公开(公告)号：US20170086304A1

公开(公告)日：2017-03-23

申请号：US14859026

申请日：2015-09-18

Applicant: Delaware Capital Formation, Inc.

Inventor： Mark Hahn

IPC: H05K3/10 ,  B23K26/0622 ,  B23K9/09 ,  B23K26/21 ,  H05K1/18 ,  B23K9/167

CPC classification number: H05K3/103 ,  B23K9/0043 ,  B23K9/091 ,  B23K9/092 ,  B23K9/167 ,  B23K9/23 ,  B23K26/0622 ,  B23K26/21 ,  B23K26/22 ,  B23K26/32 ,  B23K2101/38 ,  B23K2103/00 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/05 ,  H01L24/07 ,  H01L24/08 ,  H01L24/09 ,  H01L24/42 ,  H01L24/44 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/02163 ,  H01L2224/02185 ,  H01L2224/04042 ,  H01L2224/45147 ,  H01L2224/45639 ,  H01L2224/48476 ,  H01L2224/80007 ,  H01L2224/80009 ,  H01L2224/8019 ,  H01L2224/8034 ,  H01L2924/00014 ,  H05K1/18 ,  H05K3/328 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.

公开(公告)号：US09532475B2

公开(公告)日：2016-12-27

申请号：US15016915

申请日：2016-02-05

Applicant: FUJITSU LIMITED

Inventor： Satoshi Masuda

IPC: H01L23/66 ,  H05K7/02 ,  H01L25/16 ,  H01L23/045 ,  H01L23/047 ,  H01L23/498 ,  H05K3/46 ,  H05K7/20 ,  H01L23/00 ,  H01L23/367 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K7/026 ,  H01L23/045 ,  H01L23/047 ,  H01L23/3677 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/06181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19107 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K3/4697 ,  H05K7/20509 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2224/45099

Abstract: A high-frequency module includes a lower base member having a recess part formed in an upper face thereof, and having a base metal part formed on a lower face thereof that is to be grounded, an upper substrate disposed inside the recess part of the lower base member. The high frequency module also includes a semiconductor device and a first ground metal part connected to the base metal part and disposed in the lower base member. The upper substrate has a first through hole formed therethrough at a position where the first ground metal part is situated, and the semiconductor device is placed on the first ground metal part in the first through hole.

Abstract translation: 高频模块包括下基部件，其具有形成在其上表面中的凹部，并且具有形成在其下表面上的待接地的基底金属部分，设置在下部的凹部内的上基板 基地会员 高频模块还包括半导体器件和连接到母体金属部分并设置在下部基底部件中的第一接地金属部件。 上基板具有在第一接地金属部件所在的位置处穿过其形成的第一通孔，并且半导体器件被放置在第一通孔中的第一接地金属部件上。

公开(公告)号：US09510449B2

公开(公告)日：2016-11-29

申请号：US14457433

申请日：2014-08-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingli Huang ,  Tao Feng ,  Songlin Li

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/14 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/144 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/10242

Abstract: Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

Abstract translation: 本公开的实施例涉及电子领域，特别是涉及多层印刷电路板及其制造方法。 电路板能够避免信号传输性能受镀层孔影响的问题。 多层印刷电路板包括至少两层粘合的芯板，其中电路机械部件设置在芯板上，在芯板上还设有通孔，并且金属柱嵌入在通孔中 其中金属柱的一端连接到设置在芯板上的天线馈线电路机械部件上的对应位置，另一端连接到设置在相邻层上的天线馈电电路机械部件上的对应位置 核心板。 该方法用于制造多层印刷电路板。

公开(公告)号：US20160315042A1

公开(公告)日：2016-10-27

申请号：US15007557

申请日：2016-01-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Kyoung-Ro YOON ,  Hyun-Kyung PARK

IPC: H01L23/498 ,  H01L21/683 ,  H01L21/288 ,  H01L21/48

CPC classification number: H01L21/288 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2224/16225 ,  H05K1/113 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10242 ,  H05K2201/10378

Abstract: Disclosed is a printed circuit board including an insulating layer, a circuit layer formed on a lower surface of the insulating layer, and a metal post contacting the circuit layer and extending from the lower surface to an upper surface of the insulating layer. The printed circuit board is able to prevent shorts while components are mounted by forming a metal post to have a secured height tolerance to connect with a die and to be in a caved shape into the board.

Abstract translation: 公开了一种印刷电路板，其包括绝缘层，形成在绝缘层的下表面上的电路层和接触电路层并从绝缘层的下表面延伸到上表面的金属柱。 印刷电路板能够通过形成金属柱来安装元件以防止短路，以具有固定的高度公差以与模具连接并且将其形成为凹陷形状。

公开(公告)号：US20160300787A1

公开(公告)日：2016-10-13

申请号：US14830955

申请日：2015-08-20

Applicant: SK hynix Inc.

