公开(公告)号：US3818415A

公开(公告)日：1974-06-18

申请号：US33324273

申请日：1973-02-16

Applicant: AMP INC

Inventor： EVANS W ,  ZIMMERMAN R

IPC: H01R43/01 ,  H01R4/24 ,  H05K1/18 ,  H05K3/00 ,  H05K3/24 ,  H05K3/32 ,  H05K3/40 ,  H01R9/08 ,  H01R3/00

CPC classification number: H01R4/2412 ,  H01R4/2491 ,  H05K1/182 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/241 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10727

Abstract: An electrical connection with a conductor having an extremely thin film type insulating covering thereon is formed by providing a terminal having a contact surface to which there is adhered fine particles of grit which are covered by a thin coating of a soft metal. The connection is made by sliding the conductor relatively over the terminal so that the film is scored and the metallic conductor is exposed. Contact between the terminal and the conductor is established through the soft metal which occupies the space between the conductor and the terminal surface.

Abstract translation: 通过提供具有接触表面的端子来形成与其上具有极薄膜型绝缘覆盖层的导体的电连接，所述接触表面附着有由软金属的薄涂层覆盖的细粒颗粒。 通过使导体相对地在端子上滑动来进行连接，使得薄膜被刻痕并且金属导体暴露。 端子与导体之间的接触通过占用导体与端子表面之间的空隙的软金属构成。

公开(公告)号：US3501831A

公开(公告)日：1970-03-24

申请号：US3501831D

申请日：1968-06-17

Applicant: ROGERS CORP

Inventor： GORDON HERMAN B

IPC: H01R12/51 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4092 ,  H05K1/118 ,  H05K3/002 ,  H05K3/005 ,  H05K3/306 ,  H05K3/326 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2203/0195 ,  H05K2203/0221 ,  Y10T29/49167

公开(公告)号：US3346950A

公开(公告)日：1967-10-17

申请号：US46446765

申请日：1965-06-16

Applicant: IBM

Inventor： SCHICK HENRY C

IPC: H01L21/48 ,  H01L23/538 ,  H01R4/06 ,  H01R12/00 ,  H05K1/00 ,  H05K3/40 ,  H05K3/42

CPC classification number: H01L21/4846 ,  H01L23/5384 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/0393 ,  H05K3/4084 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/091 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/0195 ,  H05K2203/0221 ,  H05K2203/1189 ,  Y10T29/49167 ,  H01L2924/00

公开(公告)号：US3213404A

公开(公告)日：1965-10-19

申请号：US12849761

申请日：1961-08-01

Applicant: THOMAS & BETTS CORP

Inventor： LARS HEDSTROM

IPC: H01R12/67 ,  H05K1/11 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32

CPC classification number: H01R12/67 ,  H05K1/118 ,  H05K3/281 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/055 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/1189

公开(公告)号：US3037265A

公开(公告)日：1962-06-05

申请号：US70589057

申请日：1957-12-30

Applicant: IBM

Inventor： XAVIER KOLLMEIER

IPC: H05K3/00 ,  H05K3/04 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/041 ,  H05K3/005 ,  H05K3/3447 ,  H05K3/4084 ,  H05K2201/0355 ,  H05K2201/091 ,  H05K2201/09827 ,  H05K2203/0195 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10T29/4916 ,  Y10T29/49167 ,  Y10T29/49833

公开(公告)号：US2912745A

公开(公告)日：1959-11-17

申请号：US53058455

申请日：1955-08-25

Applicant: ERIE RESISTOR CORP

Inventor： STEIGERWALT OLIVER I ,  OSHRY HOWARD I

IPC: H05K3/00 ,  H05K3/04 ,  H05K3/40

CPC classification number: H05K3/4084 ,  H05K3/005 ,  H05K3/041 ,  H05K3/045 ,  H05K2201/0355 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/4916 ,  Y10T29/49165

公开(公告)号：US12038666B2

公开(公告)日：2024-07-16

申请号：US17245040

申请日：2021-04-30

Applicant: E Ink Corporation

Inventor： Matthew Joseph Kayal ,  Steven Joseph Battista ,  Richard J. Paolini, Jr. ,  Shyamala A. Subramanian

IPC: G02F1/167 ,  B29D11/00 ,  C09D11/52 ,  G02F1/1343 ,  G02F1/153 ,  G02F1/155 ,  G02F1/1675 ,  H05K1/02 ,  H05K3/40 ,  B32B37/12 ,  B32B38/00 ,  B32B38/04 ,  G02F1/1333 ,  H05K1/09 ,  H05K3/32

CPC classification number: G02F1/167 ,  B29D11/0073 ,  C09D11/52 ,  G02F1/13439 ,  G02F1/1533 ,  G02F1/155 ,  G02F1/1675 ,  H05K1/0274 ,  H05K3/4084 ,  B32B37/12 ,  B32B38/0004 ,  B32B38/04 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2310/0843 ,  B32B2457/20 ,  G02F1/133377 ,  G02F2201/42 ,  G02F2202/16 ,  G02F2202/28 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4053 ,  H05K2201/0108 ,  H05K2201/091 ,  H05K2203/0455 ,  H05K2203/063

Abstract: An electrical connection between the backplane and the light-transmissive front electrode of an electrowetting device is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.

