公开(公告)号：US08908383B1

公开(公告)日：2014-12-09

申请号：US13476923

申请日：2012-05-21

Applicant: Tarak A. Railkar ,  Paul D. Bantz

Inventor： Tarak A. Railkar ,  Paul D. Bantz

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0206 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2201/10098

Abstract: Embodiments of the present disclosure describe apparatuses, methods, and systems of thermal via structures with surface features. In some embodiments the surface features may have dimensions greater than approximately one micron. The thermal via structures may be incorporated into a substrate of an integrated circuit device. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了具有表面特征的热通孔结构的装置，方法和系统。 在一些实施例中，表面特征可具有大于约1微米的尺寸。 热通孔结构可以结合到集成电路器件的衬底中。 可以描述和/或要求保护其他实施例。

公开(公告)号：US08901432B2

公开(公告)日：2014-12-02

申请号：US13250503

申请日：2011-09-30

Applicant: Matthew Clark ,  Craig A. Galbrecht ,  George Goblish ,  Myles Koshiol

Inventor： Matthew Clark ,  Craig A. Galbrecht ,  George Goblish ,  Myles Koshiol

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0271 ,  H05K2201/068 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09854 ,  Y10T29/49124

Abstract: An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.

Abstract translation: 一种设备包括电路板材料片，位于电路板材料片上的至少一个导电迹线以及位于电路板材料片上的至少一个导电接触焊盘，并与至少一个导电 跟踪。 该设备还包括至少一个变形点，其被配置为当电路板材料片经受抵抗由连接到抵抗物体的膨胀或压缩引起的膨胀或压缩的阻力时，吸收在电路板材料片材中产生的应力。

公开(公告)号：US20140345124A1

公开(公告)日：2014-11-27

申请号：US14283989

申请日：2014-05-21

Applicant: Patrik PATZNER ,  Carsten KASCHUBE ,  Christoph GMELIN ,  Andreas OTTO ,  Markus REINHARD ,  Ronny WOLF

Inventor： Patrik PATZNER ,  Carsten KASCHUBE ,  Christoph GMELIN ,  Andreas OTTO ,  Markus REINHARD ,  Ronny WOLF

IPC: H05K3/30

CPC classification number: H05K3/325 ,  H05K1/115 ,  H05K3/308 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10878 ,  H05K2203/0285 ,  Y10T29/49139

Abstract: A method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards include: providing a circuit board having a thickness, at least one electrical conductor path, and a contacting opening guided perpendicularly through the circuit board and having a metallized inner wall; providing an electrically conductive press-fit pin having a longitudinal axis and having a press-fit region suitable for press-fitting into the contacting opening and having a substantially round cross section; and press-fitting the press-fit pin into the contacting opening by applying onto the press-fit pin a force acting along the longitudinal axis of the press-fit pin, press-fitting being assisted by the application of ultrasound acting on the press-fit pin.

Abstract translation: 一种用于电路板中的导电压配合销的无焊接电压配合接触的方法包括：提供具有厚度，至少一个电导体路径和垂直于电路板引导的接触开口的电路板，并且具有金属化 内墙; 提供具有纵向轴线并具有适于压配合到所述接触开口中并且具有基本圆形横截面的压配合区域的导电压配合销; 并且通过在压配合销上施加沿着压配合销的纵向轴线的力，将压配合销压入接触开口中，通过施加超声波作用在压配合销上， 适合针。

公开(公告)号：US20140208590A1

公开(公告)日：2014-07-31

申请号：US13754799

申请日：2013-01-30

Applicant: NVIDIA CORPORATION

Inventor： Leilei Zhang ,  Ronilo V. Boja ,  Abraham Fong Yee ,  Zuhair Bokharey

IPC: H05K3/00

CPC classification number: H05K3/0094 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/42 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49165

Abstract: A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.

Abstract translation: 公开了一种用于制造在厚衬底中形成的具有高密度微孔的印刷电路板的方法。 该方法包括以下步骤：使用激光钻孔技术在厚基底中形成一个或多个孔，用导电材料电镀一个或多个孔，其中导电材料不完全填充一个或多个孔，并填充一个 或更多的电镀孔与非导电材料。

公开(公告)号：US20140198469A1

公开(公告)日：2014-07-17

申请号：US14138673

申请日：2013-12-23

Applicant: Hiroyuki BASHO ,  Katsuhiko MAEDA ,  Masashi SUZUKI ,  Yuugo MATSUURA

Inventor： Hiroyuki BASHO ,  Katsuhiko MAEDA ,  Masashi SUZUKI ,  Yuugo MATSUURA

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K3/3447 ,  B41J2/473 ,  H05K3/308 ,  H05K2201/09072 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10757 ,  H05K2203/0195 ,  Y10T29/49142

Abstract: An electronic circuit having an electronic component mounted on a substrate, a light source device having the electronic circuit, and a method of manufacturing the electronic circuit on which the electronic component is mounted on the substrate are described. The electronic component has a plurality of lead pins to be electrically connected to wirings on the substrate. The substrate is formed with a hole having a larger dimension than a maximum distance between at least two lead pins of the lead pins. The lead pins are inserted into the hole from sides of tips of the lead pins while being bent at a plurality of bending portions, and fixed to the substrate by a solder.