Inventor： Ki Jun SUNG

IPC: H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H01L23/31

CPC classification number: H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15151 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/3436 ,  H05K3/4015 ,  H05K3/4673 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/10242 ,  H05K2203/1316

Abstract: A substrate may include a body having a first surface and a second surface opposite to each other, at least one first wiring pattern disposed on the first surface of the body to include a bonding finger, an upper insulating pattern disposed on the first surface of the body to cover the overall surface of the at least one first wiring pattern except the bonding finger, and a second wiring pattern disposed on the second surface of the body. The substrate may include a lower insulating pattern disposed on the second surface of the body to cover the second wiring pattern, and a first via electrode penetrating the body from the first surface to the second surface and coupling the at least one first wiring pattern to the second wiring pattern. The body may include a first film and the upper and lower insulating patterns may include second films.

Abstract translation: 衬底可以包括具有彼此相对的第一表面和第二表面的主体，设置在主体的第一表面上的至少一个第一布线图案，以包括接合指状物，上绝缘图案设置在第一表面上 主体覆盖除了接合手指之外的至少一个第一布线图案的整个表面，以及布置在主体的第二表面上的第二布线图案。 衬底可以包括布置在主体的第二表面上以覆盖第二布线图案的下绝缘图案，以及从第一表面穿过主体到第二表面的第一通孔电极，并将至少一个第一布线图案耦合到 第二布线图。 主体可以包括第一膜，并且上和下绝缘图案可以包括第二膜。

公开(公告)号：US20160072210A1

公开(公告)日：2016-03-10

申请号：US14830280

申请日：2015-08-19

Applicant: ROLLS-ROYCE PLC

Inventor： Daniel Martin ARMSTRONG ,  Simon Thomas CORT

IPC: H01R12/78 ,  H01R43/20 ,  H01R13/6594

CPC classification number: H01R12/78 ,  F02C7/00 ,  F02C7/32 ,  F05D2230/238 ,  H01R12/61 ,  H01R13/6594 ,  H01R43/205 ,  H05K1/144 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/058 ,  H05K2201/10242 ,  H05K2201/10295 ,  H05K2201/10303 ,  Y02T50/672

Abstract: An electrical assembly is disclosed in which two flexible printed circuits are electrically joined. This allows greater lengths of flexible printed circuits to be provided, for example for gas turbine engine harnesses. Each flexible printed circuit has a terminating region having electrically conductive through holes that are connected to respective electrical tracks of the flexible printed circuit. The terminating regions are adjacent each other in the electrical assembly, and an electrically conductive pin is passed through the aligned through holes, then permanently bonded in position, for example by welding. This results in a robust, reliable connection of two flexible printed circuits.

Abstract translation: 公开了一种电气组件，其中两个柔性印刷电路电连接。 这允许提供更大长度的柔性印刷电路，例如用于燃气涡轮发动机线束。 每个柔性印刷电路具有端接区域，其具有连接到柔性印刷电路的相应电迹线的导电通孔。 端接区域在电气组件中彼此相邻，并且导电销穿过对准的通孔，然后例如通过焊接永久地接合就位。 这导致两个柔性印刷电路的可靠连接。

公开(公告)号：US09236665B2

公开(公告)日：2016-01-12

申请号：US14342880

申请日：2012-09-01

Applicant: Klaus Götzen

Inventor： Klaus Götzen

IPC: H01R4/10 ,  H05K3/40 ,  H01R12/55 ,  E05B85/02 ,  E05B81/54 ,  H05K1/02 ,  H05K3/20 ,  H05K3/30 ,  H05K3/34 ,  E05B81/06

CPC classification number: H01R4/10 ,  E05B81/06 ,  E05B81/54 ,  E05B85/02 ,  H01R12/55 ,  H05K1/0256 ,  H05K3/202 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/4015 ,  H05K2201/1009 ,  H05K2201/10242 ,  H05K2201/2072

Abstract: The invention relates to a conductor track unit, in particular for a motor vehicle. The conductor track unit is provided with conductor tracks which are embedded in an electrically insulating material. The conductor tracks are, in particular completely, surrounded by the electrically insulating material and are therefore not accessible from the outside. Electrical connections are electrically connected to the conductor tracks. The electrical connections are accessible from the outside, and therefore can be electrically connected to electrical contacts of electrical or electronic components such as a switch, detector, electronic radio component, integrated circuit, electronic chip, electronic control device or motor, for example by soldering. The conductor tracks and electrical connections are different components which are therefore initially independent of one another and can be produced independently dependently of one another. A particularly robust yet delicate conductor track unit can be provided in this way.

