公开(公告)号：US20090168348A1

公开(公告)日：2009-07-02

申请号：US11967756

申请日：2007-12-31

Applicant: Fabien Letourneau ,  Stefano DeCecco ,  Peter Serjak

Inventor： Fabien Letourneau ,  Stefano DeCecco ,  Peter Serjak

IPC: H05K7/20 ,  H05K1/00

CPC classification number: H05K3/303 ,  H01L23/467 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/301 ,  H05K2201/09072 ,  H05K2201/09127 ,  H05K2201/10522 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.

Abstract translation: 用于提供高密度组件组件的装置和方法，例如机电或电光组件。

公开(公告)号：US20090084583A1

公开(公告)日：2009-04-02

申请号：US12122211

申请日：2008-05-16

Applicant: Yukihiro UENO

Inventor： Yukihiro UENO

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/4691 ,  H05K1/117 ,  H05K1/148 ,  H05K3/4652 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/2009 ,  Y10T29/49147

Abstract: Provided is a multilayer printed wiring board having a terminal portion of high quality. This multilayer printed wiring board has a flexible portion having flexibility, the flexible portion that can be bent when used, a rigid portion formed continuously with the flexible portion, the rigid portion having greater rigidity than the flexible portion, and a terminal portion formed continuously with the flexible portion at an end portion of the flexible portion. The rigid portion includes a rigid layer having insulation properties. The terminal portion includes an insulating layer formed of the same material as that for the rigid layer, the insulating layer having a conductive layer formed on the surface thereof, the conductive layer having a predetermined terminal pattern and serving as a connecting terminal.

Abstract translation: 提供一种具有高质量端子部分的多层印刷线路板。 该多层印刷布线板具有挠性部分，柔性部分可在使用时弯曲，柔性部分与柔性部分连续形成，刚性部分具有比挠性部分更大的刚性，以及连接部分形成的端部部分 柔性部分的柔性部分。 刚性部分包括具有绝缘性质的刚性层。 端子部分包括由与刚性层相同的材料形成的绝缘层，绝缘层在其表面上形成有导电层，导电层具有预定的端子图案并用作连接端子。

公开(公告)号：US20090038831A1

公开(公告)日：2009-02-12

申请号：US12187654

申请日：2008-08-07

Applicant: Shu-Yuan Hsueh ,  Chiu-Chuan Ho

Inventor： Shu-Yuan Hsueh ,  Chiu-Chuan Ho

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K3/222 ,  H05K1/0286 ,  H05K3/0052 ,  H05K2201/09072 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10189 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A printed circuit board includes a main board part, a reserved board part, a connecting part and a groove. The main board part has a first extending circuit. The reserved board part has a second extending circuit corresponding to the first extending circuit. The connecting part connects the main board part and the reserved board part. The groove is located between the main board part and the reserved board part to prevent the first extending circuit from being electrically connected to the second extending circuit. When the reserved board part needs to be removed, the main board part may be separated from the reserved board part by the groove.

Abstract translation: 印刷电路板包括主板部分，预约板部分，连接部分和凹槽。 主板部分具有第一延伸电路。 保留板部分具有对应于第一延伸电路的第二延伸电路。 连接部分连接主板部分和预留板部分。 槽位于主板部分和预留板部分之间，以防止第一延伸电路电连接到第二延伸电路。 当预留的板部分需要去除时，主板部分可以通过凹槽与保留的板部分分离。

公开(公告)号：US20090023309A1

公开(公告)日：2009-01-22

申请号：US11778903

申请日：2007-07-17

Applicant: Lawrence R. Knapp ,  Charles D. Cosner ,  Karl B. Randall ,  Steven A. Everly

Inventor： Lawrence R. Knapp ,  Charles D. Cosner ,  Karl B. Randall ,  Steven A. Everly

IPC: H05K1/00 ,  H01R12/00

CPC classification number: H05K1/18 ,  H05K1/0295 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2203/175

Abstract: According to an example embodiment of the invention, a configurable printed circuit board (PCB) includes one or more separable portions for supporting modules for interfacing with the PCB. The separable portions extend from an edge portion of a main body of the PCB, and are disposed between the main body of the PCB and a protective portion. A scored portion is provided at a boundary between the main body of the PCB and the separable portions, the separable portions being separable by being broken off from the main body of the PCB at the scored portion. According to an example embodiment of the invention, a method of configuring a PCB having one or more separable portions of the PCB includes securing the PCB and separating the one or more separable portions of the PCB from another portion of the PCB.

