公开(公告)号：US20090107713A1

公开(公告)日：2009-04-30

申请号：US12209629

申请日：2008-09-12

Applicant: Jeff CHINN ,  W. Robert Ashurst ,  Adam Anderson

Inventor： Jeff CHINN ,  W. Robert Ashurst ,  Adam Anderson

IPC: B32B5/00 ,  H05K1/00 ,  H05K1/16

CPC classification number: H05K3/284 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09872 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24388 ,  Y10T428/24405 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/269 ,  Y10T428/2839 ,  H01L2924/00

Abstract: A composite is provided, comprising a substrate and a film on the substrate. The film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.

Abstract translation: 提供了一种复合材料，其包括基底和基底上的薄膜。 膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。

公开(公告)号：US20080212292A1

公开(公告)日：2008-09-04

申请号：US11751775

申请日：2007-05-22

Applicant: Wen-Lung Yu ,  Yu-Tang Liu

Inventor： Wen-Lung Yu ,  Yu-Tang Liu

IPC: H05K1/18

CPC classification number: H05K3/284 ,  H05K7/209 ,  H05K2201/09872 ,  Y10T29/49002

Abstract: An electronic device with a waterproof structure includes a housing structure, a printed circuit board and a protective layer. The housing structure includes a receptacle, a first opening and a second opening. The printed circuit board is disposed within the receptacle and includes plural electronic components and electrical trace patterns thereon. The protective layer is formed on at least a portion of the electronic components and the electrical trace patterns to protect the printed circuit board from moisture attack.

Abstract translation: 具有防水结构的电子设备包括壳体结构，印刷电路板和保护层。 壳体结构包括插座，第一开口和第二开口。 印刷电路板设置在容器内，并且包括多个电子部件和其上的电迹线图案。 保护层形成在电子部件和电迹线图案的至少一部分上，以保护印刷电路板免受水分侵蚀。

公开(公告)号：US20080055878A1

公开(公告)日：2008-03-06

申请号：US11468104

申请日：2006-08-29

Applicant: James F. Salzman

Inventor： James F. Salzman

IPC: H05K9/00

CPC classification number: H05K9/0084 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2203/0191 ,  H05K2203/0582

Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.

Abstract translation: 一种电气设备，包括安装到印刷电路板的表面上的电子部件，所述表面上的接地连接和电磁干扰（EMI）屏蔽。 EMI屏蔽包括涂覆电子部件的电绝缘体，与表面接触的绝缘体和覆盖电绝缘体的导电层，以及接触电绝缘体和接地连接。

公开(公告)号：US5461545A

公开(公告)日：1995-10-24

申请号：US305424

申请日：1994-09-13

Applicant: Michel Leroy ,  Christian Val

Inventor： Michel Leroy ,  Christian Val

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H05K3/28 ,  H05K5/06 ,  H05K1/16

CPC classification number: H05K3/284 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1322

Abstract: According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components and board as a whole are covered with a relatively thick first layer consisting of an organic compound and ensuring a levelling function, followed by a second layer such as an inorganic metal compound, the function of which is to ensure the hermetic sealing of the whole.

Abstract translation: 根据本发明的一个实施例，离散或集成的电子部件被封装在每个封装中，例如塑料电子元件; 然后将包装件安装在印刷电路板上，例如环氧树脂。 组件和板整体上覆盖有由有机化合物组成的相对较厚的第一层和确保平整功能，随后是第二层，例如无机金属化合物，其功能是确保气密性 整个。

公开(公告)号：US5379186A

公开(公告)日：1995-01-03

申请号：US85807

申请日：1993-07-06

Applicant: Glenn E. Gold ,  Anthony B. Suppelsa ,  Anthony J. Suppelsa

Inventor： Glenn E. Gold ,  Anthony B. Suppelsa ,  Anthony J. Suppelsa

IPC: H01L23/31 ,  H01L23/42 ,  H05K1/02 ,  H05K3/28 ,  H05K7/20

CPC classification number: H05K3/284 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/42 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/017 ,  H05K2201/0209 ,  H05K2201/09872 ,  H05K2203/1322

Abstract: An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.

