公开(公告)号：US20090191415A1

公开(公告)日：2009-07-30

申请号：US12022457

申请日：2008-01-30

Applicant: Bruce W. Anderson ,  Douglas R. Carlson ,  Lisa Lust

Inventor： Bruce W. Anderson ,  Douglas R. Carlson ,  Lisa Lust

IPC: B32B15/04 ,  B32B37/14

CPC classification number: H01R4/02 ,  H01R4/04 ,  H01R43/0207 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/611 ,  Y10T156/10 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: A connection made between components at a safe temperature for each of the components. A slot made may be provided on one component and a tab provided on the other component. The slot may be filled with an electrically conductive material. The tab may be inserted in the slot before significant curing of the material and kept in the slot throughout the curing period of the material. The curing may be effected at a temperature harmless to the components. For example, the temperature may be room temperature. One example of a temperature-sensitive component may be a thin battery.

Abstract translation: 在每个组件的安全温度下，组件之间的连接。 可以在一个部件上设置一个槽，另一个部件上设有一个接头。 槽可以填充有导电材料。 在材料的显着固化之前，突片可以插入槽中并在材料的整个固化期间保持在槽中。 固化可以在对组分无害的温度下进行。 例如，温度可能是室温。 温度敏感组件的一个实例可以是薄电池。

公开(公告)号：US07566228B2

公开(公告)日：2009-07-28

申请号：US11768382

申请日：2007-06-26

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01R13/2442 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.

Abstract translation: 所公开的实施例涉及使用刮削技术形成电接触。 电触点包括已经从下面的金属体滑开的弹簧结构，但是弹簧保持与金属体结合，该金属体为弹簧结构提供基座。 电接触件的刮刀弹簧部分可包括悬臂状弹簧，线圈状弹簧或任何其它合适类型的弹簧。 这种弹簧接点可用于在集成电路器件和电路板（或其他衬底）之间形成电连接。 描述和要求保护其他实施例。

公开(公告)号：US20090081889A1

公开(公告)日：2009-03-26

申请号：US11903962

申请日：2007-09-25

Applicant: Chandrashekhar Ramaswamy ,  Thomas G. Ruttan ,  Mark D. Summers

Inventor： Chandrashekhar Ramaswamy ,  Thomas G. Ruttan ,  Mark D. Summers

IPC: H01R12/00

CPC classification number: H01R13/2442 ,  H01R12/714 ,  H05K3/326 ,  H05K3/4015 ,  H05K7/1069 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10719 ,  Y02P70/611

Abstract: In one embodiment, the present invention includes a circuit board having integrated contacts to mate with corresponding pads of a semiconductor device. At least some of the integrated contacts are of varying sizes to enable different contact resistances between the corresponding integrated contacts and pads, enabling reduced loading forces to adapt the semiconductor device to the circuit board. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，本发明包括具有集成触点以与半导体器件的相应焊盘配合的电路板。 集成接触中的至少一些具有不同的尺寸，以实现相应的集成触点和焊盘之间的不同接触电阻，从而能够减少负载力以使半导体器件适应电路板。 描述和要求保护其他实施例。

公开(公告)号：US20090020869A1

公开(公告)日：2009-01-22

申请号：US11779110

申请日：2007-07-17

Applicant: Qing Xue ,  Shengquan E. Ou ,  Sairam Agraharam

Inventor： Qing Xue ,  Shengquan E. Ou ,  Sairam Agraharam

IPC: H01L23/48

CPC classification number: H05K3/4015 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2924/3512 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/1031 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

Abstract: An interconnect joint comprises a substrate (110), a solder resist layer (120) over the substrate, a solder resist opening (130) (having a top surface (131)) in the solder resist layer, a solder material (140) in the solder resist opening, and an electrically conducting structure (150) having a portion that extends into the solder material below the top of the solder resist opening.

Abstract translation: 互连接头包括衬底（110），衬底上的阻焊层（120），阻焊层中的阻焊剂开口（130）（具有顶表面（131）），焊料材料（140） 阻焊剂开口，以及导电结构（150），其具有在阻焊剂开口的顶部下方延伸到焊料材料中的部分。

公开(公告)号：US20080268663A1

公开(公告)日：2008-10-30

申请号：US11740671

申请日：2007-04-26

Applicant: Thomas Michael Ales ,  Davis-Dang Hoang Nhan

Inventor： Thomas Michael Ales ,  Davis-Dang Hoang Nhan

IPC: H01R33/00

CPC classification number: H01R43/0256 ,  H01R13/03 ,  H05K3/308 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/209 ,  Y02P70/611 ,  Y02P70/613

Abstract: The present disclosure is directed to conductive connector attachments for use in electrically connecting printed circuit boards to absorbent products such as diapers, training pants, incontinence products, feminine hygiene products, and the like. Specifically, various configurations and methods of securely attaching conventional conductive hook and loop attachments to printed circuit boards are disclosed.