Abstract translation: 根据本发明的示例性实施例，可配置印刷电路板（PCB）包括用于支撑用于与PCB接口的模块的一个或多个可分离部分。 可分离部分从PCB的主体的边缘部分延伸，并且设置在PCB的主体和保护部分之间。 在PCB的主体和可分离部分之间的边界处设置有刻痕部分，可分离部分通过在刻痕部分处从PCB的主体断开而分离。 根据本发明的示例实施例，一种配置具有PCB的一个或多个可分离部分的PCB的方法包括固定PCB并将PCB的一个或多个可分离部分与PCB的另一部分分开。

公开(公告)号：US20090008760A1

公开(公告)日：2009-01-08

申请号：US12233170

申请日：2008-09-18

Applicant: Yun-Lung Tsai ,  Yu-Chieh Tsai ,  Chien-Chih Chen ,  Chien-Ping Huang

Inventor： Yun-Lung Tsai ,  Yu-Chieh Tsai ,  Chien-Chih Chen ,  Chien-Ping Huang

IPC: H01L21/52 ,  H01L23/04

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L23/04 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/15162 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/284 ,  H05K2201/09127 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.

Abstract translation: 提供半导体器件及其制造方法。 具有至少一个倾斜侧的开口形成在基板上。 至少一个芯片和至少一个无源部件安装在基板上。 在基板上形成具有切口角的密封剂，以封装芯片和无源部件，其中密封剂的切口角与开口的倾斜侧隔开预定距离。 进行切割处理以切割密封剂以形成具有倒角的包装。 封装被嵌入盖子中以形成半导体器件，其中位于开口的倾斜侧和密封剂的切除角之间的基底的一部分从密封剂暴露出来以形成暴露部分。 本发明还提供了一种用于半导体器件的载体。

公开(公告)号：US20080257587A1

公开(公告)日：2008-10-23

申请号：US11785601

申请日：2007-04-19

Applicant: Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/14

CPC classification number: H05K3/4691 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.

Abstract translation: 刚性柔性PCB包括至少一个刚性PCB（RPCB）和至少一个柔性PCB（FPCB）。 每个RPCB都有一个连接部分; 第一和第二部分分别从连接部分的两个侧边缘延伸并且每个具有至少一个FPCB接合侧; 以及沿着连接部分和第一和第二部分的每个接头形成的弱化结构。 每个FPCB具有对应于RPCB上的连接部分的弯曲部分; 第一和第二部分分别从弯曲部分的两个侧边缘延伸并且具有至少一个RPCB接合侧，每个RPCB接合侧对应于RPCB的第一和第二部分的FPCB接合侧。 当对弱化结构施加适当的压力时，RPCB可以容易地在弱化结构处弯曲断裂以从其中移除连接部分。

公开(公告)号：US20080236890A1

公开(公告)日：2008-10-02

申请号：US12053570

申请日：2008-03-22

Applicant: Hiroto Sugahara

Inventor： Hiroto Sugahara

IPC: H01B13/00 ,  H01R43/00

CPC classification number: H05K3/361 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2002/14491 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/321 ,  H05K3/3405 ,  H05K3/3415 ,  H05K3/363 ,  H05K3/4069 ,  H05K2201/09127 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/013 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the substrate. Further, a droplet of an electroconductive liquid is made to land on the recess, and the liquid is filled in the through hole via the groove. Next, the liquid filled in the groove, the recess, and the through hole is heated to harden. Further, the recess and the groove of the substrate are removed by cutting up to an area near the through hole. Accordingly, it is possible to connect electrically the connecting bodies arranged on both surfaces of the substrate by filling an electroconductive material in the through holes easily.

Abstract translation: 凹槽和与槽连通的凹部形成在基板中。 接着，形成与槽连通的通孔。 此后，在基板的上表面上形成导线，并且在基板的下表面上设置单独的电极。 此外，使导电液体的液滴落在凹部上，并且液体经由凹槽填充在通孔中。 接下来，将填充在槽，凹部和通孔中的液体加热硬化。 此外，通过切割到通孔附近的区域来去除基板的凹部和凹槽。 因此，可以容易地在通孔中填充导电材料来电连接布置在基板的两个表面上的连接体。

