公开(公告)号：US07751202B2

公开(公告)日：2010-07-06

申请号：US11685269

申请日：2007-03-13

Applicant: Ho-Seong Seo ,  Young-Min Lee ,  Youn-Ho Choi

Inventor： Ho-Seong Seo ,  Young-Min Lee ,  Youn-Ho Choi

IPC: H05K1/11

CPC classification number: H05K1/186 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/9222 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K3/4614 ,  H05K2201/10674 ,  H05K2201/10681

Abstract: Disclosed is a multi-layered printed circuit board including a plurality of insulation layers; a plurality of conductive patterns stacked on the multi-layered printed circuit board while alternating with the insulation layers; an integrated circuit positioned inside a core insulation layer of the insulation layers so as to be embedded in the multi-layered printed circuit board, a plurality of external connection terminal being positioned on a surface of the integrated circuit for external electric connection; and a film attached to a surface of the integrated circuit, the film having a plurality of inner conductive pads in one-to-one electric connection with the external connection terminals, the film being electrically connected to an adjacent conductive pattern layer.

Abstract translation: 公开了一种包括多个绝缘层的多层印刷电路板; 多个导电图案，堆叠在所述多层印刷电路板上，同时与所述绝缘层交替; 集成电路，其位于所述绝缘层的芯绝缘层的内部，以嵌入所述多层印刷电路板中;多个外部连接端子，位于所述用于外部电连接的所述集成电路的表面上; 以及附着到集成电路的表面的膜，所述膜具有多个与所述外部连接端子一对一电连接的内部导电焊盘，所述膜电连接到相邻的导电图案层。

公开(公告)号：US07746439B2

公开(公告)日：2010-06-29

申请号：US11871868

申请日：2007-10-12

Applicant: Akifumi Kohno

Inventor： Akifumi Kohno

IPC: G02F1/1345

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H05K1/148 ,  H05K2201/09063 ,  H05K2201/10681

Abstract: The present invention provides a mounting film for a liquid crystal display drive chip and a method for manufacturing the same. The mounting film is provided with a slit cut from a side edge thereof, or provided with a weakened line for forming the slit. When a distance between a liquid crystal display panel and a control circuit substrate of the liquid crystal display unit is un-uniform, the opening degree of the slit is variable accordingly to accommodate variations in the distance. Such a COF mounting film for a liquid crystal display drive chip may be generally used even though a distance between the liquid crystal display panel and the control circuit substrate varies slightly. Therefore, the manufacturing cost of the liquid crystal display unit may be reduced.

Abstract translation: 本发明提供一种液晶显示驱动芯片的安装膜及其制造方法。 安装膜设置有从其侧边缘切割的狭缝，或设置有用于形成狭缝的弱化线。 当液晶显示面板和液晶显示单元的控制电路基板之间的距离不均匀时，狭缝的开度相应地变化以适应距离的变化。 即使液晶显示面板和控制电路基板之间的距离略有变化，也可以通常使用这种用于液晶显示驱动芯片的COF安装膜。 因此，可以降低液晶显示单元的制造成本。

公开(公告)号：US20100019394A1

公开(公告)日：2010-01-28

申请号：US12312981

申请日：2007-11-30

Applicant: Satoru Kudose ,  Tomokatsu Nakagawa ,  Tatsuya Katoh

Inventor： Satoru Kudose ,  Tomokatsu Nakagawa ,  Tatsuya Katoh

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L23/49833 ,  H01L23/13 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10681 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: In one embodiment of the present invention, an IC chip mounting package includes a film base member and an IC chip connected via an interposer. Connecting terminals on the film base member side of the interposer are provided so as to have a pitch larger than that of connecting terminals of the IC. A device hole is opened to the film base member, and the IC chip is provided in the device hole. A distance between an inner lead leading end and a periphery of the device hole is set as not less than 10 μm.

