公开(公告)号：US20110079808A1

公开(公告)日：2011-04-07

申请号：US12777930

申请日：2010-05-11

Applicant: Chung-Chuan Hsieh

Inventor： Chung-Chuan Hsieh

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: A light emitting diode is provided, including an LED chip, a reflector, a lens, a circuit plate, a circuit substrate and an electrical conductivity device. The LED chip is disposed in the reflector and the lens is disposed on the reflector, covering the reflector and the LED chip. The LED chip is electrically connected to the circuit plate. The circuit plate further includes a first through hole therein and the circuit substrate further includes a second through hole therein. The electrical conductivity device passes through the first through hole and the second through hole so that the circuit plate is electrically connect to the circuit substrate. The reflector is installed between the circuit plate and the circuit substrate. The first through hole and the second through hole are not connected to the reflector.

Abstract translation: 提供了一种发光二极管，包括LED芯片，反射器，透镜，电路板，电路基板和导电装置。 LED芯片设置在反射器中，透镜设置在反射器上，覆盖反射器和LED芯片。 LED芯片电连接到电路板。 电路板还包括第一通孔，电路基板还包括第二通孔。 导电性器件通过第一通孔和第二通孔，使得电路板电连接到电路基板。 反射器安装在电路板和电路基板之间。 第一通孔和第二通孔不连接到反射器。

公开(公告)号：US20110036627A1

公开(公告)日：2011-02-17

申请号：US12809841

申请日：2008-12-11

Applicant: Josef Loibl ,  Hermann- Josef Robin ,  Karl Smirra

Inventor： Josef Loibl ,  Hermann- Josef Robin ,  Karl Smirra

IPC: H01L23/48 ,  B23K31/02 ,  B23K26/20 ,  H05K1/09

CPC classification number: H01R43/0221 ,  H01L2924/0002 ,  H05K3/328 ,  H05K3/368 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/10416 ,  H05K2203/107 ,  H01L2924/00

Abstract: A method for producing an electrical connection between a rigid printed circuit board and a metallic contact partner, includes preparing the rigid printed circuit board having at least one copper layer and at least one prepreg layer, bringing the metallic contact partner and the printed circuit board together in such a way that the metallic contact partner is brought into contact with a contact pad on the copper layer of the printed circuit board, forming a cutout in the printed circuit board by removing the prepreg layer in at least one partial region of the contact pad, and irradiating with laser light to form a weld connection between the contact partner and the contact pad. A configuration of a rigid printed circuit board, a metallic contact partner and an electrical connection point, as well as a module having such a configuration, are also provided.

Abstract translation: 一种用于在刚性印刷电路板和金属接触配合体之间制造电连接的方法，包括制备具有至少一个铜层和至少一个预浸料层的刚性印刷电路板，使金属接触对象和印刷电路板在一起 使得金属接触对象与印刷电路板的铜层上的接触焊盘接触，通过在接触垫的至少一个部分区域中去除预浸料层，在印刷电路板中形成切口 并且用激光照射以在接触对象和接触垫之间形成焊接连接​​。 还提供了刚性印刷电路板，金属接触对象和电连接点的配置，以及具有这种结构的模块。

公开(公告)号：US20100326714A1

公开(公告)日：2010-12-30

申请号：US12817562

申请日：2010-06-17

Applicant: Kenji FUKUZONO

Inventor： Kenji FUKUZONO

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0271 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/562 ,  H01L2224/73204 ,  H01L2924/01019 ,  H05K1/181 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49139

Abstract: A printed circuit board include: a printed circuit board main body having a mounting area on a first surface of the printed circuit board main body and a recess being provided at a recess area on a second surface that is a back side of the first surface of the printed circuit board main body, the electronic component being mounted on the mounting area, the recess area being provided to correspond to the mounting area; and a thermal expansion control element being placed in the recess and having a smaller thermal expansion coefficient than the printed circuit board main body.