公开(公告)号：US20080171139A1

公开(公告)日：2008-07-17

申请号：US11972533

申请日：2008-01-10

Applicant: Yukihiro UENO ,  Yuhji TAKAMOTO

Inventor： Yukihiro UENO ,  Yuhji TAKAMOTO

IPC: B05D5/12

CPC classification number: H05K3/4691 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/09127 ,  H05K2203/0191 ,  H05K2203/0264

Abstract: In one embodiment, an inner layer circuit pattern portion and a lead pattern portion are formed, an outer layer base material is prepared, an interlayer adhesive layer to which has been affixed in advance an inner layer separation film is prepared, the interlayer adhesive layer is layered on the outer layer base material, a molded inner layer separation film is formed by molding the inner layer separation film, the molded inner layer separation film is positioned on the lead pattern portion and the outer layer base material is layered on the inner layer base material with interposition of the interlayer adhesive layer, a conductor layer of the outer layer base material is patterned to form an outer layer circuit pattern portion, and the molded inner layer separation film is separated from the inner layer base material to remove the interlayer adhesive layer and the outer layer base material.

Abstract translation: 在一个实施例中，形成内层电路图案部分和引线图案部分，制备外层基材，预先固定内层分离膜的层间粘合剂层，层间粘合剂层为 层叠在外层基材上，通过成型内层分隔膜形成模塑内层分离膜，将成型内层分离膜定位在引线图案部分上，将外层基材层叠在内层基材上 插入层间粘合剂层的材料，对外层基材的导体层进行图案化以形成外层电路图形部分，并将模制的内层分离膜与内层基材分离以除去层间粘合剂层 和外层基材。

公开(公告)号：US07389012B2

公开(公告)日：2008-06-17

申请号：US10904271

申请日：2004-11-02

Applicant: Stefano S. Oggioni ,  Bert J. Offrein

Inventor： Stefano S. Oggioni ,  Bert J. Offrein

IPC: G02B6/12

CPC classification number: G02B6/43 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/147 ,  H05K3/0061 ,  H05K3/0067 ,  H05K2201/048 ,  H05K2201/09127 ,  H05K2201/2009

Abstract: An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be brokenalong a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.

Abstract translation: 公开了一种包括柔性连接电缆和对准能力的电光模块。 电光器件可以焊接在诸如玻璃的透明衬底或包括其中导电迹线被设计的光波导的衬底上，形成电光模块。 当将这种电光模块插入并对准印刷电路板时，包括导电迹线和焊盘（称为柔性电缆）的基板的外部部分朝向PCB的安装平面向下弯曲，允许建立 这些焊盘和PCB之间的电气连接。 衬底可以是预先形成的凹槽，并且可以去除衬底的外部，留下柔性电缆部分就位。

公开(公告)号：US20080117608A1

公开(公告)日：2008-05-22

申请号：US11974962

申请日：2007-10-17

Applicant: Ho-Seong Seo ,  Young-Min Lee ,  Shi-Yun Cho ,  Youn-Ho Choi ,  Sang-Hyun Kim

Inventor： Ho-Seong Seo ,  Young-Min Lee ,  Shi-Yun Cho ,  Youn-Ho Choi ,  Sang-Hyun Kim

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/10 ,  H05K3/42

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/0035 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/09127 ,  Y10T29/49165

Abstract: Disclosed are a multi-layer PCB and a fabricating method thereof. The multi-layer PCB includes: a core; a plurality of insulation layers and a plurality of conductive pattern layers alternatively stacked on both sides of the core; and a plurality of via holes formed through the core and the insulation layers. The fabricating method may includes the steps of: forming a conductive pattern layer on each of both sides of a core, and forming via holes through the core; attaching a double-stick tape with weak adhesive strength to a portion of each of a upper surface and a lower surface of the core; and forming an insulation layer on each of a upper surface and a lower surface of the core to cover the double-stick tapes, and forming a conductive pattern layer on each of the insulation layers.

Abstract translation: 公开了一种多层PCB及其制造方法。 多层PCB包括：核心; 多个绝缘层和交替堆叠在芯的两侧上的多个导电图案层; 以及形成在所述芯和所述绝缘层上的多个通孔。 制造方法可以包括以下步骤：在芯的两侧的每一侧上形成导电图案层，并且形成穿过芯的通孔; 将具有弱粘合强度的双面胶带附着到芯的上表面和下表面的每一个的一部分; 并且在所述芯的上表面和下表面的每一个上形成绝缘层以覆盖所述双色带，并且在每个所述绝缘层上形成导电图案层。