Abstract translation: 一种具有整体散热器的封装的电子部件。 发热电子部件（10）安装在基板载体（12）上，并且密封材料层（16）覆盖该部件。 将一层导热材料（18）施加在密封剂材料上，然后将第二层密封剂材料（20）施加在导热材料上。 由部件产生的热量分布在整个导热材料上，从而消除了部件上的热点，从而导致基本上较低的表面温度。

公开(公告)号：US5377079A

公开(公告)日：1994-12-27

申请号：US188075

申请日：1994-01-27

Applicant: Takeshi Morita ,  Osamu Hayashi

Inventor： Takeshi Morita ,  Osamu Hayashi

IPC: H05K1/18 ,  B29C33/14 ,  B29C45/14 ,  B29C70/68 ,  H05K3/00 ,  H05K3/28 ,  H05K7/14 ,  H05K5/00

CPC classification number: H05K3/284 ,  B29C33/14 ,  B29C45/14639 ,  B29C70/68 ,  H05K3/0014 ,  H05K3/0058 ,  B29C2045/14114 ,  B29C2045/14852 ,  B29K2069/00 ,  B29L2031/3406 ,  B29L2031/3425 ,  B29L2031/3481 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10689 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1327 ,  Y10S428/901 ,  Y10T29/49146 ,  Y10T29/49155

Abstract: An electronic device comprises a housing made of a polycarbonate resin, and a novel double-sided printed circuit board. The printed circuit board has one side embedded in the housing, and the other side exposed to the interior of the housing. A plurality of refractory electronic components are mounted onto one side of the printed circuit board and include a resistor and a capacitor. A plurality of lower refractory electronic components are mounted onto the other side of the housing and include a semiconductor integrated circuit, and a transformer. Preferably, an insulating layer is applied to cover the one side of the printed circuit board and the refractory electronic components. Also, a metal layer is applied to cover the insulating layer and the inner surface of the housing.

Abstract translation: 电子设备包括由聚碳酸酯树脂制成的壳体和新颖的双面印刷电路板。 印刷电路板的一侧嵌入壳体中，另一侧暴露于壳体的内部。 多个难熔电子部件安装在印刷电路板的一侧，并且包括电阻器和电容器。 多个下部难熔电子部件安装在壳体的另一侧，并且包括半导体集成电路和变压器。 优选地，施加绝缘层以覆盖印刷电路板和难熔电子部件的一侧。 此外，施加金属层以覆盖绝缘层和壳体的内表面。

公开(公告)号：US5240746A

公开(公告)日：1993-08-31

申请号：US811873

申请日：1991-12-19

Applicant: Mary O'Connell Litteral

Inventor： Mary O'Connell Litteral

IPC: B05B13/02 ,  B05B5/00 ,  B05C9/12 ,  B05C13/02 ,  B23Q41/04 ,  C23F1/00 ,  C23F1/08 ,  G05B19/418 ,  H05K3/00 ,  H05K3/28 ,  H05K13/00

CPC classification number: H05K3/0091 ,  H05K13/0061 ,  H05K13/0469 ,  H05K3/00 ,  H05K2201/09872 ,  H05K2203/0165 ,  H05K2203/1366 ,  H05K2203/1509 ,  Y10T29/49126 ,  Y10T29/49829 ,  Y10T29/53404

Abstract: Related operations are performed on workpieces, e.g., coating and curing circuit boards, of different types in random order in assembly line fashion on a rotary table of an apparatus under programmed control. The table is rotated stepwise to move successive sections thereof from a load-unload station at which the respective workpieces are loaded and unloaded in random order, to a sensing station at which the type and orientation of the workpiece is sensed, next to an initial work station at which initial work, e.g., coating, is performed on the workpiece in dependence upon its type and orientation previously sensed at the sensing station, then to a subsequent work station at which related subsequent work is performed on the workpiece, e.g., curing of the coating, and in turn back to the load-unload station to complete a cycle. The workpiece is either changed in orientation on the table section for a repeat cycle to perform further work thereon or is replaced by another workpiece in random order.

公开(公告)号：US5109058A

公开(公告)日：1992-04-28

申请号：US739449

申请日：1991-08-02

Applicant: Hiroshige Okinoshima ,  Hideto Kato

Inventor： Hiroshige Okinoshima ,  Hideto Kato

IPC: C08G73/10 ,  C09D179/08 ,  H01B3/30 ,  H01B3/46 ,  H01L23/29 ,  H05K3/28

CPC classification number: C09D179/08 ,  C08G73/106 ,  H01B3/306 ,  H01B3/46 ,  H01L23/293 ,  H05K3/285 ,  H01L2924/0002 ,  H05K2201/09872

Abstract: A solution composition of a polyimide resin type curable resin having imide and alkoxysilyl groups is prepared by reacting a polyimide with a silicon compound in an organic solvent. The solution can be cured through relatively mild heating into coatings having enhanced substrate adherence and solvent resistance and thus suitable as protective coatings on electronic parts.