Abstract translation: 印刷电路板包括：印刷电路板主体，其具有位于印刷电路板主体的第一表面上的安装区域;以及凹部，设置在作为第一表面的第一表面的第二表面的第二表面的凹部 所述印刷电路板主体，所述电子部件安装在所述安装区域上，所述凹部区域设置成对应于所述安装区域; 并且热膨胀控制元件放置在凹部中并且具有比印刷电路板主体更小的热膨胀系数。

公开(公告)号：US20100271780A1

公开(公告)日：2010-10-28

申请号：US12747781

申请日：2007-12-17

Applicant: Martin Schöön

Inventor： Martin Schöön

IPC: H05K7/20 ,  F28F7/00 ,  F28F9/26

CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416

Abstract: The present invention relates to a device adapted in order to decrease stress on connection points between a heat generating source and a substrate. The device 13 comprises a larger heat-dissipating part 7, and at least one smaller heat-dissipating part 6. The larger part 7 is arranged with at least one cavity 8 for housing the at least one smaller part 6. The at least one smaller part 6 is adapted to be attached to at least one heat-generating source 2, and at the same time more mobile in the cavity 8 and/or less affected by changes in temperature than the larger part.

Abstract translation: 本发明涉及一种适于减小发热源和基板之间的连接点上的应力的装置。 装置13包括较大的散热部分7和至少一个较小的散热部分6.较大部分7布置有至少一个用于容纳至少一个较小部分的空腔8。 部分6适于附接到至少一个发热源2，并且同时在空腔8中更可移动，和/或较少地受到较大部分的温度变化的影响。

公开(公告)号：US20100238635A1

公开(公告)日：2010-09-23

申请号：US12789247

申请日：2010-05-27

Applicant: Ruiquan Yang ,  Haiqiang Sheng ,  Hongcai Li

Inventor： Ruiquan Yang ,  Haiqiang Sheng ,  Hongcai Li

IPC: H05K7/00 ,  H05K3/10

CPC classification number: H05K1/0243 ,  H05K1/021 ,  H05K1/024 ,  H05K1/025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/11 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/4688 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10416 ,  H05K2203/063

Abstract: A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.

Abstract translation: 提供印刷电路板（PCB）。 PCB包括被压在一起的第一微波板材料，第二预浸料坯和第三普通板材料。 第一微波板材料，第二预浸料坯和第三普通板材分别设置有开口。 至少两个开口具有不同的尺寸。 在具有不同尺寸的至少两个开口的边界之间的区域中，提供钻孔以穿过该区域中的板材料。 有选择地使用后钻孔。 进一步提供射频装置及其制造方法。 因此，它适用于在同一单板上设计不同的电源模块和其他电路模块，并且与现有的基本PCB制造技术相兼容，这进一步具有低成本，并且可以满足大功率射频 不同频率的电路

公开(公告)号：US20100200984A1

公开(公告)日：2010-08-12

申请号：US12370453

申请日：2009-02-12

Applicant: David Robert Storch

Inventor： David Robert Storch

IPC: H01L23/34

CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10416

Abstract: Adjustable threaded cores for LED thermal management. The cores provide a direct thermal path between a LED and a heat sink while minimizing gaps and stresses between materials. The system includes a heat generating object, a first substrate housing containing a threaded hole beginning adjacent to the heat generating object, a second substrate having compatible threading with the threaded hole, and a third substrate including a heat sink. The second substrate has a higher thermal conductivity in comparison to the first substrate. The threaded hole and threaded core may terminate adjactent to the heat sink or may extent into the heat sink.

Abstract translation: 可调式螺纹内芯，用于LED热管理。 核心在LED和散热片之间提供直接的热路径，同时最小化材料间的间隙和应力。 该系统包括发热物体，第一基底壳体，其包含与发热物体相邻的螺纹孔，具有与螺纹孔相容的螺纹的第二基底和包括散热器的第三基底。 与第一基板相比，第二基板具有更高的热导率。 螺纹孔和螺纹芯可以终止于与散热器相邻或可能扩展到散热器中。

公开(公告)号：US07768793B2

公开(公告)日：2010-08-03

申请号：US11524688

申请日：2006-09-21

Applicant: Minoru Takizawa

Inventor： Minoru Takizawa

IPC: H05K7/00

CPC classification number: H05K3/4614 ,  H05K1/186 ,  H05K3/4046 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/10416 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611

Abstract: According to one embodiment of, a multilayer printed wiring board comprises an electronic part, a mount layer where the electronic part is mounted, a mount layer conductor pattern formed in the mount layer, an opposite layer containing the electronic part between itself and the mount layer, an opposite layer conductor pattern formed on the opposite layer and an electrically conductive connector contained between the mount layer and the opposite layer and electrically connecting the mount layer conductor pattern and the opposite layer conductor pattern to each other.

