公开(公告)号：US07534654B2

公开(公告)日：2009-05-19

申请号：US11733562

申请日：2007-04-10

Applicant: David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

Inventor： David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

Abstract translation: 提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。 插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。 公开了各种捕获垫结构。 通过邻近插座基板表面的导电迹线提供与外部设备的连接。 插座基板可以由支撑基板支撑。 在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

公开(公告)号：US20090103276A1

公开(公告)日：2009-04-23

申请号：US12239256

申请日：2008-09-26

Applicant: Hideyuki SAKAMOTO ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

Inventor： Hideyuki SAKAMOTO ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC: H05K1/11 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/065 ,  H05K2201/042 ,  H05K2201/10318 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.

Abstract translation: 本发明提供一种电路装置及其制造方法，其特征在于，能够使由树脂构成的多个电路基板与树脂密封而形成。 在混合集成电路装置中，第一电路板与第二电路板重叠，并且两个板都装配到壳体中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 此外，在壳体构件的侧壁部设置有开口，壳体的内部空间通过该开口与外部连通。 因此，在树脂密封工序中，能够通过该开口从外部将密封树脂注入到壳体的内部空间。

公开(公告)号：US20090086454A1

公开(公告)日：2009-04-02

申请号：US12239250

申请日：2008-09-26

Applicant: Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

Inventor： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC: H05K7/00

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/065 ,  H05K2201/042 ,  H05K2201/10318 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract translation: 提供了能够增加封装密度并防止引入电路元件之间的热干扰的电路装置。 在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式装配到壳体构件中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 此外，在壳体内设置有未填充有密封树脂的中空部。 这样的结构防止作为微型计算机的第二电路元件例如由于在作为功率晶体管的第一电路元件中产生的热而不稳定地运行。

公开(公告)号：US20090084155A1

公开(公告)日：2009-04-02

申请号：US11864260

申请日：2007-09-28

Applicant: Ryan Chase ,  Ravi K. Nalla

Inventor： Ryan Chase ,  Ravi K. Nalla

IPC: B21D22/00 ,  B21D31/00 ,  C21D9/00 ,  C22F1/00

CPC classification number: C22C38/08 ,  C21D9/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/105 ,  C22F1/00 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2924/0002 ,  H01R12/57 ,  H01R43/16 ,  H05K3/3426 ,  H05K2201/0373 ,  H05K2201/10318 ,  Y02P70/613 ,  Y10T29/49204 ,  H01L2924/00

Abstract: A method of forming a pin adapted to be used in a PGA joint, and a flattening head used to perform the method. The method includes: providing a pin blank; and forming a pin head by coining an end of the pin blank using a flattening head thereby forming the pin, the pin having a pin stem and the pin head attached to the pin stem, the flattening head being shaped to impart a topography to an underside surface to the pin head that is non-smooth during coining, the topography being adapted to allow gases to escape from a pin-attach solder disposed adjacent to the underside surface.

Abstract translation: 一种形成适于在PGA接头中使用的销的方法，以及用于执行该方法的扁平头。 该方法包括：提供销空白; 并且通过使用平坦的压头来压出销坯的端部来形成销头，从而形成销，所述销具有销杆，并且所述销头连接到销杆，所述压扁头被成形为将形状赋予下侧 表面到压头处的不平滑的针头，该形状适于允许气体从邻近下表面设置的针附着焊料逸出。

公开(公告)号：US20090056992A1

公开(公告)日：2009-03-05

申请号：US12200201

申请日：2008-08-28

Applicant: Hirokazu Takeuchi ,  Kiyotaka Shimada ,  Masayoshi Ebe ,  Yoshinori Furihata

Inventor： Hirokazu Takeuchi ,  Kiyotaka Shimada ,  Masayoshi Ebe ,  Yoshinori Furihata

IPC: H05K1/02 ,  H01B5/00

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2924/15312 ,  H05K2201/10318 ,  Y02P70/613

Abstract: A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.

Abstract translation: 具有引脚的布线基板是通过导电材料将引线焊接到形成在布线基板上的电极焊盘而形成的。 在引导销中，在与轴部的一端形成的头部的电极焊盘相对的端面侧形成有侧面形成为凹面的圆锥突起部。 在导电材料延伸到头部的背面侧超过头部的凸缘部分并到达引脚的轴部的状态下，将引脚接合到电极焊盘。

公开(公告)号：US20090038823A1

公开(公告)日：2009-02-12

申请号：US12186851

申请日：2008-08-06

Applicant: Yoshinori Furihata ,  Toshifumi Machii ,  Kiyotaka Shimada ,  Kazuhiro Yoshida

Inventor： Yoshinori Furihata ,  Toshifumi Machii ,  Kiyotaka Shimada ,  Kazuhiro Yoshida

IPC: H01B5/00

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L2924/0002 ,  H01R12/777 ,  H05K2201/10318 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad.