Abstract translation: 本公开涉及用于将印刷电路板电连接到诸如尿布，训练裤，失禁产品，女性卫生产品等吸收产品的导电连接器附件。 具体地，公开了将常规导电钩和环附接件牢固地连接到印刷电路板的各种配置和方法。

公开(公告)号：US20080231305A1

公开(公告)日：2008-09-25

申请号：US12054289

申请日：2008-03-24

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US07331799B1

公开(公告)日：2008-02-19

申请号：US11626985

申请日：2007-01-25

Applicant: Ming-Tsung Lee

Inventor： Ming-Tsung Lee

IPC: H01R12/00

CPC classification number: H05K3/301 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10515 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A stacked electronic component includes multiple energy storage units and a fastening device. Each energy storage unit has a first electrode and a second electrode. The fastening device includes first and second fastening member disposed on opposite sides of the energy storage units. Each of the first and second fastening members includes a body plate, at least a clamping structure extending from two edges of the body plate and at least a connecting part electrically connected to the body plate and the circuit board. The energy storage units are clamped by the clamping structures of the first and second fastening members and the first and second electrodes are electrically connected to the body plates of the first and second fastening members, so that the first and second electrodes are electrically connected to the circuit board through the body plates and the connecting parts of the first and second fastening members.

Abstract translation: 堆叠的电子部件包括多个能量存储单元和紧固装置。 每个能量存储单元具有第一电极和第二电极。 紧固装置包括设置在能量存储单元的相对侧上的第一和第二紧固构件。 第一和第二紧固构件中的每一个包括主体板，至少一个从主体板的两个边缘延伸的夹持结构和至少一个电连接到主体板和电路板的连接部分。 能量存储单元由第一和第二紧固构件的夹持结构夹持，并且第一和第二电极电连接到第一和第二紧固构件的主体板，使得第一和第二电极电连接到 电路板通过主体板和第一和第二紧固构件的连接部分。

公开(公告)号：US20080014769A1

公开(公告)日：2008-01-17

申请号：US11822418

申请日：2007-07-05

Applicant: Osamu Miyoshi ,  Tatsuo Saito ,  Ken Aoki

Inventor： Osamu Miyoshi ,  Tatsuo Saito ,  Ken Aoki

IPC: H01R12/00

CPC classification number: H01R12/57 ,  H01R4/64 ,  H05K3/303 ,  H05K3/32 ,  H05K3/3421 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10962 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mounting lug terminal formed of a metallic plate having terminal leads and positioning projections can readily be positioned on a printed board with high precision by fitting the positioning projections into positioning cutouts formed in the printed board. The terminal leads of the surface mounting lug terminal can easily be soldered to land patterns on the printed board to secure the surface mounting lug terminal onto the printed board irrespective of the number of terminal leads. The surface mounting lug terminal can be reduced in size, thus to contribute miniaturization of electronic circuits.

Abstract translation: 由具有端子引线和定位突起的金属板形成的表面安装凸耳端子可以通过将定位突起装配到形成在印刷电路板上的定位切口中而可以高精度地定位在印刷电路板上。 表面安装凸耳端子的端子引线可以容易地焊接到印刷板上的焊盘图案，以将表面安装凸耳端子固定到印刷板上，而不管端子引线的数量。 表面安装凸耳端子的尺寸可以减小，从而有助于电子电路的小型化。

公开(公告)号：US20070197091A1

公开(公告)日：2007-08-23

申请号：US11309718

申请日：2006-09-15

Applicant: MING-CHIH HSIEH

Inventor： MING-CHIH HSIEH

IPC: H01R13/648

CPC classification number: H01R12/52 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/366 ,  H05K2201/0311 ,  H05K2201/10189 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A PCB assembly includes a motherboard, a daughter board, and an elastic strip. The motherboard is electrically connected to the daughter board via connectors. Each of the motherboard and the daughter board includes an area connected to a power layer or a ground layer. One end of the elastic strip electrically connects to the area of the motherboard. The other end of the elastic strip electrically connects to the area of the daughter board whereby increases electrically connection between the motherboard and the daughter board.

Abstract translation: PCB组件包括母板，子板和弹性条。 主板通过连接器与子板电连接。 主板和子板中的每一个包括连接到电源层或接地层的区域。 弹性带的一端电连接到母板的区域。 弹性带的另一端电连接到子板的区域，从而增加母板和子板之间的电连接。

公开(公告)号：US20070173085A1

公开(公告)日：2007-07-26

申请号：US11717938

申请日：2007-03-14

Applicant: John Pereira ,  Manuel Machado ,  Stephen Antaya

Inventor： John Pereira ,  Manuel Machado ,  Stephen Antaya

IPC: H05K1/00

CPC classification number: H05B3/84 ,  H01R4/02 ,  H01R4/028 ,  H01R4/58 ,  H01R12/57 ,  H01R13/20 ,  H01R13/207 ,  H01R13/213 ,  H01R13/639 ,  H01R43/0235 ,  H01R43/0256 ,  H01R43/0263 ,  H05B2203/016 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49217 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: An electrical connector includes a hollow conductive post member having a circular periphery, a foot portion and a distal end. The distal end has a generally cup shaped indentation. A base member is included having top and bottom surfaces. The foot portion of the post member is mounted to the top surface. At least one standoff extends from the bottom surface of the base member. The at least one standoff is for resting against a contact surface when soldering the electrical connector to the contact surface, thereby separating the bottom surface from the contact surface to define a minimum volume therebetween for occupation by solder.