公开(公告)号：US3465091A

公开(公告)日：1969-09-02

申请号：US3465091D

申请日：1967-02-24

Applicant: TEXAS INSTRUMENTS INC

Inventor： BRADHAM ALLEN C

IPC: H05K1/00 ,  H05K3/06 ,  H05K3/40 ,  H05K1/02

CPC classification number: H05K3/4038 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0293 ,  H05K3/064 ,  H05K3/4046 ,  H05K2201/0305 ,  H05K2201/09609 ,  H05K2201/10234 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/128 ,  H05K2203/173 ,  H05K2203/175

公开(公告)号：US2066511A

公开(公告)日：1937-01-05

申请号：US3235335

申请日：1935-07-20

Applicant: BELL TELEPHONE LABOR INC

Inventor： ARLT HERBERT G

IPC: H05K1/09 ,  H05K3/22 ,  H05K3/40

CPC classification number: H05K3/225 ,  H05K1/095 ,  H05K3/222 ,  H05K3/4046 ,  H05K2201/10234 ,  H05K2201/10363 ,  H05K2201/10401 ,  Y10S29/039

公开(公告)号：US12090108B2

公开(公告)日：2024-09-17

申请号：US17023320

申请日：2020-09-16

Applicant: Xiamen High Top Electronic Technology Co., Ltd.

Inventor： Liangsan Zhao

IPC: A61H15/00 ,  A61H15/02 ,  A61N5/06 ,  H05K1/02

CPC classification number: A61H15/02 ,  A61H15/0078 ,  A61N5/06 ,  H05K1/0296 ,  A61H2201/10 ,  A61H2201/1671 ,  A61N2005/0659 ,  H05K2201/10234

Abstract: A conductive structure of a massage roller includes a working circuit board, a conductive base, a conductive plate, two first conductive parts and two second conductive parts. The working circuit board and the conductive plate are positioned at upper and lower ends of the conductive base respectively. The conductive base is provided with at least a pair of accommodating cavities, and conductors are placed in the accommodating cavities. The two first conductive parts are positioned on the bottom surface of the working circuit board, and the first conductive parts are connected with the working circuit board. The two second conductive parts are positioned on the top surface of the conductive plate, and the second conductive parts are connected with the conductive plate; and the top surfaces of the conductors abut against the two first conductive parts, and the bottom surfaces of the conductors abut against the two second conductive parts.

公开(公告)号：US20180188290A1

公开(公告)日：2018-07-05

申请号：US15741213

申请日：2016-07-04

Applicant: OKINS ELECTRONICS CO.,LTD

Inventor： Sung Gye PARK ,  Jin Kook JUN

IPC: G01R3/00 ,  G01R1/04 ,  G01R31/28 ,  H05K3/10 ,  H05K3/28 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: G01R3/00 ,  G01R1/0433 ,  G01R31/2863 ,  G01R31/2896 ,  H05K1/0268 ,  H05K1/028 ,  H05K1/111 ,  H05K3/103 ,  H05K3/28 ,  H05K3/285 ,  H05K3/3484 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10856 ,  H05K2203/041 ,  H05K2203/1327 ,  H05K2203/166

Abstract: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.

公开(公告)号：US09954160B2

公开(公告)日：2018-04-24

申请号：US14538289

申请日：2014-11-11

Applicant: Seiko Epson Corporation

Inventor： Hideki Ishigami ,  Hidefumi Nakamura ,  Yukihiko Shiohara ,  Tetsuya Otsuki ,  Tetsuro Miyao

IPC: H01L41/053 ,  H01L41/047 ,  H05K3/40 ,  H05K1/03 ,  H03H9/17 ,  H03H9/10 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01L41/0475 ,  H01L41/053 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16152 ,  H03H9/1021 ,  H03H9/17 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/1216 ,  H05K3/4046 ,  H05K3/4061 ,  H05K2201/10234 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A method of manufacturing a vibrator which includes a method of manufacturing a wiring board includes disposing one granular conductor within each of through holes of a ceramic substrate having the through holes formed therein, supplying a glass paste into the through holes, baking the glass paste, forming an electrode, and disposing a vibrator element and a lid. When a maximum diameter of the granular conductor is set to d1 and a minimum diameter of each of the through holes is set to d2, d1/d2 is preferably equal to or greater than 0.8 and equal to or less than 1.

公开(公告)号：US20170350751A1

公开(公告)日：2017-12-07

申请号：US15240277

申请日：2016-08-18

Applicant: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： XIAO-HU TANG ,  PEI LIU

IPC: G01J1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02

CPC classification number: G01J1/18 ,  G01V8/20 ,  H05K1/0274 ,  H05K1/0275 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10234

Abstract: A security device in an electronic device which protects against unauthorized disassembly includes light sources, a plurality of photosensitive elements, a detection unit, a storage unit, a processor, and light guiding devices. Light conducting channels are provided between the light sources and the induction elements. Barrier objects that block light are installed at certain first light guiding channels of the light guiding channels, and are removed from the first light conducting channels when the electronic device is disassembled, so that induction signals output by the photosensitive elements are changed from the model or original digitally-recorded signals.

