公开(公告)号：US5300340A

公开(公告)日：1994-04-05

申请号：US874553

申请日：1992-04-22

Applicant: Clyde D. Calhoun ,  Maurice J. Fleming ,  George D. Foss ,  Richard L. Renstrom

Inventor： Clyde D. Calhoun ,  Maurice J. Fleming ,  George D. Foss ,  Richard L. Renstrom

IPC: H01B5/16 ,  C09J7/02 ,  C09J9/02 ,  H01B1/22 ,  H01B5/00 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01B1/22 ,  C09J7/02 ,  C09J9/02 ,  H01R4/04 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K3/361 ,  Y10S428/906 ,  Y10T428/1429 ,  Y10T428/2438 ,  Y10T428/24413 ,  Y10T428/24545 ,  Y10T428/24843 ,  Y10T428/24893 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2857

Abstract: Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 .mu.m thick.

Abstract translation: 两个基板上的导电元件可以通过包含以预定图案单独定位在粘合剂层中的导电等轴晶粒的胶带电连接。 每个颗粒比要互连的元件更硬，从而手压使颗粒进入元件，从而产生可靠的电连接。 特别有用的颗粒是具有厚度为0.1至2（μm）的金属涂层的玻璃珠。

公开(公告)号：US5276964A

公开(公告)日：1994-01-11

申请号：US2159

申请日：1993-01-11

Applicant: Herbert R. Anderson, Jr. ,  Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  Donald E. Myers ,  Thomas J. Walsh

Inventor： Herbert R. Anderson, Jr. ,  Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  Donald E. Myers ,  Thomas J. Walsh

IPC: H01R4/02 ,  H01R12/52 ,  H01R43/02 ,  H01R43/16 ,  H05K3/40 ,  H05K3/20

CPC classification number: H01R12/526 ,  H05K3/4015 ,  H05K3/4046 ,  H01R4/02 ,  H01R43/02 ,  H01R43/16 ,  H05K2201/0129 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2203/1105 ,  H05K2203/1189 ,  H05K3/403 ,  Y10S29/044 ,  Y10S439/951 ,  Y10T29/49167 ,  Y10T29/49853 ,  Y10T29/53191

Abstract: There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated. After a ball is seated in contact with a conductive trace, the solder plating may be reflowed.

Abstract translation: 公开了一种高密度电子连接器系统，其中塑料绝缘体在一个或多个层次上支撑多个导电电路迹线。 这些迹线的输出触点由小金属球提供。 金属球被驱动与相应的导电迹线紧密接触并被塑料体吸收。 球用金覆盖，并在连接器系统中提供微型，耐磨的紧密间隔的输出触点。 球可接触绝缘体两层的导电迹线，从而提供导电迹线之间的电连接。 制造连接器系统的方法包括以下步骤：将塑料体加热到升高的温度，并通过或抵靠相应的导电迹线驱动小金属球并进入塑料体，由此吸收它。 导电迹线可以是焊接电镀的。 在与导电迹线接触球后，可以回流焊接电镀。

公开(公告)号：US5259110A

公开(公告)日：1993-11-09

申请号：US863627

申请日：1992-04-03

Applicant: Arthur Bross ,  Robert O. Lussow ,  Thomas J. Walsh

Inventor： Arthur Bross ,  Robert O. Lussow ,  Thomas J. Walsh

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H05K1/11 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46 ,  H05K3/36 ,  B29C47/00 ,  B32B31/20 ,  H01K3/10

CPC classification number: H05K3/4632 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/49822 ,  H05K3/4617 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10416 ,  H05K3/28 ,  H05K3/4046 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets formed by injection, compression or other suitable molding techniques. Metal pieces to form vias of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets.

公开(公告)号：US5170931A

公开(公告)日：1992-12-15

申请号：US644528

申请日：1991-01-23

Applicant: Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

Inventor： Kishor V. Desai ,  Nelson P. Franchak ,  Robert H. Katyl ,  Harold Kohn ,  Tamar A. Sholtes ,  Vilakkudi G. Veeraraghavan ,  Charles G. Woychik

IPC: H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15321 ,  H05K1/141 ,  H05K2201/0215 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0557

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template having a pattern of openings corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.

