateable with the receptacle connector, includes an insulative housing defining a mating cavity to receive the mating tongue and equipped with a plurality of contacts and a metallic latch beside the mating cavity, wherein a tail of one grounding contact and a leg of the latch share the same conductive grounding region on a paddle card, which is behind the mating cavity and on which tails of the contacts are electrically and mechanically mounted.

Abstract translation: 安装到PCB的插座连接器包括限定配合舌片的绝缘壳体和围绕壳体的金属壳体，以形成配合腔体，所述配合舌片向前延伸。 金属屏蔽板嵌入在配合舌片的中间层内，其中屏蔽板的腿部和最外面的接地触头的尾部共享PCB上相同的导电接地区域。 与插座连接器配合的插头连接器包括绝缘壳体，其限定配合腔室以容纳配合舌片，并配备有多个触点和在配合腔体旁边的金属闩锁，其中一个接地触头的尾部和 闩锁在桨卡上共享相同的导电接地区域，其位于配合腔的后面，并且触头的尾部被电和机械地安装。

公开(公告)号：US20150155246A1

公开(公告)日：2015-06-04

申请号：US14615956

申请日：2015-02-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki Tsukizawa ,  Jun Adachi ,  Takayuki Imada ,  Takahiro Sumi

IPC: H01L23/60 ,  H01B1/14 ,  H05F3/04

CPC classification number: H01L23/60 ,  H01B1/14 ,  H01B1/16 ,  H01B1/18 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/0002 ,  H01T1/22 ,  H01T4/10 ,  H05F3/04 ,  H05K1/026 ,  H05K3/4697 ,  H05K2201/09063 ,  H05K2201/0919 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An ESD protection device 1 has a ceramic insulating material 10, first and second discharge electrodes 21 and 22, and a discharge-assisting section 51. The first and second discharge electrodes 21 and 22 are disposed somewhere of the ceramic insulating material 10. The discharge-assisting section 51 is located between the distal end portion of the first discharge electrode 21 and the distal end portion of the second discharge electrode 22. The discharge-assisting section 51 is an electrode configured to reduce the discharge starting voltage between the first discharge electrode 21 and the second discharge electrode 22. The discharge-assisting section 51 is made from a sintered body containing conductive particles and at least one of semiconductor particles and insulating particles. The first and second discharge electrodes contain at least one of the semiconductor material constituting the semiconductor particles and the insulating material constituting the insulating particles.

Abstract translation: ESD保护器件1具有陶瓷绝缘材料10，第一和第二放电电极21和22以及放电辅助部分51.第一和第二放电电极21和22设置在陶瓷绝缘材料10的某处。放电 辅助部51位于第一放电电极21的前端部与第二放电电极22的前端部之间。放电辅助部51是将第一放电电极 21和第二放电电极22.放电辅助部51由包含导电颗粒和半导体颗粒和绝缘颗粒中的至少一种的烧结体制成。 第一和第二放电电极包含构成半导体颗粒的半导体材料和构成绝缘颗粒的绝缘材料中的至少一个。

公开(公告)号：US09030007B2

公开(公告)日：2015-05-12

申请号：US12903403

申请日：2010-10-13

Applicant: Daisuke Mizutani

Inventor： Daisuke Mizutani

IPC: H01L23/48 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L21/768 ,  H05K1/02 ,  H05K3/22

CPC classification number: H05K1/147 ,  H01L21/76898 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/222 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0379 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor device includes a first circuit base member including a surface having multiple first electrodes formed thereon, a second circuit base member being provided above the first circuit base member and having first through holes and second through holes formed respectively above the first electrodes, a semiconductor package provided above the second circuit base member, and multiple first bumps provided inside the first through holes and the second through holes to connect the first electrodes to the semiconductor package.

Abstract translation: 半导体器件包括：第一电路基体部件，其包括形成有多个第一电极的表面;第二电路基体部件，设置在第一电路基体的上方，并具有分别形成在第一电极上方的第一通孔和第二通孔; 设置在第二电路基体上方的封装，以及设置在第一通孔内的多个第一凸起和第二通孔，以将第一电极连接到半导体封装。

公开(公告)号：US20150117001A1

公开(公告)日：2015-04-30

申请号：US14506000

申请日：2014-10-03

Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.

Inventor： Ben FAN

IPC: F21S4/00 ,  H05K3/10 ,  F21V7/00 ,  F21V23/00 ,  F21V21/14 ,  F21K99/00

CPC classification number: F21S4/005 ,  F21K9/90 ,  F21S4/22 ,  F21V7/0066 ,  F21V21/14 ,  F21V23/001 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/028 ,  H05K1/189 ,  H05K3/10 ,  H05K3/202 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10106 ,  Y10T29/49162

Abstract: A flexible circuit board is disclosed, including a first insulation layer, a second insulation layer and a circuit layer, wherein the first insulation layer is attached to one side of the circuit layer and the second insulation layer is attached to the other side of the circuit layer, each of the first insulation layer and the second insulation layer is provided with a foldable portion along their length, the foldable portion of the first insulation layer is corresponding in position with the foldable portion of the second insulation layer, and the circuit layer includes a set of power wires and at least one lighting wire. And a method for manufacturing the flexible circuit board, and a LED flexible strip light are also disclosed.

