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公开(公告)号：US20220238449A1
公开(公告)日：2022-07-28
申请号：US17583895
申请日：2022-01-25
Applicant: Infinera Corp.
Inventor： John W. Osenbach , Jiaming Zhang
IPC: H01L23/538 , H01L23/64 , H01L49/02
Abstract: Disclosed herein are multi-layer substrates for integrated circuit packages and methods of making the same. The multi-layer substrate may comprise a plurality of lower layers, at least one core layer, a plurality of upper layers, and a side surface. A first connection and a second connection may extend through or on an uppermost layer of the plurality of upper layers. A trace may be embedded in or on one of the plurality of upper layers, the trace electrically connected to the first connection and the second connection. A first mounting pad and a second mounting pad may be positioned on the side surface and/or the uppermost layer of the plurality of upper layers and a blocking capacitor may be electrically connected to the first mounting pad and the second mounting pad with the second mounting pad electrically connected to the second connection.
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公开(公告)号：US09711879B2
公开(公告)日：2017-07-18
申请号：US14452197
申请日：2014-08-05
Applicant: Infinera Corp.
Inventor： John Michael Coronati , Eugene Messenger , Michael Sipics , Joseph Edward Riska , Jiaming Zhang
IPC: H01R31/08 , H01R12/71 , H01R12/70 , H01L31/02 , H05K3/32 , H01R12/73 , H05K3/22 , H05K3/36 , H05K3/40
CPC classification number: H01R12/714 , H01L31/02002 , H01R12/7011 , H01R12/73 , H05K3/225 , H05K3/325 , H05K3/368 , H05K3/4015 , H05K2201/0373 , H05K2201/068 , H05K2201/09427 , H05K2201/10121 , H05K2201/10234 , H05K2201/10378 , H05K2201/10393 , H05K2203/176
Abstract: An apparatus including a bridge member and a clamp is disclosed. The bridge member is positioned in a first plane and has a substrate with a first surface and a second surface; and a plurality of distinct conductive pillars formed on the second surface of the substrate. The clamp has a body, a proximal end and a distal end. The body is positioned in a second plane above the first plane with the second plane being within 2 degrees of parallel to the first plane. The proximal end is positioned along the second plane; and the distal end has a plurality of prongs. The distal end is offset from the second plane in a direction toward the bridge member such that each prong contacts the first surface of the substrate.
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公开(公告)号：US09389441B2
公开(公告)日：2016-07-12
申请号：US13855552
申请日：2013-04-02
Applicant: Infinera Corp.
Inventor： David Gerald Coult , Radhakrishnan L. Nagarajan , Jiaming Zhang , Joseph Edward Riska , Donald J. Pavinski, Jr. , Jie Tang , Timothy Butrie
CPC classification number: G02F1/0327 , G02B6/4274
Abstract: A photonic transmitter, comprises a modulator driver having a first and second output ports, a photonic integrated transmitter circuit having a modulator having a first and a second input line, and a first input port electrically coupled with the first input line and a second input port electrically coupled with the second input line, and an interconnect bridge assembly, including a first termination resistor, a second termination resistor, and a substrate. An impedance-controlled transmission structure is formed in the substrate, and has: (a) an impedance control section including a first and a second signal lines electrically insulated from one another; and (b) a transmission section including a third and a fourth signal line coupled with termination resistor. The interconnect bridge assembly transmits an impedance controlled differential electrical signal from the modulator driver to the modulator, and transmits the electrical signal from the modulator to the first and second termination resistors.
Abstract translation: 一种光子发射器，包括具有第一和第二输出端口的调制器驱动器，具有调制器的光子集成发射器电路，具有第一和第二输入线，以及与第一输入线电耦合的第一输入端口和第二输入端口 与第二输入线电耦合，以及互连桥组件，包括第一终端电阻器，第二终端电阻器和衬底。 阻抗控制传输结构形成在衬底中，并具有：（a）阻抗控制部分，包括彼此电绝缘的第一和第二信号线; 和（b）包括与终端电阻耦合的第三和第四信号线的发送部分。 互连桥组件将阻抗控制的差分电信号从调制器驱动器发送到调制器，并将电信号从调制器发送到第一和第二终端电阻器。
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Patent Agency Ranking
公开(公告)号：US11803021B2
公开(公告)日：2023-10-31
申请号：US17215728
申请日：2021-03-29
Applicant: Infinera Corp.
Inventor： Franklin Wall, Jr. , John Osenbach , Jiaming Zhang
IPC: G02B6/42
CPC classification number: G02B6/426 , G02B6/4251 , G02B6/4267
Abstract: Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.
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公开(公告)号：US20160043489A1
公开(公告)日：2016-02-11
申请号：US14452197
申请日：2014-08-05
Applicant: INFINERA CORP.