公开(公告)号：US11665830B2

公开(公告)日：2023-05-30

申请号：US15635803

申请日：2017-06-28

Applicant: Honda Motor Co., Ltd.

Inventor： Zainab I. Ali ,  Patricia A. Scott

IPC: B60Q3/54 ,  H05K3/12 ,  B60N2/00 ,  B60Q3/80 ,  B60R16/02 ,  H05K1/02 ,  H05K3/32 ,  H05K1/16 ,  B60N2/58 ,  B60Q3/74 ,  H05K1/03 ,  H05K3/46 ,  B60Q3/283 ,  B60Q3/14 ,  B60Q3/233

CPC classification number: H05K3/1283 ,  B60N2/002 ,  B60N2/5891 ,  B60Q3/14 ,  B60Q3/233 ,  B60Q3/283 ,  B60Q3/54 ,  B60Q3/745 ,  B60Q3/80 ,  B60R16/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/32 ,  H05K3/4664 ,  H05K1/038 ,  H05K3/125 ,  H05K3/1216 ,  H05K2201/091 ,  H05K2201/0999

Abstract: A method of producing a functional vehicle component includes fixing a leather sheet over a surface of a vehicle component, applying a flexible electronic circuit to an A-surface of the leather sheet, and arranging a pigmented coating over the circuit. The pigmented coating inhibits or prevents the circuit from being visible through the pigmented coating. The method may include attaching an electronic element, such as a light source, a sensor, a wireless transmitter, or a switch, to the circuit. When the circuit includes a light source, the pigmented coating inhibits or prevents the light source from being visible through the pigmented coating, but light emitted by the light source is visible through the pigmented coating.

公开(公告)号：US20190248970A1

公开(公告)日：2019-08-15

申请号：US15895659

申请日：2018-02-13

Applicant: International Business Machines Corporation

Inventor： JOSEPH KUCZYNSKI ,  JASON T. WERTZ ,  BRUCE J. CHAMBERLIN ,  SARAH K. CZAPLEWSKI-CAMPBELL ,  JING ZHANG

IPC: C08J5/18 ,  B29C39/00 ,  B29C45/14 ,  B26F1/02 ,  B26F1/16 ,  B26F1/31 ,  H05K1/02

CPC classification number: C08J5/18 ,  B26F1/02 ,  B26F1/16 ,  B26F1/31 ,  B29C39/003 ,  B29C45/14819 ,  B29K2039/00 ,  C08J2379/04 ,  H05K1/024 ,  H05K1/0298 ,  H05K2201/0175 ,  H05K2201/091

Abstract: According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

公开(公告)号：US20190104622A1

公开(公告)日：2019-04-04

申请号：US15723245

申请日：2017-10-03

Applicant: Delphi Technologies, Inc.

Inventor： Naiki A. Reynoso Galvan ,  Rodrigo Villanueva Ponce ,  Christopher Alan Brandon

IPC: H05K5/00 ,  H01R12/58 ,  H01R43/20 ,  H05K1/11 ,  H05K1/18 ,  B60R16/03

CPC classification number: H05K5/0069 ,  B60R16/0238 ,  B60R16/03 ,  H01R12/58 ,  H01R43/205 ,  H02G3/086 ,  H05K1/0278 ,  H05K1/11 ,  H05K1/147 ,  H05K1/18 ,  H05K3/361 ,  H05K2201/091 ,  H05K2201/10181 ,  H05K2201/10189

Abstract: An electrical center for distributing electrical power to an electrical system of a vehicle and a method of manufacture the same is described herein. The electrical center includes a printed circuit board structure having a first printed circuit board (PCB) section angularly arranged with respect to a second PCB section. The printed circuit board structure includes a flexible connection element integrally formed with the first and second PCB sections forming a printed circuit extending from the first to second PCB section. The electrical center also includes a first plurality of electrical terminals extending perpendicularly from a first major surface of the first PCB section and a second plurality of electrical terminals extending perpendicularly from a second major surface of the second PCB section. The first major surface is angularly arranged at about a ninety degree angle relative to the second major surface.