公开(公告)号：US07405155B2

公开(公告)日：2008-07-29

申请号：US11334172

申请日：2006-01-18

Applicant: Xiaowei Yao ,  Tam Nguyen ,  Marc Finot ,  Rickie C. Lake ,  Jeffrey A. Bennett ,  Robert Kohler

Inventor： Xiaowei Yao ,  Tam Nguyen ,  Marc Finot ,  Rickie C. Lake ,  Jeffrey A. Bennett ,  Robert Kohler

IPC: H01L21/44 ,  C25D5/00

CPC classification number: H01L23/498 ,  C25D5/02 ,  H01L21/4846 ,  H01L23/10 ,  H01L23/15 ,  H01L23/36 ,  H01L23/3731 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/241 ,  H05K3/243 ,  H05K2201/09354 ,  H01L2924/00

Abstract: A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

Abstract translation: 电路封装包括具有开口的基板和适于有效散发热量的单个整体式散热器，其位于开口中以暴露与基板的顶表面和底表面共面的顶表面和底表面。 选择性电镀包括将第一和第二金属图案施加到基板表面，产生第一金属图案和金属源之间的电位差，并且通过将第一金属类型吸引到第一金属图案的电压电位来镀覆第一金属图案 。 第一金属图案的电压电位小于金属源的电压电位。

公开(公告)号：US20080173476A1

公开(公告)日：2008-07-24

申请号：US11825169

申请日：2007-07-05

Applicant: Martin A. Cotton

Inventor： Martin A. Cotton

IPC: H05K9/00

CPC classification number: H05K1/0218 ,  H01L23/552 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K1/0221 ,  H05K1/115 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/4652 ,  H05K2201/09036 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09854 ,  H05K2201/09981 ,  H01L2224/0401

Abstract: Construction of printed circuit boards (PCBs) containing electromagnetic shielding and conductive tubes forming signal lines and/or waveguides. The method of construction calls for forming of grooves through layers of the PCB and coating the interior surfaces of these grooves with conductive material. These conductor-coated groove walls serve as conductive surfaces between embedded conductive surfaces on different layers. The conductive surfaces thus joined form a continuous electrically conductive surface that can be configured to act as an electromagnetic shield. Such conductive surfaces may be configured with internal conductors to act as a signal line, or without internal conductors to act as a waveguide.

Abstract translation: 构造包含电磁屏蔽和形成信号线和/或波导的导电管的印刷电路板（PCB）。 施工方法要求通过PCB的层形成凹槽，并用导电材料涂覆这些凹槽的内表面。 这些导体涂覆的槽壁用作不同层上的嵌入的导电表面之间的导电表面。 这样连接的导电表面形成连续的导电表面，该表面可配置为充当电磁屏蔽。 这样的导电表面可以配置有内部导体以用作信号线，或者不具有用作波导的内部导体。

公开(公告)号：US20080158766A1

公开(公告)日：2008-07-03

申请号：US11896574

申请日：2007-09-04

Applicant: Takashi Oyama

Inventor： Takashi Oyama

IPC: H05F3/00

CPC classification number: H05K1/0259 ,  H05K1/026 ,  H05K2201/09354 ,  H05K2201/10689

Abstract: A circuit board, including a static electricity protection conductor formed around a protection target to be protected from static electricity, the static electricity protection conductor having one or more projections and being grounded at one or more points.

Abstract translation: 一种电路板，包括形成在保护目标周围以防止静电的静电保护导体，所述静电保护导体具有一个或多个突起并且在一个或多个点处接地。

公开(公告)号：US20080112136A1

公开(公告)日：2008-05-15

申请号：US12013228

申请日：2008-01-11

Applicant: Yu-Liang Lin ,  Yu-Lung Dung ,  Yueh-Lung Huang ,  Chen-Lin Huang

Inventor： Yu-Liang Lin ,  Yu-Lung Dung ,  Yueh-Lung Huang ,  Chen-Lin Huang

IPC: H05K7/20

CPC classification number: H05K1/0272 ,  F04B15/08 ,  F04D25/0633 ,  F04D25/068 ,  F04D29/5813 ,  F04D29/5853 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09354 ,  H05K2201/09781 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A circuit board adapted to a fan comprises a circuit region and a heat-dissipative film. The circuit region is provided on a first surface of the circuit board and comprises at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the first surface and is in contact with the heat-generating component. A plurality of openings through the heat-dissipative film, a protrusion of the circuit board, a cutout in the protrusion to expose the heat-generating component to airflow, etc., have been disclosed and claimed for enhancing the efficiency in heat dissipation. A heat sink may also be provided on a second surface opposite to the first surface of the circuit board. The heat sink is connected to the heat-dissipative film to help dissipate the heat generated by the operation of the fan.