Abstract translation: 提供了一种具有引线引脚的布线基板，该引线引脚通过导电材料将导线焊接到布线基板上形成的电极焊盘而形成，并且在引脚中，端面侧与形成在引线板的一端的头部的电极焊盘相对 轴部分形成在锥形突出部分中，并且锥形突出部分的顶角也设置在110°至140°的角度范围内，并且导电材料插入在圆锥突起部分和电极焊盘之间，并且还 延伸到头部的平坦部分并到达轴部分的外表面，并且引脚接合到电极焊盘。

公开(公告)号：US20080305655A1

公开(公告)日：2008-12-11

申请号：US11758338

申请日：2007-06-05

Applicant: Mengzhi Pang ,  Yonggang Li

Inventor： Mengzhi Pang ,  Yonggang Li

IPC: H01R12/18 ,  H01R4/02

CPC classification number: H05K3/3426 ,  H05K1/111 ,  H05K2201/0969 ,  H05K2201/10318 ,  H05K2203/167 ,  Y02P70/613

Abstract: A microelectronic package substrate and an electrically conductive pin. The substrates includes: a die-side surface adapted to receive a die thereon; a PCB-side surface adapted to be mechanically and electrically bonded to a PCB; an array of land pads on the PCB-side surface, the land pads defining anchoring recesses therein; an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, the pins having anchoring elements thereon mated with corresponding ones of the anchoring recesses of the land pads, the anchoring elements and anchoring recesses being configured such that a mating thereof inhibits a tilting of the pins on the land pads; and a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads.

Abstract translation: 微电子封装基板和导电引脚。 基板包括：适于在其上容纳管芯的模具侧表面; PCB侧表面，其适于机械地和电气地结合到PCB; PCB侧表面上的焊盘阵列，焊盘限定其中的固定凹槽; 导电销的阵列电和机械地结合到相应的焊盘，所述引脚在其上具有锚定元件，其中所述锚定元件与所述焊盘的相应锚固凹槽配合，所述锚固元件和锚固凹槽被配置为使得其匹配 抑制焊盘上的销的倾斜; 以及多个引脚附接焊点，将引脚机械地和电气地结合到对应的焊盘。

公开(公告)号：US20080296752A1

公开(公告)日：2008-12-04

申请号：US12107966

申请日：2008-04-23

Applicant: Shigeo NAKAJIMA

Inventor： Shigeo NAKAJIMA

IPC: H01L23/49 ,  H05K1/00 ,  H05K3/00

CPC classification number: H01L23/49833 ,  H01L21/4853 ,  H01L23/49861 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15312 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/10318 ,  H05K2201/10424 ,  Y02P70/613 ,  Y10T29/49147 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor product is constructed of a wiring substrate in which pads for pin connection are formed, and a substrate with pins in which pins are disposed. The substrate with the pins is formed so that one end of the pin is exposed to one surface of a resin substrate formed by resin molding and the other end of the pin extends from the other surface of the resin substrate and one end of the pin is bonded to a pad of the wiring substrate through a conductive material.

Abstract translation: 半导体产品由其中形成用于引脚连接的焊盘的布线基板和具有销钉的引脚的基板构成。 具有销的基板形成为使得销的一端暴露于通过树脂成型形成的树脂基板的一个表面，并且销的另一端从树脂基板的另一个表面延伸，并且销的一端为 通过导电材料结合到布线基板的焊盘。

公开(公告)号：US20080142944A1

公开(公告)日：2008-06-19

申请号：US11953365

申请日：2007-12-10

Applicant: Kiyoshi Oi ,  Teruaki Chino

Inventor： Kiyoshi Oi ,  Teruaki Chino

IPC: H01L23/538 ,  H01L21/58

CPC classification number: H01L25/105 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10719 ,  H05K2201/10946 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: In a stacked package in which a plurality of packages having semiconductor elements mounted on substrates are stacked, while being electrically connected together, by use of connection sections, wherein the connection sections are formed from pillar-like members and solder joint sections and the upper package is supported on the lower package by pillar-like members.

Abstract translation: 在其中通过使用连接部分而电连接在一起的多个具有安装在基板上的半导体元件的封装的堆叠封装中，其中连接部分由柱状部件和焊接部分形成，并且上部封装 由柱状构件支撑在下部封装上。

公开(公告)号：US20070240900A1

公开(公告)日：2007-10-18

申请号：US11689858

申请日：2007-03-22

Applicant: Toshihiko Yokomaku

Inventor： Toshihiko Yokomaku

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H05K3/3463 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16251 ,  H05K1/0262 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3415 ,  H05K3/3457 ,  H05K3/4602 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2224/05599

Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps. This multilayer printed wiring board is easy to mount components, excellent in work efficiency or easy in reworkable process and a mounting method of such multilayer printed wiring board is also provided.

Abstract translation: 多层印刷电路板的部件安装方法包括：多个焊料凸块，用于安装形成在其前后的电子元件，其中当焊料凸块由第一，第二，第三和第四 焊料，第一，第二，第三和第四焊料具有不同的熔点，第一，第二，第三和第四焊料的熔点被排列为第一焊料的熔点，第二焊料的熔点，熔化 第三焊料的点和第四焊料的熔点按照高熔点顺序依次使用，并且第一，第二，第三和第四焊料依次用于以高熔点的顺序焊接电子部件等。 此外，在这种情况下，优选地，具有大体积的焊料凸块应比其它焊料凸块更早地焊接。 该多层印刷电路板容易安装组件，工作效率优异或易于再加工的工艺，并且还提供了这种多层印刷线路板的安装方法。