Abstract translation: 在本发明的一个实施例中，IC芯片安装封装包括通过插入件连接的薄膜基底构件和IC芯片。 插入器的膜基底侧的连接端子设置成具有比IC的连接端子的间距大的间距。 一个设备孔向薄膜基底部件打开，IC芯片设置在设备孔中。 内引线前端与器件孔周边之间的距离设定为10um以上。

公开(公告)号：US20090251446A1

公开(公告)日：2009-10-08

申请号：US12481892

申请日：2009-06-10

Applicant: Kazuhiro Ogawa ,  Kazuhiko Yanagawa

Inventor： Kazuhiro Ogawa ,  Kazuhiko Yanagawa

IPC: G09G3/36 ,  G09G5/00

CPC classification number: G02F1/13452 ,  G02F1/134363 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/244 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10659 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A display device includes a display panel, a printed circuit board, a plurality of semiconductor devices which are film-like substrates with an IC chip, and a monolithic anisotropic conductive film disposed on the printed circuit board. Each of the semiconductor devices has a first side portion and a second side portion opposite to the first side portion. The first side portion is connected to the printed circuit board via the monolithic anisotropic conductive film, and the second side portion is connected to the display panel. Further the first side portion of each of the semiconductor devices is respectively connected at separated portions of the monolithic anisotropic conductive film.

Abstract translation: 显示装置包括显示面板，印刷电路板，作为具有IC芯片的薄膜状基板的多个半导体装置以及布置在印刷电路板上的整体式各向异性导电膜。 每个半导体器件具有与第一侧部相对的第一侧部分和第二侧部分。 第一侧部通过单片式各向异性导电膜与印刷电路板连接，第二侧部与显示面板连接。 此外，每个半导体器件的第一侧部分别分别连接在单片各向异性导电膜的分离部分。

公开(公告)号：US07599193B2

公开(公告)日：2009-10-06

申请号：US10975809

申请日：2004-10-27

Applicant: Sang-Ho Park ,  Sa-Yoon Kang ,  Si-Hoon Lee

Inventor： Sang-Ho Park ,  Sa-Yoon Kang ,  Si-Hoon Lee

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H01L23/49838 ,  G02F1/13452 ,  H01L21/563 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/142 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/09227 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring extends into the chip mount portion through a third side and bends within the chip mount portion toward the second side. The first, second, and third sides are different sides of the chip mount portion. Thus, size and in turn cost of the base film are minimized by arranging wirings within the chip mount portion for further miniaturization of electronic devices, such as a display panel assembly, using the tape circuit substrate.

Abstract translation: 带状电路基板包括具有第一布线的基膜和设置在基膜上的第二布线。 第一布线通过第一侧延伸到芯片安装部分中，并且在芯片安装部分内向第二侧弯曲。 第二布线通过第三侧延伸到芯片安装部分，并且在芯片安装部分内向第二侧弯曲。 第一，第二和第三面是芯片安装部分的不同侧面。 因此，通过在芯片安装部分内布置布线以使得使用带电路基板的诸如显示面板组件的电子设备的进一步小型化来使基膜的尺寸和成本进一步降低。

公开(公告)号：US20090200648A1

公开(公告)日：2009-08-13

申请号：US12069376

申请日：2008-02-08

Applicant: Irvin W. Graves, JR.

Inventor： Irvin W. Graves, JR.

IPC: H01L23/552 ,  H01L21/52 ,  H05K1/03

CPC classification number: H05K1/182 ,  H01L23/13 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/50 ,  H01L24/82 ,  H01L24/86 ,  H01L2224/2402 ,  H01L2224/24227 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1617 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0218 ,  H05K1/0243 ,  H05K2201/09072 ,  H05K2201/09981 ,  H05K2201/10083 ,  H05K2201/10681

Abstract: A method and system is disclosed for facilitating miniaturization of an electronic device by efficiently utilizing available space. Specifically, in an exemplary embodiment, there is provided an electronic device comprising a substrate, a cavity formed in the substrate, and a bridge coupled to the substrate such that it spans the cavity. Further, the device may include a semiconductor device coupled to the bridge such that the semiconductor device is positioned within the cavity. In some embodiments, the bridge may include a tape automated bonding (TAB) tape having various layers, including a layer configured to provide electromagnetic shielding.

