公开(公告)号：US20150082626A1

公开(公告)日：2015-03-26

申请号：US14258985

申请日：2014-04-22

Applicant: Permlight Products, Inc.

Inventor： John Popovich ,  Gregory W. Honegger

IPC: F21V15/01 ,  H05K3/32 ,  F21K99/00

CPC classification number: F21V29/70 ,  A47C7/725 ,  F21K9/00 ,  F21K9/60 ,  F21K9/90 ,  F21V7/0025 ,  F21V7/005 ,  F21V19/001 ,  F21V29/507 ,  F21V29/74 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10598 ,  Y10S362/80 ,  Y10T29/49133 ,  Y10T29/49826

Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

Abstract translation: 提供了一种模块化发光二极管（LED）安装配置，其包括具有以串联阵列布置的多个预先封装的LED的光源模块。 该模块包括适于将由LED产生的热量传导到相邻散热器的导热体部分。 因此，LED能够以比正常允许的更高的电流工作。 因此，增加LED的亮度和性能而不降低LED的寿命。 LED模块可用于采用一个或多个模块的各种照明应用。

公开(公告)号：US20150060126A1

公开(公告)日：2015-03-05

申请号：US14015938

申请日：2013-08-30

Applicant: Apple Inc.

Inventor： Shayan Malek ,  John B. Ardisana, II ,  Dhaval N. Shah

IPC: H05K1/11

CPC classification number: H05K1/0284 ,  H05K1/115 ,  H05K1/141 ,  H05K3/36 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2203/061

Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.

Abstract translation: 所描述的实施例通常涉及电子设备和用于增加与其相关联的电路板上的可用空间的三维模块。 在一些实施例中，模块可以具有长方体几何形状，并且可以包括多个表面，其具有被配置为互连布置在模块的各个表面上的电子部件的嵌入式电路迹线。 模块的一个表面可以包括至少一个通信接口，其被配置为将模块上的电路迹线互连到与模块耦合到的电路板上的相关联的电路路径。 在一些实施例中，该模块可以作为电路板和电子设备的另一个组件之间的间隔来操作。

公开(公告)号：US08741411B2

公开(公告)日：2014-06-03

申请号：US12696404

申请日：2010-01-29

Applicant: Takahiro Yada

Inventor： Takahiro Yada

IPC: B32B3/30 ,  B32B3/02 ,  B32B3/06 ,  B32B7/04 ,  B32B7/12 ,  H05K1/18 ,  H05K5/02 ,  H05K7/14 ,  H05K7/18

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T156/1002 ,  Y10T156/1066 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/24612

Abstract: A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.

Abstract translation: 一种用于制造具有框架部分和连接到框架部分的多个部分的多片板的方法包括：从用于框架部分的制造面板形成框架部分，通过检查片段的质量来分选多个可接受片段， 在框架部分和可接受的片部分中形成切口部分，使得切口部分允许相对于框架部分布置可接受的片部分，将片部分和框架部分临时固定在相应的位置，将粘合剂注入 当框架部分和片段彼此临时固定时，由切口部分形成的空腔，以及通过固化注入到空腔中的粘合剂将可接受片段与框架部分接合。

公开(公告)号：US08572839B2

公开(公告)日：2013-11-05

申请号：US12500041

申请日：2009-07-09

Applicant: Yasushi Hasegawa

Inventor： Yasushi Hasegawa

IPC: H05K3/20

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/0169 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/166 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49789 ,  Y10T29/49895

Abstract: A fabrication method for a multi-piece board having a frame part and multi piece parts each having a printed wiring board includes producing the frame part having a first coupling portion, and the multi-piece parts including piece parts each having a second coupling portion coupled to the first coupling portion at a production panel with at least the frame part and the piece parts being separated from each other, separating the frame part and the multi-piece parts from the production panel, and coupling the first coupling portion to the second coupling portion to couple the frame part and the piece parts and combine the frame part and the multi piece parts so as to yield the multi-piece board.

Abstract translation: 一种具有框架部分和多片部分的多片板的制造方法，每个具有印刷线路板包括制造具有第一联接部分的框架部分，并且所述多片部件包括件部件，每个部件具有联接的第二联接部分 在至少框架部分和零件彼此分离的生产面板处的第一联接部分处，将框架部分和多件部件与生产面板分离，并将第一联接部分连接到第二联接器 联接框架部分和零件，并且组合框架部分和多件部件以产生多片板。

公开(公告)号：US08535623B2

公开(公告)日：2013-09-17

申请号：US12762510

申请日：2010-04-19

Applicant: Hidehiro Nakamura

Inventor： Hidehiro Nakamura

IPC: B01L99/00 ,  H01R13/15

CPC classification number: H05K13/00 ,  G01D1/00 ,  G01D15/00 ,  H05K1/028 ,  H05K1/118 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2203/061 ,  H05K2203/167

Abstract: A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

Abstract translation: 一种制造凹形连接器基板的方法包括：准备具有将板状连接器引导到连接位置和切割部分的引导/保持区域的引导基板的步骤; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合 布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。

公开(公告)号：US20130182385A1

公开(公告)日：2013-07-18

申请号：US13876841

申请日：2011-02-04

Applicant: Karstein Kristiansen ,  Kjetil Zsolt Volent

Inventor： Karstein Kristiansen ,  Kjetil Zsolt Volent

IPC: G06F1/16

CPC classification number: G06F1/16 ,  H05K1/141 ,  H05K3/301 ,  H05K7/12 ,  H05K2201/10159 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10606

Abstract: A subsea control system may include a computer unit including a printed circuit board that contains a central processing unit, and a socket for holding at least one memory card, whereby the computer unit has a screw hole, a wedged plate is fixed above at least a part of the socket by a screw which is screwed into the screw hole for fixing the at least one memory card placed in the socket.