Abstract translation: 通过在有机溶剂中使聚酰亚胺与硅化合物反应制备具有酰亚胺和烷氧基甲硅烷基的聚酰亚胺树脂型固化性树脂的溶液组合物。 该溶液可以通过相对温和的加热固化成具有增强的基底粘附性和耐溶剂性的涂层，因此适合作为电子部件上的保护涂层。

公开(公告)号：US4741784A

公开(公告)日：1988-05-03

申请号：US893322

申请日：1986-07-25

Applicant: Howard L. Roeser, Jr.

Inventor： Howard L. Roeser, Jr.

IPC: H05K3/28 ,  B08B7/00 ,  C11D7/50 ,  C11D7/52 ,  C23D17/00

CPC classification number: H05K3/288 ,  H05K2201/09872 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K3/28

Abstract: A composition and method for removing conforming coatings such as polyurethane or epoxy from printed circuit boards is disclosed. The composition comprises separate base and activator components which are mixed to form the coating remover. The base component comprises methylene chloride or toluene, or a mixture thereof, preferably together with a thickening agent. In general, the activator component comprises (a) from about 75 to about 85 parts methylene chloride or toluene, or a mixture thereof, (b) about 7 to about 25 parts lower alkyl alcohol, and (c) about 2 to about 8 parts acetone or methylethylketone. For epoxy conformal coatings, the activator component preferably comprises 85 parts of (a): about 7 to about 15 parts of (b); and about 2 to about 6 parts of (c). The activator component for removing polyurethane conformal coatings preferably comprises 75 parts of (a), about 15 to about 25 parts of (b); about 2 to about 8 parts of (c). The base component is usually mixed with the activator component in a ratio of from 1:1 to 10:1, depending on the thickness of the coating to be removed. The composition is used by combining the base component with the activator component, treating a conformal coating on a printed circuit board by applying the coating remover thereto, and removing the treated conformal coating. Ultraviolet light accelerates the reaction between the conformal coating and the composition of the present invention.

Abstract translation: PCT No.PCT / US85 / 02339 371日期：1986年7月25日 102（e）日期1986年7月25日PCT提交1985年11月22日PCT公布。 出版物WO86 / 03145 日本1986年6月5日公开了一种从印刷电路板上去除适合涂层如聚氨酯或环氧树脂的组合物和方法。 组合物包含分离的碱和活化剂组分，其被混合以形成涂层去除剂。 碱组分包括二氯甲烷或甲苯，或其混合物，优选与增稠剂一起。 通常，活化剂组分包含（a）约75至约85份二氯甲烷或甲苯或其混合物，（b）约7至约25份低级烷基醇，和（c）约2至约8份 丙酮或甲基乙基酮。 对于环氧树脂保形涂层，活化剂组分优选包含85份（a）：约7至约15份（b）; 和约2至约6份（c）。 用于去除聚氨酯保形涂层的活化剂组分优选包含75份（a），约15至约25份（b）; 约2至约8份（c）。 根据待除去的涂层的厚度，基础组分通常以1：1至10：1的比例与活化剂组分混合。 组合物通过将基础组分与活化剂组分组合使用，通过将涂布去除剂施加到印刷电路板上来处理保形涂层，并除去处理过的保形涂层。 紫外线加速本发明的保形涂层和组合物之间的反应。

公开(公告)号：US4255469A

公开(公告)日：1981-03-10

申请号：US54360

申请日：1979-07-02

Applicant: Patrick J. McGinness

Inventor： Patrick J. McGinness

IPC: B05B15/04 ,  B05D1/32 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28

CPC classification number: B05D1/32 ,  B05B15/0456 ,  H05K3/0079 ,  H05K3/284 ,  H05K1/117 ,  H05K2201/09872 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/0582

Abstract: A process for masking an electronic module with a masking tape having an imbedded wire utilized as a cutting edge. The wire is adhered along the edge of the masking tape and the tape is applied to the module so that the wire separates the area to be coated from the area to be coating free. A conformal coating is then applied to the module. After the conformal coating has dried the wire cutting edge is pulled from the tape so as to cut a smooth edge through the conformal coating. The tape is then removed leaving the area underneath free of the coating.

Abstract translation: 一种用掩蔽胶带掩蔽电子模块的方法，该胶带具有用作切割边缘的嵌入线。 电线沿着遮蔽胶带的边缘粘合，并且带被施加到模块，使得电线将要涂覆的区域与要涂覆的区域分开。 然后将保形涂层施加到模块。 在保形涂层干燥之后，将线切割边缘从带拉出，以便通过保形涂层切割光滑的边缘。 然后取出胶带，留下没有涂层的区域。