Abstract translation: 公开了通过有效地利用可用空间来促进电子设备的小型化的方法和系统。 具体地，在示例性实施例中，提供了一种电子设备，其包括基板，形成在基板中的空腔，以及耦合到基板的桥，使得其跨越空腔。 此外，器件可以包括耦合到桥的半导体器件，使得半导体器件位于腔内。 在一些实施例中，桥可以包括具有各种层的带自动接合（TAB）带，包括被配置为提供电磁屏蔽的层。

公开(公告)号：US20090167735A1

公开(公告)日：2009-07-02

申请号：US12125168

申请日：2008-05-22

Applicant: Sang Gon Lee ,  Dae Sung Kim ,  Woo Hyuck Chang

Inventor： Sang Gon Lee ,  Dae Sung Kim ,  Woo Hyuck Chang

IPC: G09G5/00 ,  B32B7/02 ,  H05K1/09 ,  H05K7/06 ,  B32B15/08 ,  H05K1/00

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2924/12044 ,  H05K3/181 ,  H05K3/388 ,  H05K2201/0191 ,  H05K2201/10681 ,  Y10T428/2495 ,  Y10T428/31681

Abstract: A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the ratio of the thickness of the metal layer to the thickness of the dielectric film is about 1:1.5 to 1:10. The flexible film has excellent plating, adhesive strength, thermal resistance, folding endurance and chemical resistance properties.

Abstract translation: 提供柔性膜。 柔性膜包括电介质膜; 以及设置在所述电介质膜上的金属层，其中所述金属层的厚度与所述电介质膜的厚度之比为约1:1.5至1:10。 柔性膜具有优异的电镀，粘合强度，耐热性，耐折性和耐化学性。

公开(公告)号：US07503767B2

公开(公告)日：2009-03-17

申请号：US11496467

申请日：2006-08-01

Applicant: Deepak Pai

Inventor： Deepak Pai

IPC: H01R12/00

CPC classification number: H01R12/523 ,  H05K1/144 ,  H05K1/147 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10681 ,  H05K2201/10946 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922 ,  Y10T29/53183

Abstract: A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.

Abstract translation: 提供了一种用于连接电路板的系统。 多个重叠间隔开的电路板具有穿过电路板中的孔的多个导电引脚。 连接器包括柔性片绝缘体和由柔性绝缘体分离和支撑的多个导电表面。 导电表面中的至少一个在其上具有孔和从其延伸的弯曲柔顺引线。 该孔接合其中一个引脚，投诉引线连接到其中一个电路板。

公开(公告)号：US20090065934A1

公开(公告)日：2009-03-12

申请号：US12232099

申请日：2008-09-10

Applicant: Ye-Chung Chung ,  Don-Han Kim

Inventor： Ye-Chung Chung ,  Don-Han Kim

IPC: H01L23/485 ,  H01L21/60 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/111 ,  H01L23/4985 ,  H01L24/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15173 ,  H05K1/189 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09709 ,  H05K2201/10674 ,  H05K2201/10681 ,  Y02P70/611 ,  Y10T29/49155

Abstract: A wiring substrate may include a base film, a plurality of wires, a first insulation member and a second insulation member. The base film may have a chip-mounting region where a semiconductor chip may be mounted thereon. The wires may extend from the chip-mounting region and the wires may include adhesive end portions that may be electrically connected to the semiconductor chip. The first insulation member may cover portions of the wires outside the chip-mounting region thereof. The second insulation member may cover portions of the wire inside the chip-mounting region, the adhesive end portion of the wire being exposed by the second insulation member.

Abstract translation: 布线基板可以包括基膜，多根导线，第一绝缘构件和第二绝缘构件。 基膜可以具有可以在其上安装半导体芯片的芯片安装区域。 电线可以从芯片安装区域延伸，并且电线可以包括可以电连接到半导体芯片的粘合剂端部。 第一绝缘构件可以覆盖其芯片安装区域外部的电线的部分。 第二绝缘构件可以覆盖芯片安装区域内的线的部分，线的粘合端部被第二绝缘构件暴露。

公开(公告)号：US20080293168A1

公开(公告)日：2008-11-27

申请号：US12220711

申请日：2008-07-28

Applicant: Nick A. Youker ,  Ronald L. Anderson ,  John E. Hansen

Inventor： Nick A. Youker ,  Ronald L. Anderson ,  John E. Hansen

IPC: H01L21/66

CPC classification number: H05K1/189 ,  A61N1/375 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/113 ,  H05K3/4069 ,  H05K2201/10545 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.

Abstract translation: 一种胶带自动接合（TAB）结构，其包括在其上形成导电图案的柔性带。 导电引线图形包括多个引线，其被配置为形成TAB结构的内部引线键合（ILB）部分。 所述多个引线中的至少一个在内部布线并且具有暴露在TAB结构的ILB部分内部的触点。