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公开(公告)号：US09888566B2
公开(公告)日：2018-02-06
申请号：US14589004
申请日：2015-01-05
Applicant: PPG Industries Ohio, Inc.
Inventor： John R. Short
CPC classification number: H05K1/0274 , H05B3/84 , H05B2203/016 , H05K1/0271 , H05K1/0306 , H05K1/09 , H05K2201/0326 , H05K2201/0338 , H05K2201/0355 , H05K2201/10272
Abstract: A transparency having a bus bar system includes a non-conductive substrate having a major surface. At least one conductive coating is located over at least a portion of the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is located over at least a portion of the conductive coating. A metallic member, such as a metallic foil or metallic braid, is located over the isotropically conductive adhesive.
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152.发明授权公开(公告)号：US09867288B2
公开(公告)日：2018-01-09
申请号：US14386637
申请日：2013-03-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Seol Hee Lim
CPC classification number: H05K1/05 , C25D3/14 , C25D3/16 , C25D5/022 , C25D5/12 , H01L2224/45144 , H01L2224/48091 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/244 , H05K2201/0104 , H05K2201/032 , H05K2201/0338 , H05K2201/10159 , H05K2203/049 , H01L2924/00014 , H01L2924/00
Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.
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公开(公告)号：US20170311446A1
公开(公告)日：2017-10-26
申请号：US15253615
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon DODD , Roberto BRIOSCHI
CPC classification number: H05K1/181 , B81C1/0023 , H01L2924/1461 , H05K1/0272 , H05K1/0293 , H05K1/0306 , H05K1/111 , H05K3/10 , H05K3/4007 , H05K2201/0175 , H05K2201/0338 , H05K2201/0391 , H05K2201/09727 , H05K2201/09763 , H05K2201/09827 , H05K2201/10083 , H05K2201/10159 , H05K2201/10181 , H05K2203/171 , H05K2203/175
Abstract: The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.
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公开(公告)号：US20170229635A1
公开(公告)日：2017-08-10
申请号：US15425607
申请日：2017-02-06
Applicant: NITTO DENKO CORPORATION
Inventor： Takahiro TAKANO , Takatoshi SAKAKURA , Tomoaki OKUNO
IPC: H01L41/053 , G11B5/48 , H05K1/18 , H05K1/11 , H05K1/09
CPC classification number: H01L41/053 , G11B5/4826 , H01L41/0475 , H01L41/29 , H05K1/09 , H05K1/111 , H05K1/181 , H05K3/244 , H05K3/3405 , H05K3/3463 , H05K2201/0338 , H05K2201/10007
Abstract: The wired circuit board includes a conductive layer having a terminal; a gold plated layer provided on the surface of the terminal; and a solder layer provided on the surface of the gold plated layer and provided so that the terminal and the electronic component can be electrically connected. The solder layer is made of a solder composition containing Sn, Bi, Cu and/or Ni, and the thickness Tsolder of the solder layer relative to the thickness TAu of the gold plated layer is 16 or more.
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公开(公告)号：US09724896B2
公开(公告)日：2017-08-08
申请号：US14919357
申请日：2015-10-21
Applicant: JX NIPPON MINING & METALS CORPORATION
Inventor： Hajime Momoi , Satoru Morioka , Toshiyuki Ono , Hideta Arai , Ryo Fukuchi , Atsushi Miki
IPC: H01L23/373 , H05K1/03 , B32B15/08 , B32B15/20 , B32B15/01 , B32B37/02 , C25D7/06 , H05K1/09 , H05K3/02 , B32B7/12 , B32B15/18 , B32B27/18 , B32B27/20 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/38 , B32B15/04
CPC classification number: B32B15/20 , B32B3/263 , B32B7/12 , B32B15/01 , B32B15/043 , B32B15/08 , B32B15/18 , B32B27/18 , B32B27/20 , B32B27/281 , B32B27/304 , B32B27/322 , B32B27/34 , B32B27/36 , B32B27/38 , B32B37/02 , B32B38/10 , B32B2255/06 , B32B2255/205 , B32B2255/26 , B32B2307/202 , B32B2307/302 , B32B2307/538 , B32B2457/00 , B32B2457/08 , B32B2457/20 , B32B2457/202 , C22C9/06 , C25D3/12 , C25D3/38 , C25D7/06 , C25D7/0614 , C25D9/08 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H01M4/662 , H01R13/03 , H05K1/0204 , H05K1/09 , H05K3/025 , H05K3/108 , H05K2201/0338 , H05K2201/0355 , H05K2201/0358 , H01L2924/00
Abstract: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.