Abstract translation: 海底控制系统可以包括包括中央处理单元的印刷电路板和用于保持至少一个存储卡的插座的计算机单元，由此计算机单元具有螺孔，楔形板固定在至少一个 该插座的一部分被螺钉拧入螺钉孔中，用于固定放置在插座中的至少一个存储卡。

公开(公告)号：US08453324B2

公开(公告)日：2013-06-04

申请号：US13306811

申请日：2011-11-29

Applicant: Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

Inventor： Rui-Wu Liu ,  Yung-Wei Lai ,  Shing-Tza Liou

IPC: H01K3/10

CPC classification number: H05K3/4084 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10598 ,  H05K2203/0165 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.

Abstract translation: FPCB基板的制造方法包括以下步骤。 首先，提供一种包含绝缘层和形成在绝缘层上的导电层的FPCB材料。 导电层具有第一表面和相对的第二表面。 绝缘层具有第三表面和相对的第四表面。 第三表面与第二表面接触。 其次，形成从第一表面延伸到第四表面的通孔。 通孔包括导电层中的金属孔和绝缘层中的绝缘孔。 第三，扩大绝缘孔，使金属孔周围的一部分导电层露出。 最后，暴露部分被弯曲以形成通过扩大的绝缘孔并从绝缘层的第四表面突出的钩。

公开(公告)号：US20130058109A1

公开(公告)日：2013-03-07

申请号：US13665227

申请日：2012-10-31

Applicant: Toshiba Lighting & Technology Corporation ,  Kabushiki Kaisha Toshiba

Inventor： Takayoshi Moriyama ,  Kazunari Higuchi ,  Sumio Hashimoto ,  Shinichi Kumashiro

IPC: F21V29/00 ,  F21V21/00

CPC classification number: F21V29/00 ,  F21S8/026 ,  F21V17/12 ,  F21V19/0035 ,  F21V19/0055 ,  F21V21/00 ,  F21V29/50 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0271 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus. In some examples, the substrate may include a surface on which a plurality of light-emitting elements are mounted and stress absorbing elements arranged on imaginary straight lines connecting portions for mounting the substrate with each other.

Abstract translation: 描述了安装有多个发光元件的基板。 基板可以安装在照明装置中。 在一些示例中，基板可以包括其上安装有多个发光元件的表面，并且将应力吸收元件布置在连接用于将基板安装的部分的假想直线上。

公开(公告)号：US08366946B2

公开(公告)日：2013-02-05

申请号：US12550289

申请日：2009-08-28

Applicant: Jason Douglas Ferguson

Inventor： Jason Douglas Ferguson

IPC: H01B13/00

CPC classification number: H01L21/67346 ,  B23Q3/062 ,  B23Q2240/005 ,  B25B11/002 ,  H01L21/6708 ,  H01L21/67757 ,  H01L21/6776 ,  H05K1/0393 ,  H05K3/0085 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/104 ,  Y10T29/49998

Abstract: A rigid holder is provided for supporting a flexible article. The rigid holder may include a first frame member and a second frame member which are held together through magnets.

Abstract translation: 提供用于支撑柔性制品的刚性保持器。 刚性保持器可以包括通过磁体保持在一起的第一框架构件和第二框架构件。

公开(公告)号：US20130003325A1

公开(公告)日：2013-01-03

申请号：US13635328

申请日：2011-03-10

Applicant: Gerhard Freydl ,  Christian Vockenberger

Inventor： Gerhard Freydl ,  Christian Vockenberger

IPC: H05K5/00 ,  H05K3/36

CPC classification number: H05K3/0097 ,  H05K2201/10598 ,  H05K2203/0165 ,  H05K2203/0169 ,  Y10T29/49126

Abstract: In a method for processing or treating a plurality of printed circuit boards, comprising the following steps: providing a plurality of printed circuit boards (4, 5, 6, 7). providing at least one frame or carrier element (2, 3), for coupling to a plurality of printed circuit boards (4, 5, 6, 7), coupling or connecting the printed circuit boards (4, 5, 6, 7) to the at least one frame or carrier element (2, 3), processing or treating the printed circuit boards (4, 5, 6, 7) in the state coupled to the frame or carrier element (2, 3), it is provided that printed circuit boards (4, 5, 6, 7) of different sizes and/or thicknesses and/or of different constructions are coupled to the at least one frame or carrier element (2, 3) to form a composite assembly (1) and are subjected to further processing in the composite assembly (1) formed by the printed circuit boards (4, 5, 6, 7) and the at least one frame or carrier element (2, 3). Furthermore, a composite assembly (1) for processing or treating a plurality of printed circuit boards (4, 5, 6, 7) and also a use of such a method and composite assembly (1) are provided.

Abstract translation: 在一种用于处理或处理多个印刷电路板的方法中，包括以下步骤：提供多个印刷电路板（4,5,6,7）。 提供至少一个框架或载体元件（2,3），用于联接到多个印刷电路板（4,5,6,7），将印刷电路板（4,5,6,7）连接或连接到 所述至少一个框架或载体元件（2,3）处理或处理在耦合到所述框架或载体元件（2,3）的状态下的所述印刷电路板（4,5,6,7）时， 具有不同尺寸和/或厚度和/或不同构造的印刷电路板（4,5,6,7）联接到所述至少一个框架或载体元件（2,3）以形成复合组件（1）和 在由印刷电路板（4,5,6,7）和至少一个框架或载体元件（2,3）形成的复合组件（1）中进行进一步处理。 此外，还提供了用于处理或处理多个印刷电路板（4,5,6,7）的复合组件（1）以及这种方法和复合组件（1）的使用。