Inventor： John Michael Coronati , Eugene Messenger , Michael Sipics , Joseph Edward Riska , Jiaming Zhang
CPC classification number: H01R12/714 , H01L31/02002 , H01R12/7011 , H01R12/73 , H05K3/225 , H05K3/325 , H05K3/368 , H05K3/4015 , H05K2201/0373 , H05K2201/068 , H05K2201/09427 , H05K2201/10121 , H05K2201/10234 , H05K2201/10378 , H05K2201/10393 , H05K2203/176
Abstract: An apparatus including a bridge member and a clamp is disclosed. The bridge member is positioned in a first plane and has a substrate with a first surface and a second surface; and a plurality of distinct conductive pillars formed on the second surface of the substrate. The clamp has a body, a proximal end and a distal end. The body is positioned in a second plane above the first plane with the second plane being within 2 degrees of parallel to the first plane. The proximal end is positioned along the second plane; and the distal end has a plurality of prongs. The distal end is offset from the second plane in a direction toward the bridge member such that each prong contacts the first surface of the substrate.
Abstract translation: 公开了一种包括桥构件和夹具的装置。 桥构件定位在第一平面中并且具有带有第一表面和第二表面的基底; 以及形成在所述基板的第二表面上的多个不同的导电柱。 夹具具有主体，近端和远端。 身体位于第一平面上方的第二平面中，第二平面在与第一平面平行的2度内。 近端沿着第二平面定位; 并且远端具有多个插脚。 远端在朝向桥接件的方向上偏离第二平面，使得每个尖头接触基板的第一表面。
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公开(公告)号：US12300621B2
公开(公告)日：2025-05-13
申请号：US17583895
申请日：2022-01-25
Applicant: Infinera Corp.
Inventor： John W. Osenbach , Jiaming Zhang
IPC: H01L23/538 , H01L23/64 , H01L49/02
Abstract: Disclosed herein are multi-layer substrates for integrated circuit packages and methods of making the same. The multi-layer substrate may comprise a plurality of lower layers, at least one core layer, a plurality of upper layers, and a side surface. A first connection and a second connection may extend through or on an uppermost layer of the plurality of upper layers. A trace may be embedded in or on one of the plurality of upper layers, the trace electrically connected to the first connection and the second connection. A first mounting pad and a second mounting pad may be positioned on the side surface and/or the uppermost layer of the plurality of upper layers and a blocking capacitor may be electrically connected to the first mounting pad and the second mounting pad with the second mounting pad electrically connected to the second connection.
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公开(公告)号：US20210302671A1
公开(公告)日：2021-09-30
申请号：US17215728
申请日：2021-03-29
Applicant: Infinera Corp.
Inventor： Franklin Wall, JR. , John Osenbach , Jiaming Zhang
IPC: G02B6/42
Abstract: Opto-electronic packages and methods for making opto-electronic packages are disclosed, including a method comprising forming an opto-electronic circuit on a first surface of a substrate of a lower package assembly, the first surface of the substrate having a first bonding pattern configured to provide a hermetic seal, the first bonding pattern extending around the opto-electronic circuit; positioning a bottom of a ring frame onto the first bonding pattern so as to surround the opto-electronic circuit with the ring frame; hermetically sealing a bottom of the ring frame to the first bonding pattern of the first surface of the substrate of the lower package assembly subsequent to the formation of the opto-electronic circuit on the first surface of the substrate; and hermetically sealing a top of the ring frame to form a hermetically sealed opto-electronic package.
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公开(公告)号：US20150180580A1
公开(公告)日：2015-06-25
申请号：US13855552
申请日：2013-04-02
Applicant: INFINERA CORP.
Inventor： David Gerald Coult , Radhakrishnan L. Nagarajan , Jiaming Zhang , Joseph Edward Riska , Donald J. Pavinski , Jie Tang , Timothy Butrie
IPC: H04B10/50 , H04B10/516
CPC classification number: G02F1/0327 , G02B6/4274
Abstract: A photonic transmitter, comprises a modulator driver having a first and second output ports, a photonic integrated transmitter circuit having a modulator having a first and a second input line, and a first input port electrically coupled with the first input line and a second input port electrically coupled with the second input line, and an interconnect bridge assembly, including a first termination resistor, a second termination resistor, and a substrate. An impedance-controlled transmission structure is formed in the substrate, and has: (a) an impedance control section including a first and a second signal lines electrically insulated from one another; and (b) a transmission section including a third and a fourth signal line coupled with termination resistor. The interconnect bridge assembly transmits an impedance controlled differential electrical signal from the modulator driver to the modulator, and transmits the electrical signal from the modulator to the first and second termination resistors.
Abstract translation: 一种光子发射器，包括具有第一和第二输出端口的调制器驱动器，具有调制器的光子集成发射器电路，具有第一和第二输入线，以及与第一输入线电耦合的第一输入端口和第二输入端口 与第二输入线电耦合，以及互连桥组件，包括第一终端电阻器，第二终端电阻器和衬底。 阻抗控制传输结构形成在衬底中，并具有：（a）阻抗控制部分，包括彼此电绝缘的第一和第二信号线; 和（b）包括与终端电阻耦合的第三和第四信号线的发送部分。 互连桥组件将阻抗控制的差分电信号从调制器驱动器发送到调制器，并将电信号从调制器发送到第一和第二终端电阻器。
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