公开(公告)号：US5153408A

公开(公告)日：1992-10-06

申请号：US607969

申请日：1990-10-31

Applicant: Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

Inventor： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

IPC: H01L21/3205 ,  H01L21/768 ,  H01L23/498 ,  H01L23/52 ,  H01L23/525 ,  H01L23/538 ,  H05K3/00 ,  H05K3/02 ,  H05K3/22 ,  H05K3/34

CPC classification number: H01L21/76892 ,  H01L23/49866 ,  H01L23/525 ,  H05K3/225 ,  H01L2924/0002 ,  H05K2201/10181 ,  H05K2201/10234 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/121 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/34 ,  Y10T29/49124

Abstract: The present invention relates generally to a new method of repairing electrical lines, and more praticularly to repairing electrical lines having an open at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the open with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.

Abstract translation: 本发明一般涉及一种修复电线的新方法，并且更具体地涉及在装置就位时修复在模块级具有开路的电线。 使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。 它可以通过将跨接线或熔核固定在开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热 焊接并允许焊料熔化并修复开路。 本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。 本发明还允许修复通常不能通过常规技术修复的细线图案。

公开(公告)号：US4670339A

公开(公告)日：1987-06-02

申请号：US757414

申请日：1985-07-22

Applicant: Gregg W. Frey

Inventor： Gregg W. Frey

IPC: C08K7/18 ,  C09J5/02 ,  H01B1/22 ,  H05K3/24 ,  H05K3/32 ,  H05K3/38 ,  H05K3/40 ,  B32B27/38

CPC classification number: H05K3/4007 ,  C08K7/18 ,  C09J5/02 ,  H01B1/22 ,  H05K3/323 ,  H05K2201/0317 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K3/244 ,  H05K3/388 ,  Y10T428/256 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522

Abstract: The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds between two substrates. Copper microspheres, having an average diameter of about 2 microns are bound in an epoxy layer which bonds two substrates together. The microspheres make electrical contact between the substrates while providing intersphere gaps which are filled with the epoxy which actually bonds the substrates together.

Abstract translation: 本发明是在两个基板之间产生极薄的导电环氧树脂结合体的方法和结构。 平均直径约2微米的铜微球体结合在环氧树脂层中，将环氧树脂层结合在一起。 微球体在基板之间进行电接触，同时提供填充有实际将基板粘合在一起的环氧树脂的间隙。

公开(公告)号：US4569877A

公开(公告)日：1986-02-11

申请号：US722755

申请日：1985-04-15

Applicant: Richard J. Tollefson ,  James G. Berg ,  Philip D. Hinderaker

Inventor： Richard J. Tollefson ,  James G. Berg ,  Philip D. Hinderaker

IPC: H01R4/04 ,  H05K3/32 ,  B32B3/10

CPC classification number: H01R4/04 ,  H05K3/323 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/1189 ,  Y10T428/24355 ,  Y10T428/24413 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/24545 ,  Y10T428/24612 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2891

Abstract: Sheet material useful for making bonded electrical connections, especially to sets of small side-by-side terminal pads. In one typical form, the sheet material is an elongated tape comprising an elongated flexible insulating backing; a plurality of narrow spaced parallel elongated electrically conductive stripes on the backing; and electrically conductive adhesive disposed over the stripes comprising a layer of adhesive material in which are dispersed a monolayer of electrically conductive elements which have an average thickness greater than the average thickness of the adhesive layer, and the top edges of which are higher than at least part of the exterior surface of the adhesive layer surrounding the element.

Abstract translation: 用于制造粘合电连接的板材，特别是小型并排端子焊盘的组合。 在一种典型的形式中，片材是包括细长的柔性绝缘背衬的细长带; 背衬上的多个窄间隔的平行细长的导电条纹; 以及设置在条纹之上的导电粘合剂，其包括粘合剂材料层，其中分散有单层导电元件，其平均厚度大于粘合剂层的平均厚度，并且其顶部边缘高于至少 围绕元件的粘合剂层的外表面的一部分。

公开(公告)号：US4346516A

公开(公告)日：1982-08-31

申请号：US252214

申请日：1981-04-08

Applicant: Kishio Yokouchi ,  Hiromi Ogawa ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa ,  Kyohei Murakawa