Abstract translation: 公开了一种柔性电路板，包括第一绝缘层，第二绝缘层和电路层，其中第一绝缘层附着到电路层的一侧，第二绝缘层附接到电路的另一侧 层，所述第一绝缘层和所述第二绝缘层中的每一个沿其长度设置有可折叠部分，所述第一绝缘层的可折叠部分与所述第二绝缘层的可折叠部分对应，并且所述电路层包括 一组电源线和至少一个照明线。 还公开了一种用于制造柔性电路板的方法和一种LED柔性条带灯。

公开(公告)号：US20150114706A1

公开(公告)日：2015-04-30

申请号：US14511397

申请日：2014-10-10

Applicant: Curtiss-Wright Controls, Inc.

Inventor： Michael Rose ,  Robert Sullivan

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/0216 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/20 ,  H05K3/4038 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/1059

Abstract: A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.

Abstract translation: 电路板包括多个层，第一和第二参考导电通孔在垂直方向上延伸穿过多个层的至少一部分，第一和第二信号导电通孔在垂直方向上延伸并且在水平方向间隔开 从所述第一和第二参考导电通孔穿过所述多个层的至少一部分，以及在所述第一和第二信号导电通孔之间沿垂直方向延伸的电介质区域。 空气通道在垂直方向上延伸穿过第一和第二信号导电通孔之间的电介质区域。 反焊盘在第一和第二参考导电通孔之间沿水平方向延伸，并且在水平方向上包围第一和第二信号导电通孔，空气通孔和电介质区域。

公开(公告)号：US20150114694A1

公开(公告)日：2015-04-30

申请号：US14231411

申请日：2014-03-31

Applicant: Wistron Corporation

Inventor： Yu-Ju Liu ,  Che-Wen Liu

IPC: H05K1/14

CPC classification number: H05K1/147 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/10356 ,  H05K2201/2027 ,  Y10T29/49181

Abstract: An assembly includes a circuit board and a flexible flat cable. The circuit board includes a board body having top, bottom and side faces, and a connection module. The board body is formed with a positioning slot that is formed through the top and bottom faces and that has a first length, and an opening that extends from the side face and that is in spatial communication with the positioning slot. The opening is formed through the top and bottom faces and has a second length shorter than the first length. The flexible flat cable includes a connection unit and a cable main body that has a width greater than the second length. The cable main body is able to pass through the opening, and extends through and is positioned in the positioning slot.

Abstract translation: 组件包括电路板和柔性扁平电缆。 电路板包括具有顶部，底部和侧面以及连接模块的板体。 板本体形成有通过顶面和底面形成并具有第一长度的定位槽，以及从侧面延伸并与定位槽空间连通的开口。 开口通过顶面和底面形成，并且具有比第一长度短的第二长度。 柔性扁平电缆包括具有大于第二长度的宽度的连接单元和电缆主体。 电缆主体能够穿过开口，并且延伸穿过并定位在定位槽中。

公开(公告)号：US20150108084A1

公开(公告)日：2015-04-23

申请号：US14375824

申请日：2013-01-24

Applicant: Trackwise Designs Limited

Inventor： Philip Johnston

IPC: H05K3/46 ,  H05K3/06

CPC classification number: H05K3/4611 ,  B32B37/1027 ,  B32B2457/08 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/06 ,  H05K3/064 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4635 ,  H05K3/4638 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2203/068 ,  H05K2203/1545 ,  H05K2203/167

Abstract: A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.

Abstract translation: 一种制造多层柔性电路的方法包括提供第一和第二柔性基板，每个柔性基板包括导体层和绝缘体层。 第一基板的导体层是图案化的导体层。 第一和第二基板使用双带压机层压在一起，基板通过该双层压机连续地移动。 该方法可以包括使用蚀刻方法图案化第一衬底的导体层和/或第二衬底的导体层，该蚀刻方法包括通过执行多个相邻和相邻的曝光来将导体层上的干膜抗蚀剂暴露于图案 /或重叠区域。

公开(公告)号：US08988890B2

公开(公告)日：2015-03-24

申请号：US13598308

申请日：2012-08-29

Applicant: Michael B. Wittenberg ,  Jared M. Kole ,  Sawyer I. Cohen ,  Shayan Malek

Inventor： Michael B. Wittenberg ,  Jared M. Kole ,  Sawyer I. Cohen ,  Shayan Malek

IPC: H05K7/00

CPC classification number: H05K3/341 ,  H05K3/0052 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/1034 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.

Abstract translation: 组件可以使用焊料安装到印刷电路基板上。 分离的支撑片可以可拆卸地连接到部件，并且可以有助于防止在回流操作期间部件移动或翻倒。 部件和分离支撑片可以由金属片形成。 将组件连接到分离支撑片的接口可以是穿孔的或半剪切的，以允许分离支撑片在回流操作之后容易地与部件分离。 分离式支撑片可以在回流操作期间通过将分离支撑片机械地联接到固定装置或通过将分离的支撑片安装到印刷电路板的面板的未使用部分来固定到位。 分离的支撑片可以机械耦合在印刷电路基板上的两个部件之间，并且可以用于在回流操作期间保持部件之间的距离。