公开(公告)号：US20170066088A1

公开(公告)日：2017-03-09

申请号：US14846489

申请日：2015-09-04

Applicant: Intel Corporation

Inventor： Mohit Sood ,  Boxi Liu ,  Wei Tan ,  Huili Xu ,  Kabir J. Mirpuri

IPC: B23K35/26 ,  B23K35/02 ,  H01L23/00 ,  H05K3/36 ,  H01L21/48 ,  H05K1/18 ,  H05K1/14 ,  H05K3/34 ,  B23K1/00 ,  H01L23/498

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/0244 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/1339 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16502 ,  H01L2224/16505 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01323 ,  H01L2924/01324 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: Embodiments herein may relate to an apparatus with a ball grid array (BGA) package that includes a plurality of solder balls of an off-eutectic material. In embodiments, the respective solder balls of the plurality of solder balls may form solder joints between a substrate of the BGA and a second substrate. In some embodiments the joints may be less than approximately 0.6 micrometers from one another. Other embodiments may be described and/or claimed.

Abstract translation: 本文的实施例可以涉及具有球栅阵列（BGA）封装的装置，其包括多个非共晶材料的焊球。 在实施例中，多个焊球的相应焊球可以在BGA的衬底和第二衬底之间形成焊接接头。 在一些实施例中，接头可以彼此小于约0.6微米。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20160043489A1

公开(公告)日：2016-02-11

申请号：US14452197

申请日：2014-08-05

Applicant: INFINERA CORP.

Inventor： John Michael Coronati ,  Eugene Messenger ,  Michael Sipics ,  Joseph Edward Riska ,  Jiaming Zhang

IPC: H01R12/71 ,  H01R43/26 ,  H01R4/38

CPC classification number: H01R12/714 ,  H01L31/02002 ,  H01R12/7011 ,  H01R12/73 ,  H05K3/225 ,  H05K3/325 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/0373 ,  H05K2201/068 ,  H05K2201/09427 ,  H05K2201/10121 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2203/176

Abstract: An apparatus including a bridge member and a clamp is disclosed. The bridge member is positioned in a first plane and has a substrate with a first surface and a second surface; and a plurality of distinct conductive pillars formed on the second surface of the substrate. The clamp has a body, a proximal end and a distal end. The body is positioned in a second plane above the first plane with the second plane being within 2 degrees of parallel to the first plane. The proximal end is positioned along the second plane; and the distal end has a plurality of prongs. The distal end is offset from the second plane in a direction toward the bridge member such that each prong contacts the first surface of the substrate.

Abstract translation: 公开了一种包括桥构件和夹具的装置。 桥构件定位在第一平面中并且具有带有第一表面和第二表面的基底; 以及形成在所述基板的第二表面上的多个不同的导电柱。 夹具具有主体，近端和远端。 身体位于第一平面上方的第二平面中，第二平面在与第一平面平行的2度内。 近端沿着第二平面定位; 并且远端具有多个插脚。 远端在朝向桥接件的方向上偏离第二平面，使得每个尖头接触基板的第一表面。

公开(公告)号：US20150130061A1

公开(公告)日：2015-05-14

申请号：US14602985

申请日：2015-01-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jiun Yi Wu

IPC: H01L23/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5386 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/206 ,  H05K1/0306 ,  H05K1/115 ,  H05K2201/10234 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: A method and structure for bump-on-trace bonding is provided. In an embodiment traces to be used for bump-on-trace (BOT) bonding are protected during a pre-solder treatment. The pre-solder treatment improves the adhesion between the exposed traces (e.g., the non-BOT traces) and a solder resist layer.

Abstract translation: 提供了一种用于凸起跟踪接合的方法和结构。 在实施例中，在预焊接处理期间保护用于跟踪（BOT）接合的迹线。 预焊接处理改善了暴露的迹线（例如，非BOT迹线）和阻焊层之间的粘附性。

公开(公告)号：US20140318837A1

公开(公告)日：2014-10-30

申请号：US14257546

申请日：2014-04-21

Applicant: PANASONIC CORPORATION

Inventor： Hideki EIFUKU ,  Koji MOTOMURA

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K3/361 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/323 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10234

Abstract: Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.

Abstract translation: 提供一种电路板互连结构，包括：第一电路板，包括第一基板和形成在第一基板的表面上的第一电极; 第二电路板，包括形成在第二基板的表面上的第二基板和第二电极; 一个或多个由用于接合第一和第二电极的含金属导电材料形成的接合部分，插入在第一和第二电极之间; 以及用于加强所述一个或多个接合部的加强树脂部。 第一电极是包括金属氧化物膜的透明电极。 与第一电极邻接的接合部分的第一邻接部分通过第一电极与导电材料的粘附润湿而形成。