Abstract translation: 根据一个实施例，多层印刷线路板包括电子部件，安装电子部件的安装层，形成在安装层中的安装层导体图案，在其与安装层之间包含电子部件的相对层 ，形成在相对层上的相对层导体图案和包含在安装层和相对层之间的导电连接器，并将安装层导体图案和相对层导体图案彼此电连接。

公开(公告)号：US20100065307A1

公开(公告)日：2010-03-18

申请号：US12585293

申请日：2009-09-10

Applicant: Shigeki Nagase ,  Motoo Nakai ,  Kouya Yoshida ,  Hiroshi Sumasu ,  Nobuhiro Uchida

Inventor： Shigeki Nagase ,  Motoo Nakai ,  Kouya Yoshida ,  Hiroshi Sumasu ,  Nobuhiro Uchida

IPC: H05K1/16 ,  H05K1/00

CPC classification number: H05K1/021 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/10416 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A multilayer circuit substrate includes: a laminated circuit portion in which conductive layers and resin insulating layers are alternately laminated; and a metal substrate portion, wherein the laminated circuit portion is fixed to the metal substrate portion so that at least part of a lower surface of the laminated circuit portion is in contact with at least part of an upper surface of the metal substrate portion. An electronic component is mounted on the metal substrate portion.

Abstract translation: 多层电路衬底包括：层叠电路部分，其中导电层和树脂绝缘层交替层叠; 以及金属基板部，其中，所述层叠电路部固定在所述金属基板部，使得所述层叠电路部的下表面的至少一部分与所述金属基板部的上表面的至少一部分接触。 电子部件安装在金属基板部分上。

公开(公告)号：US07552530B2

公开(公告)日：2009-06-30

申请号：US11603390

申请日：2006-11-22

Applicant: Marcus Mueller

Inventor： Marcus Mueller

IPC: H05K3/30

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K3/4046 ,  H05K3/429 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2203/0195 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An improved cooling of an electronic component loaded to a printed circuit board, wherein the PCB comprises at its upper side at least one electronic component, and at least one heat conducting member inserted into a through-hole of the PCB, wherein the HCM extends from the upper side to the lower side of the PCB and has a thermal contact to the components.

Abstract translation: 加载到印刷电路板的电子部件的改进的冷却，其中PCB在其上侧包括至少一个电子部件，以及插入到PCB的通孔中的至少一个导热部件，其中，HCM从 PCB的上侧到PCB的下侧，并且与部件具有热接触。

公开(公告)号：US20090002996A1

公开(公告)日：2009-01-01

申请号：US11823696

申请日：2007-06-28

Applicant: Shen-Yuan Wu

Inventor： Shen-Yuan Wu

IPC: F21V29/00

CPC classification number: F21V29/89 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/4046 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: A heat-dissipating device has a circuit board, two layers of heat-dissipating paste and a heat-dissipating metal block. The circuit board has a light emitting diode mounting segment, multiple through holes, multiple metal rods and multiple electrical nodes. The through holes are defined through the circuit board and are arranged in the light emitting diode mounting segment. The metal rods are mounted respectively in the through holes. The electrical nodes are mounted on the top around the light emitting diode mounting segment. The first layer of heat-dissipating paste is coated on the light emitting diode mounting segment and contacts with the metal rods in the through holes. The heat-dissipating metal block is attached to the bottom of the circuit board. The second layer of heat-dissipating device is mounted between the circuit board and the metal block and contacts with the metal rods.

Abstract translation: 散热装置具有电路板，两层散热膏和散热金属块。 电路板具有发光二极管安装段，多个通孔，多个金属杆和多个电节点。 通孔通过电路板定义并布置在发光二极管安装段中。 金属棒分别安装在通孔中。 电气节点安装在发光二极管安装段周围的顶部。 第一层散热膏涂在发光二极管安装段上，并与通孔中的金属杆接触。 散热金属块安装在电路板的底部。 第二层散热装置安装在电路板和金属块之间，并与金属棒接触。