Abstract translation: 具有安装在基板上的电子部件的电子电路，具有该电子电路的光源装置以及将电子部件安装在基板上的电子电路的制造方法。 电子部件具有多个引脚以与基板上的布线电连接。 衬底形成有具有比引脚引脚的至少两个引脚之间的最大距离更大的尺寸的孔。 引脚在多个弯曲部分弯曲的同时从引脚的尖端的侧面插入孔中，并通过焊料固定到基板。

公开(公告)号：US20140190728A1

公开(公告)日：2014-07-10

申请号：US13831291

申请日：2013-03-14

Applicant: ECOCERA OPTRONICS CO., LTD.

Inventor： Cheng-Feng Chou ,  Hung-Pin Lee ,  Tzu-Yuan Lin

IPC: H05K3/00 ,  H05K3/42 ,  H05K1/05 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K3/0029 ,  H05K1/0306 ,  H05K3/002 ,  H05K3/42 ,  H05K2201/09854

Abstract: The invention provides a method for manufacturing a circuit board comprising the steps of: (a) forming a through hole in a substrate; (b) providing a photo resist to cover a predetermined area adjacent to the through hole on a first surface and a second surface opposite to the first surface of the substrate; and (c) performing an etching process to make the through hole has a shape of dumbbell.

Abstract translation: 本发明提供一种制造电路板的方法，包括以下步骤：（a）在衬底中形成通孔; （b）提供光致抗蚀剂以覆盖与所述基板的第一表面相对的第一表面和第二表面上的与所述通孔相邻的预定区域; 和（c）进行蚀刻处理以使通孔具有哑铃形状。

公开(公告)号：US20140182915A1

公开(公告)日：2014-07-03

申请号：US14060345

申请日：2013-10-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung HAN ,  Young Do KWEON ,  Jin Gu KIM ,  Hyung Jin JEON ,  Yoon Su KIM

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/116 ,  H05K1/113 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/421 ,  H05K2201/0195 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2203/0733

Abstract: The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.

Abstract translation: 本发明涉及一种电路板。 根据本发明实施例的电路板包括：基底; 覆盖基底的层间绝缘层; 通孔结构至少穿过基底衬底的层间绝缘层和层间绝缘层在垂直方向上; 以及在水平方向上设置在层间绝缘层上以围绕通孔结构并由绝缘材料制成的蚀刻停止图案。

公开(公告)号：US20140174793A1

公开(公告)日：2014-06-26

申请号：US14038509

申请日：2013-09-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Gun Oh ,  Ho Sik Park ,  Hwa Sub Oh

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0206 ,  H05K1/0207 ,  H05K1/0243 ,  H05K2201/096 ,  H05K2201/09854 ,  Y10T29/49165

Abstract: Disclosed herein are a printed circuit board and a method for manfuacturing the same, the printed circuit board including: a base substrate having circuit patterns; and heat radiating vias having a donut shape, formed in the base substrate, so that the heat radiation efficiency may be improved by increasing the area of the heat radiating via.

Abstract translation: 这里公开了一种印刷电路板及其制造方法，所述印刷电路板包括：具有电路图形的基底基板; 以及形成在基底基板中的具有环形形状的散热通孔，从而可以通过增加散热通路的面积来提高散热效率。

公开(公告)号：US08692126B2

公开(公告)日：2014-04-08

申请号：US12805710

申请日：2010-08-16

Applicant: Jun Ishii ,  Hirotoshi Iguchi

Inventor： Jun Ishii ,  Hirotoshi Iguchi

IPC: H05K1/03

CPC classification number: H05K3/303 ,  G11B5/484 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126

Abstract: A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer, and a conductive layer formed on the insulating layer. In the metal supporting layer, a reference hole for positioning is formed, and a stepped portion is formed so as to surround the reference hole.

Abstract translation: 布线电路板包括金属支撑层，形成在金属支撑层上的绝缘层和形成在绝缘层上的导电层。 在金属支撑层中，形成用于定位的基准孔，并且形成有围绕基准孔的阶梯部。

公开(公告)号：US20140060908A1

公开(公告)日：2014-03-06

申请号：US14115138

申请日：2012-04-26

Applicant: Chung Sik Park ,  Duk Nam Kim ,  Jae Hyun Ahn

Inventor： Chung Sik Park ,  Duk Nam Kim ,  Jae Hyun Ahn

IPC: H05K3/38 ,  H05K1/02

CPC classification number: H05K3/388 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/48227 ,  H05K1/0201 ,  H05K1/0206 ,  H05K3/4038 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/0369

Abstract: A printed circuit board includes a first insulating layer, a second insulating layer on the first insulating layer, and at least one via formed through the first and second insulating layers in a layered structure. The via includes a first via layer formed through the first insulating layer, a second via layer formed on the first via layer while passing through the second insulating layer, and an adhesive layer between the first and second via layers. The first via layer has a section different from a section of the second via layer. The adhesive property between the copper layer and the insulating layer is improved. The vias used to connect interlayer circuits to each other are formed between a plurality of insulating layers through an etching process instead of a laser process or a polishing process, thereby improving the process ability and reducing the manufacturing cost.

Abstract translation: 印刷电路板包括第一绝缘层，在第一绝缘层上的第二绝缘层，以及至少一个通过第一和第二绝缘层以分层结构形成的通孔。 通孔包括通过第一绝缘层形成的第一通孔层，在穿过第二绝缘层时形成在第一通孔层上的第二通孔层，以及在第一和第二通孔层之间的粘合剂层。 第一通孔层具有与第二通孔层的一部分不同的部分。 铜层与绝缘层之间的粘合性提高。 用于通过蚀刻工艺而不是激光工艺或抛光工艺在多个绝缘层之间形成用于连接层间电路的通孔，从而提高了处理能力并降低了制造成本。