公开(公告)号：US20240234443A1

公开(公告)日：2024-07-11

申请号：US18618181

申请日：2024-03-27

Applicant: Samsung Display Co., LTD.

Inventor： Dae Geun LEE

IPC: H01L27/12 ,  G02F1/1345 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18 ,  H10K59/131

CPC classification number: H01L27/124 ,  G02F1/13458 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H05K1/111 ,  H01L2224/05552 ,  H01L2224/06152 ,  H01L2224/81132 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2203/166 ,  H10K59/131 ,  Y02P70/50 ,  Y10T29/49005

Abstract: An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

公开(公告)号：US11818839B2

公开(公告)日：2023-11-14

申请号：US17124383

申请日：2020-12-16

Applicant: Samsung Display Co., Ltd.

Inventor： Yun-mo Chung ,  Tak-young Lee ,  Joosun Yoon

IPC: H05K1/11 ,  H05K5/00 ,  H10K59/131

CPC classification number: H05K1/111 ,  H05K5/0017 ,  H10K59/131 ,  H01L2224/49171 ,  H05K2201/094 ,  H05K2201/09418

Abstract: A display panel includes: a display substrate having a display area, and a pad area disposed on at least one side of thereof; and a plurality of pad groups arranged on the pad area in a first direction and including: a first pad group having a plurality of first pads, at least some of the plurality of first pads have a first inclination with respect to a reference line extending in a second direction different from the first direction, and the plurality of first pads being spaced from each other at a first pitch; and a second pad group having a plurality of second pads, at least some of the plurality of second pads having a different second inclination with respect to the reference line, and the plurality of second pads being spaced from each other at a second pitch different from the first pitch.

公开(公告)号：US11800642B2

公开(公告)日：2023-10-24

申请号：US17108925

申请日：2020-12-01

Applicant: TPK Advanced Solutions Inc.

Inventor： Xian-Bin Xu ,  He Luo ,  Ming-Qiang Fu ,  Xiong-Min Zhang ,  Chen-Hsin Chang

IPC: H05K1/11 ,  H05K3/36

CPC classification number: H05K1/118 ,  H05K1/111 ,  H05K3/361 ,  H05K2201/09418

Abstract: A bonding pad structure includes a substrate, a flexible printed circuit board, and a plurality of bonding pins. The bonding pins include at least one central bonding pin and at least two first bonding pins. The at least one central bonding pin is located at a center of bonding pins. The at least two first bonding pins are located farthest away from the at least one central bonding pin and have mirror symmetry with respect to the at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. A first width A of the first end and a second width B of the second end satisfy 0

公开(公告)号：US20180317314A1

公开(公告)日：2018-11-01

申请号：US15770114

申请日：2016-10-24

Applicant: Universität des Saarlandes

Inventor： Simon Olberding ,  Jürgen Steimle

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  G06T19/00 ,  G06F3/044

CPC classification number: H05K1/028 ,  G06F3/044 ,  G06F3/0488 ,  G06F2203/0339 ,  G06F2203/04102 ,  G06T19/00 ,  G06T2219/021 ,  G09F9/301 ,  H03K17/962 ,  H05K1/0326 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/162 ,  H05K3/0005 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10053 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: The invention is directed to an object (2) with a three-dimensional shape made of a folded sheet (4) so as to form at least one face (6), at least one corner (10) and/or at least one edge (8), the object comprising electrically conductive traces (14) printed on the sheet (4); and at least one functional area (12) printed on one of the at least one face (6), adjacent to one of the at least one edge (8), or adjacent to one of the at least one corner (10), the at least one functional area (12) being electrically connected to the conductive traces (14) and forming at least one control for a touch input, for a display output, and/or for sensing a change of shape of the object.

公开(公告)号：US20180249574A1

公开(公告)日：2018-08-30

申请号：US15942913

申请日：2018-04-02

Applicant: LG DISPLAY CO., LTD.

Inventor： Ducksu OH ,  Sung Soo PARK ,  Minsoo KANG

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：US20180182781A1

公开(公告)日：2018-06-28

申请号：US15901846

申请日：2018-02-21

Applicant: Samsung Display Co., Ltd.

Inventor： Dae Geun Lee

IPC: H01L27/12 ,  H01L23/00 ,  G02F1/1345 ,  H01L27/32

CPC classification number: H01L27/124 ,  G02F1/13458 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H01L27/3276 ,  H01L2224/05552 ,  H01L2224/06152 ,  H01L2224/81132 ,  H01L2924/3511 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49005

Abstract: An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

公开(公告)号：US09974164B2

公开(公告)日：2018-05-15

申请号：US14904551

申请日：2014-07-24

Applicant: LG Display Co., Ltd.

Inventor： Ducksu Oh ,  Sung Soo Park ,  Minsoo Kang

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02 ,  H05K7/00 ,  H05K1/14 ,  H01L27/32 ,  H05K3/36 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：US20180014405A1

公开(公告)日：2018-01-11

申请号：US15641686

申请日：2017-07-05

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： BYOUNG YONG KIM ,  Jeong Ho HWANG ,  Jong Hyuk LEE

IPC: H05K1/11 ,  H01L23/00 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L24/06 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/06135 ,  H01L2224/06153 ,  H01L2224/06155 ,  H01L2224/06177 ,  H01L2224/16227 ,  H01L2224/29499 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81194 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10128 ,  Y02P70/611

Abstract: A display device includes a display substrate including a display area where an image is displayed and a pad area disposed at a periphery of the display area, and a first pad portion disposed in the pad area, the first pad portion including a plurality of first line pad terminals arranged along a first curved line in a first direction.

公开(公告)号：US20170280569A1

公开(公告)日：2017-09-28

申请号：US15082682

申请日：2016-03-28

Applicant: ALCATEL-LUCENT CANADA INC.

Inventor： James M. SCHRIEL ,  Alex L. CHAN ,  Paul J. BROWN

IPC: H05K3/34 ,  G06F17/50 ,  H05K3/00 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K3/3436 ,  G06F17/5072 ,  G06F2217/38 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0005 ,  H05K3/225 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/09809 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/0445 ,  H05K2203/176 ,  Y02P70/611 ,  Y02P70/613

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a surface mount component including: a plurality of metal pads on the surface of one side of the PCB corresponding to connection points on the component, wherein at least a portion of the plurality of metal pads have stubs which extend outside the boundary of the surface mount component when the surface mount component is mounted to the PCB; and wherein the stubs have sufficient thermal conductivity to facilitate at least one of the set of dismounting and reattaching of the surface mount component.

公开(公告)号：US09693450B2

公开(公告)日：2017-06-27

申请号：US14944051

申请日：2015-11-17

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroyuki Miyake ,  Yusuke Murai ,  Kiyoshi Sekiguchi

IPC: H05K1/11 ,  H05K1/02 ,  H01L23/498 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/112 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09227 ,  H05K2201/09418 ,  H01L2924/00

Abstract: A printed wiring board includes conductive layers laminated with insulator layers interposed. A land group including a plurality of lands arranged with intervals between each other, is formed in a rectangular region on a surface layer, among the plurality of conductive layers, when viewed in a direction perpendicular to the surface layer. The land group is arrayed in a triangular lattice manner. The land group is arranged so that a smallest angle, among angles formed between one side of the rectangular region and respective three sides of the triangular lattice, is 7° or more and 23° or less.