Abstract translation: 适于风扇的电路板包括电路区域和散热膜。 电路区域设置在电路板的第一表面上，并且在其上包括至少一个发热部件。 散热膜涂覆在第一表面的边缘部分上并与发热部件接触。 为了提高散热效率，已经公开并要求了通过散热膜的多个开口，电路板的突起，突起中的切口以将发热部件暴露于气流等。 也可以在与电路板的第一表面相对的第二表面上设置散热器。 散热器连接到散热片，以帮助消散风扇运行产生的热量。

公开(公告)号：US20080068313A1

公开(公告)日：2008-03-20

申请号：US11853309

申请日：2007-09-11

Applicant: Hyun-Min JANG

Inventor： Hyun-Min JANG

IPC: G09G3/36

CPC classification number: G02F1/13452 ,  G02F1/133608 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/118 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/09354 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09681 ,  H05K2201/10136

Abstract: A display device includes a display panel provided with an electrode pad, a light source to emit light to the display panel, a mold frame to support the light source; a bottom chassis to accommodate the mold frame, a driving part to apply a driving signal to the display panel connected to the electrode pad, and a driving circuit part that controls the driving part. The driving circuit part includes a first driving circuit board connected to the driving part and on which circuit components are mounted toward the mold frame, and a second driving circuit board connected to the first driving circuit board. The display device further includes a flexible circuit board to connect the first driving circuit board and the second driving circuit board.

Abstract translation: 显示装置包括：显示面板，设置有电极焊盘，向显示面板发光的光源;支撑光源的模架; 用于容纳模具框架的底部底盘，用于将驱动信号施加到连接到电极垫的显示面板的驱动部件，以及控制驱动部件的驱动电路部件。 驱动电路部分包括连接到驱动部分的第一驱动电路板，并且电路部件被安装到模架上，以及连接到第一驱动电路板的第二驱动电路板。 显示装置还包括用于连接第一驱动电路板和第二驱动电路板的柔性电路板。

公开(公告)号：US20080029298A1

公开(公告)日：2008-02-07

申请号：US11462875

申请日：2006-08-07

Applicant: Roger Allen Booth ,  Matthew Stephen Doyle

Inventor： Roger Allen Booth ,  Matthew Stephen Doyle

IPC: H05K9/00

CPC classification number: H05K1/0218 ,  H05K1/0224 ,  H05K1/0253 ,  H05K3/061 ,  H05K3/3452 ,  H05K2201/09354 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2203/0542 ,  H05K2203/0571

Abstract: A method and structures with an EMI shielding electrically conductive coating are provided for implementing EMI shielding for rigid cards and flexible circuits. An EMI shielding electrically conductive coating is deposited on an outer layer, for example, using a vacuum sputtering deposition, chemical vapor deposition (CVD) or physical vapor deposition (PVD) process. A solder mask is applied. Mechanically cleaning removes the sputtered copper coating in areas of the outer layer that are not protected by the solder mask.

Abstract translation: 提供了具有EMI屏蔽导电涂层的方法和结构，用于实现刚性卡和柔性电路的EMI屏蔽。 EMI屏蔽导电涂层沉积在外层上，例如使用真空溅射沉积，化学气相沉积（CVD）或物理气相沉积（PVD）工艺。 使用焊接掩模。 机械清洁将外部层的不被焊接掩模保护的区域中的溅射铜涂层除去。

公开(公告)号：US20070089788A1

公开(公告)日：2007-04-26

申请号：US11482542

申请日：2006-07-07

Applicant: Robert Chinnock ,  Clifford Miller ,  Charles Meacham

Inventor： Robert Chinnock ,  Clifford Miller ,  Charles Meacham

IPC: G05D7/06

CPC classification number: G01F1/363 ,  G05D7/0635 ,  H05K1/0218 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09354 ,  Y10T137/7759 ,  Y10T137/7761 ,  Y10T137/7895

Abstract: A flow controller including a unitary controller body with a chemically inert fluid conduit having an insertable constriction or orifice disposed within the conduit having a reduced cross-sectional area to thereby restrict the flow of fluid within the conduit allowing for reliable flow measurement. An integrated circuit or controller may be coupled to the control valve and also coupled to the pressure sensors by a lead structure including signal conductors surrounded by a Faraday cage, and a chemically inert housing coupled to the unitary controller body enclosing the control valve and the pressure sensors.