Inventor： Kishio Yokouchi ,  Hiromi Ogawa ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa ,  Kyohei Murakawa

IPC: H05K3/46 ,  H01L21/48 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K3/4046 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/5384 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2203/0195 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49153 ,  Y10T29/49694

Abstract: A method of forming a ceramic circuit substrate allowing mounting of high integration density semiconductor elements. The method provides a multilayered ceramic circuit substrate having via holes formed with high accuracy and high integration density wiring patterns by forming metallic conductive balls to connect the conductive wiring patterns of upper and lower layers; a ball arranging plate having many holes placing on a green sheet uniformly in close contact; filling the holes of the plate with the embedding the conductive balls by pressure into the green sheet; and thereafter baking the green sheet individually or in a stacked layered arrangement.

Abstract translation: 一种形成陶瓷电路基板的方法，允许安装高集成度密度的半导体元件。 该方法通过形成金属导电球以连接上层和下层的导电布线图案，提供具有形成有高精度和高集成度的布线图案的通孔的多层陶瓷电路基板; 具有多个孔的球排列板，其均匀地放置在生片上; 通过压力将导电球嵌入生片中来填充板的孔; 然后单独地或以堆叠的层叠布置烘烤生片。

公开(公告)号：US4322777A

公开(公告)日：1982-03-30

申请号：US131771

申请日：1980-03-19

Applicant: Yasuomi Ueta ,  Tatsuro Toyama

Inventor： Yasuomi Ueta ,  Tatsuro Toyama

IPC: H01T4/10 ,  H01T4/08 ,  H05K1/02 ,  H05K3/40 ,  H05K1/18

CPC classification number: H05K1/026 ,  H01T4/08 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10234 ,  H05K3/4015

Abstract: A circuit board formed with a spark gap for protecting a circuit element such as a transistor connected to a picture tube of a television receiver when spark discharge occurring within the picture tube produces a current under a high voltage tending to destroy the transistor. The spark gap comprises a pair of metal balls disposed respectively on the confronting tip portions of a pair of discharge electrodes disposed opposite to each other on an insulator substrate so that spark discharge can always occur across these metal balls without occurring across the electrodes.

Abstract translation: 形成有火花隙的电路板，用于在显像管内发生火花放电时，保护连接到电视接收机的显像管的电路元件等电路元件，产生高电压的电流，从而破坏晶体管。 火花隙包括一对金属球，分别设置在绝缘体基板上彼此相对设置的一对放电电极的相对的尖端部分上，使得在这些金属球之间总能发生火花放电而不会在电极之间发生。

公开(公告)号：US4097266A

公开(公告)日：1978-06-27

申请号：US645395

申请日：1975-12-30

Applicant: Eikichi Takahashi ,  Toshihiko Taguchi ,  Kazuo Fujikura ,  Toshihisa Sudo

Inventor： Eikichi Takahashi ,  Toshihiko Taguchi ,  Kazuo Fujikura ,  Toshihisa Sudo

IPC: B22F1/02 ,  B23K1/20 ,  B23K35/02 ,  B23K35/14 ,  B23K35/40 ,  H05K3/34 ,  B22D23/08

CPC classification number: B22F1/025 ,  B23K35/0244 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/0338 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T428/12181

Abstract: A microsphere of solder having a metallic core, in which the thickness of the solder coating of the microsphere is more than 20 microns, can be produced by a process comprising preparing a sheet having a plurality of hollows provided all over the sheet, placing a spherical grain of a metal together with at least one grain of solder in each of said hollows, the metallic grain having wettability for solder, then heating the grains in the hollow in the presence of a flux to coat the metallic grain with the solder, and recovering a spherical solder bead having a metallic core.

Abstract translation: 具有金属芯的焊料微球，其中微球的焊料涂层的厚度大于20微米，可以通过以下方法制备，该方法包括制备具有遍及片材的多个中空部分的片材，放置球形 金属颗粒与每个所述凹槽中的至少一个焊料晶粒一起，金属颗粒具有用于焊料的润湿性，然后在焊剂存在下加热中空部分中的晶粒以用焊料涂覆金属颗粒，并回收 具有金属芯的球形焊料珠。