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Patent Agency Ranking
公开(公告)号：US09689852B2
公开(公告)日：2017-06-27
申请号：US15175127
申请日：2016-06-07
Applicant: General Electric Company
Inventor： Radislav Alexandrovich Potyrailo , Yongjae Lee
IPC: G01R33/385 , H03K17/955 , G01N33/00 , G01N27/02 , H05K1/16
CPC classification number: G01N33/0031 , G01N27/026 , H05K1/16 , H05K2201/0338 , H05K2201/09263 , H05K2201/10151 , Y10T29/4913
Abstract: A sensing system for selective analyte detection in presence of interferences is presented. The sensing system includes an inductor-capacitor-resistor (LCR) resonant sensor includes a substrate, a plurality of first sensing elements mutually spaced apart and disposed on the substrate, a plurality of second sensing elements, each second sensing element disposed overlapping a corresponding first sensing element of the plurality of second sensing elements, and a protecting film applied onto the plurality of first sensing elements and the plurality of second sensing elements, wherein the protecting film is disposed to be in a physical contact with the analyte and is configured to enable an operational contact of the plurality of first sensing elements and the plurality of second sensing elements with the analyte.
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157.发明申请公开(公告)号：US20170135206A1
公开(公告)日：2017-05-11
申请号：US15319997
申请日：2015-06-24
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Hiroshi UEDA , Kousuke MIURA
Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive pattern formed on at least one of surfaces of the base film, wherein at least a portion of the conductive pattern includes a core body, and a shrink layer formed by plating on an outer surface of the core body. The portion of the conductive pattern preferably has a striped configuration or a spiral configuration. The portion of the conductive pattern preferably has an average circuit gap width of 30 μm or less. The portion of the conductive pattern preferably has an average aspect ratio of 0.5 or more. The plating is preferably electroplating or electroless plating.
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公开(公告)号：US09622344B2
公开(公告)日：2017-04-11
申请号：US14391748
申请日：2013-02-28
Applicant: KABUSHIKI KAISHA NIHON MICRONICS
Inventor： Tatsuo Inoue , Takayasu Sugai , Toshiyuki Kudo , Toshinori Omori
CPC classification number: H05K1/0298 , H05K1/0233 , H05K1/0242 , H05K1/025 , H05K1/09 , H05K3/46 , H05K2201/0154 , H05K2201/0338 , H05K2201/0391 , H05K2201/0776 , H05K2201/0792 , H05K2201/083 , Y10T29/49155
Abstract: A multi-layer wiring board includes wiring layers stacked on a substrate with an insulating layer between each layer. A wire formed in the wiring layer consists of a first layer and a second layer to form a double layered structure. The first layer is made of a first conductive material and the second layer is made of a second conductive material having relative magnetic permeability of 10 or more and larger than that of the first conductive material. The characteristic impedance of the wire is adjusted to a value closer to 50 ohms than that of a wire which has the same thickness as of the wire with the double layered structure, and is made only of the first conductive material.
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159.发明授权公开(公告)号：US09603258B2
公开(公告)日：2017-03-21
申请号：US14819150
申请日：2015-08-05
Applicant: UYEMURA INTERNATIONAL CORPORATION
Inventor： Jon E. Bengston
CPC classification number: C23C18/44 , C23C18/1637 , C23C18/1651 , C23C18/54 , H05K1/09 , H05K1/118 , H05K3/187 , H05K3/244 , H05K2201/0338
Abstract: A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
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公开(公告)号：US20170079147A1
公开(公告)日：2017-03-16
申请号：US15259226
申请日：2016-09-08
Applicant: NEC Space Technologies, Ltd,
Inventor： Bunsuke OGAWA
CPC classification number: H05K3/3457 , B23K1/0016 , B23K20/026 , B23K35/0244 , B23K35/26 , B23K35/268 , B23K2101/38 , H01L31/042 , H02S40/36 , H05K1/09 , H05K1/181 , H05K3/3494 , H05K2201/0338 , Y02E10/50
Abstract: [Problem] Even if heat cycles are applied, degradation of joint strength is restrained.[Solution to problem] Lead solder joint structure, in which a first member is joined to a second member using lead solder, the structure comprising: a first solder layer that includes the first member as a core; a second solder layer that exists between the first solder layer and the second member and joins the first solder layer and the second member together; and a third solder layer that exists between the second solder layer and the second member.
Abstract translation: [问题的解决方案]引线焊点结构，其中第一部件使用铅焊料接合到第二部件，该结构包括：第一焊料层，其包括作为芯的第一部件; 第二焊料层，存在于第一焊料层和第二部件之间，并将第一焊料层和第二部件连接在一起; 以及存在于第二焊料层和第二部件之间的第三焊料层。
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