Abstract translation: 本发明涉及导体轨道单元，特别是用于机动车辆。 导体轨道单元设置有嵌入电绝缘材料的导体轨迹。 导体轨道特别完全被电绝缘材料包围，因此不能从外部接近。 电连接电连接到导体轨道。 电连接可以从外部访问，因此可以电连接到诸如开关，检测器，电子无线电部件，集成电路，电子芯片，电子控制装置或电机之类的电气或电子部件的电触点，例如通过焊接 。 导体轨道和电连接是不同的部件，因此它们最初彼此独立并且可以彼此独立地相互制造。 这样可以提供一个特别坚固而精细的导轨跟踪单元。

公开(公告)号：US20150282316A1

公开(公告)日：2015-10-01

申请号：US14543303

申请日：2014-11-17

Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： ZHANG-LONG PENG ,  CHUN-SHENG CHEN

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K1/09 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/10242 ,  H05K2201/10992 ,  Y02P70/611

Abstract: A printed circuit board which avoids the melding of closely adjacent solders includes a top surface, a number of electronic elements and a number of solders. The top surface includes a plurality of copper clad areas. Each copper clad area includes a head area and a neck area. The neck area is positioned on same side of the head area. The neck area includes two edges extended from a fringe of the head area and a terminal point. The two edges intersect at the terminal point. The electronic elements are positioned at the head area. Each solder includes a soldering portion and a tip portion. The soldering portion is attached on the head area and surrounds the electronic element. The tip portion is attached on the neck area. A fringe of the solder is same as the fringe of the copper clad area.

Abstract translation: 避免紧密相邻的焊料熔接的印刷电路板包括顶表面，多个电子元件和多个焊料。 顶表面包括多个铜包覆区域。 每个铜包覆区域包括头部区域和颈部区域。 颈部区域位于头部区域的同一侧。 颈部区域包括从头部区域的边缘延伸的两个边缘和终点。 两个边缘在终点处相交。 电子元件位于头部区域。 每个焊料包括焊接部分和尖端部分。 焊接部分附着在头部区域上并围绕电子元件。 尖端部分附着在颈部区域。 焊料的边缘与铜包覆区域的边缘相同。

公开(公告)号：US20150237732A1

公开(公告)日：2015-08-20

申请号：US14200684

申请日：2014-03-07

Applicant: QUALCOMM Incorporated

Inventor： Mario Francisco Velez ,  Daeik Daniel Kim ,  Young Kyu Song ,  Xiaonan Zhang ,  Jonghae Kim ,  Changhan Hobie Yun ,  Chengjie Zuo

IPC: H05K1/18 ,  H01L21/48 ,  H05K3/40 ,  H05K1/03 ,  H05K1/16 ,  H01L23/498 ,  H05K1/11

CPC classification number: H05K1/182 ,  H01F17/0006 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L28/10 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/165 ,  H05K3/4038 ,  H05K2201/10015 ,  H05K2201/10242 ,  H05K2201/10984 ,  Y10T29/49165

Abstract: A low-profile passive-on-package is provided that includes a plurality of recesses that receive corresponding interconnects. Because of the receipt of the interconnects in the recesses, the passive-on-package has a height that is less than a sum of a thickness for the substrate and an interconnect height or diameter.

Abstract translation: 提供了一种低调无源封装，其包括接收相应互连的多个凹槽。 由于在凹槽中接收到互连，所以被动封装的高度小于衬底的厚度和互连高度或直径的总和。

公开(公告)号：US20150237730A1

公开(公告)日：2015-08-20

申请号：US14434532

申请日：2012-10-23

Applicant: ABB TECHNOLOGY LTD.

Inventor： Wei Liu ,  Huan Shi ,  Jincheng Li ,  Haoran Li ,  Axel Lohbeck

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  G05B19/0428 ,  G05B19/058 ,  G05B2219/24029 ,  H05K3/36 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/1034 ,  H05K2201/10356 ,  H05K2201/2027 ,  Y10T29/49126

Abstract: A control system may include a plurality of terminal boards. Each of the plurality of terminal boards may at least include a power pin. The definition of the power pin on at least one of the plurality of terminal boards may be different from the definition of the power pin on another one of the plurality of terminal boards. Thus, if the at least one of the plurality of terminal boards is connected to a wrong input/output module, the input/output module will not get a process power supplied via the power pin on the terminal board. Therefore, a wrong input/output signal will not be transferred, and the input/output module will not be damaged even if a higher process voltage is provided by a wrong terminal board.

Abstract translation: 控制系统可以包括多个终端板。 多个端子板中的每一个可以至少包括电源引脚。 多个端子板中的至少一个端子板上的电源引脚的定义可以与多个端子板中的另一个端子板上的电源引脚的定义不同。 因此，如果多个端子板中的至少一个连接到错误的输入/输出模块，则输入/输出模块将不会获得通过端子板上的电源引脚提供的处理能力。 因此，错误的输入/输出信号将不会传输，即使错误的端子板提供较高的处理电压，输入/输出模块也不会损坏。