Abstract translation: 流量控制器包括具有化学惰性流体导管的整体控制器主体，其具有设置在导管内的可插入的收缩部或孔口，其具有减小的横截面积，从而限制管道内的流体流动，从而可靠地进行流量测量。 集成电路或控制器可以耦合到控制阀并且还通过包括由法拉第笼围绕的信号导体的引线结构耦合到压力传感器，以及耦合到包围控制阀的单一控制器主体和压力的化学惰性壳体 传感器。

公开(公告)号：US07088591B2

公开(公告)日：2006-08-08

申请号：US10695463

申请日：2003-10-28

Applicant: Tadao Kishimoto ,  Yutaka Igarashi ,  Hironobu Hirayama

Inventor： Tadao Kishimoto ,  Yutaka Igarashi ,  Hironobu Hirayama

IPC: H05K7/06 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/116 ,  H05K3/325 ,  H05K3/429 ,  H05K7/142 ,  H05K9/0039 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/10446 ,  Y10T29/49155

Abstract: There is described a multi-layer printed circuit board and a method of installing it. The circuit board includes a first signal layer formed on its obverse surface; a ground layer arranged at a position next to the first signal layer; an electronic power source layer arranged at a position next to the ground layer; and a second signal layer formed on its reverse surface. The first and second patterns are formed around peripheral areas of the first and second signal layers, respectively. The first ground pattern and the second ground pattern are electrically coupled to each other by plural through holes, and the multi-layer printed circuit board is installed on an electro-conductive housing in such a manner that a substantially whole area of the second ground pattern electrically contacts a mounting area of the electro-conductive housing, the mounting area being an electro-conductive area continuously coupled to the electro-conductive housing.

Abstract translation: 描述了一种多层印刷电路板及其安装方法。 电路板包括在其正面上形成的第一信号层; 布置在与所述第一信号层相邻的位置处的接地层; 布置在接地层旁边的位置处的电子电源层; 以及形成在其反面上的第二信号层。 第一和第二图案分别形成在第一和第二信号层的周边区域周围。 第一接地图案​​和第二接地图案通过多个通孔彼此电耦合，并且多层印刷电路板以这样的方式安装在导电外壳上，使得第二接地图案的大致整个区域 电接触导电壳体的安装区域，该安装区域是连续耦合到导电壳体的导电区域。

公开(公告)号：US07087845B2

公开(公告)日：2006-08-08

申请号：US10508538

申请日：2004-01-28

Applicant: Hiroshi Tohkairin ,  Kenji Sakakibara ,  Hideki Kabune

Inventor： Hiroshi Tohkairin ,  Kenji Sakakibara ,  Hideki Kabune

IPC: H05K1/00

CPC classification number: H05K1/0207 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/10689 ,  H01L2924/00

Abstract: The present invention is characterized in that in a metal-core multilayer printed wiring board (1) which is obtained by forming one or more of at least inner layers of a laminate having a insulating layer and a conductor layer stacked alternately from a metal plate and has the metal plate as a core, the metal plate (13) is disposed below a site on which a heating element (10) is to be mounted, a surface layer over which the heating element (10) is to be mounted is connected to the metal plate (13) of the inner layer via a BVH (12) and a heat radiation layer (14) is formed over the surface layer. The present invention makes it possible to efficiently radiate heat, which has been released from the heating element, to the outside of the printed wiring board without impairing the packaging density of circuits and at the same time, to mount another element on the side opposite to the side on which the heating element exists.

Abstract translation: 本发明的特征在于，在金属芯多层印刷电路板（1）中，所述金属芯多层印刷电路板（1）通过形成由金属板交替堆叠的具有绝缘层和导体层的层叠体的至少内层中的一个或多个而获得， 将金属板作为芯，将金属板（13）设置在要安装加热元件（10）的位置的下方，将要安装加热元件（10）的表面层连接到 通过BVH（12）和散热层（14）在内层的金属板（13）上形成。 本发明使得可以有效地将已经从加热元件释放的热量辐射到印刷电路板的外部，而不会损害电路的封装密度，同时在另一个元件的相反侧安装另一个元件 加热元件所在的一侧。

公开(公告)号：US20060152869A1

公开(公告)日：2006-07-13

申请号：US11163574

申请日：2005-10-24

Applicant: Chih-Chiang Su ,  Chieh-Chih Liu ,  Wei-Chih Liu

Inventor： Chih-Chiang Su ,  Chieh-Chih Liu ,  Wei-Chih Liu

IPC: H02H9/00

CPC classification number: H05K3/0052 ,  H05K1/0259 ,  H05K1/18 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10446 ,  H05K2203/175

Abstract: A printed circuit board capable of resisting electrostatic discharge and a routing method of the one or multi-layer printed circuit board are disclosed. The routing method includes planning a first routing area, planning a second routing area apart from the first routing area for a predetermined distance at least, and connecting an attenuating component between the first routing area and the second routing area for attenuating an impulse generated by electrostatic discharge in order to prevent the impulse spreading to the second routing area from the first routing area.

Abstract translation: 公开了能够抵抗静电放电的印刷电路板和一层或多层印刷电路板的布线方法。 路由方法包括规划第一路由区域，至少规划距离第一路由区域第二路由区域预定距离，以及在第一路由区域和第二路由区域之间连接衰减分量，以衰减由静电产生的脉冲 放电，以防止从第一路由区域到第二路由区域的脉冲扩展。