公开(公告)号：US07225538B2

公开(公告)日：2007-06-05

申请号：US10035633

申请日：2001-12-28

Applicant: Benjamin Niles Eldridge ,  Gary William Grube ,  Igor Yan Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin Niles Eldridge ,  Gary William Grube ,  Igor Yan Khandros ,  Gaetan L. Mathieu

IPC: H01R43/16

CPC classification number: H05K7/1069 ,  B23K20/004 ,  B23K2101/40 ,  C23C18/31 ,  C23C18/32 ,  C23C18/38 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/01048

Abstract: Contact structures exhibiting resilience or compliance are formed. The contact structures may be formed on a sacrificial substrate. The contact structures are attached to an array of electrical connections on a substrate to form a contact assembly. The electrical connections on the substrate may be metallic pads.

Abstract translation: 形成表现出弹性或顺应性的接触结构。 接触结构可以形成在牺牲衬底上。 接触结构附接到基底上的电连接阵列以形成接触组件。 基板上的电连接可以是金属焊盘。

公开(公告)号：US07200930B2

公开(公告)日：2007-04-10

申请号：US11256514

申请日：2005-10-19

Applicant: Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R43/00 ,  H05K3/00 ,  G01R1/067

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/72

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

公开(公告)号：US20060286828A1

公开(公告)日：2006-12-21

申请号：US11461749

申请日：2006-08-01

Applicant: Igor Khandros

Inventor： Igor Khandros

IPC: H01R12/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K2101/40 ,  C23C18/161 ,  C25D7/12 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45117 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/4554 ,  H01L2224/4556 ,  H01L2224/456 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49609 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/0102

Abstract: A contact structure can comprise a core structure on a substrate and over coat material on the core structure. The over coat material can be harder or have a greater yield strength than the material of the core structure. The core structure can be formed by attaching a wire to the substrate and spooling the wire out from a spool. While spooling the wire out, the spool can be moved to impart a desired shape to the wire. The wire can be severed from the spool and over coated. As an alternative, the wire need not be over coated. The substrate can be an electronic device, such as a semiconductor die.

Abstract translation: 接触结构可以包括基底上的芯结构和芯结构上的外涂层材料。 外涂层材料可以比芯结构的材料更硬或具有更大的屈服强度。 芯结构可以通过将线附接到基底并且将线从线轴缠绕而形成。 在将电线绕出线的同时，可以使线轴移动以向导线赋予期望的形状。 电线可以从线轴上被切断并且被覆盖。 作为替代，电线不需要过度涂覆。 基板可以是诸如半导体管芯的电子器件。

公开(公告)号：US07140883B2

公开(公告)日：2006-11-28

申请号：US10692114

申请日：2003-10-23

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier, II ,  William D. Smith

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier, II ,  William D. Smith

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US20060255456A1

公开(公告)日：2006-11-16

申请号：US11431021

申请日：2006-05-10

Applicant: Don Choi ,  Dong-Hwan Lee ,  Hee-Soo Yoon

Inventor： Don Choi ,  Dong-Hwan Lee ,  Hee-Soo Yoon

IPC: H01L23/34

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15174 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/3011 ,  H05K3/368 ,  H05K3/445 ,  H05K2201/10318 ,  H05K2201/10378 ,  Y10S439/931 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A multilayer substrate, comprising a first substrate, a connector and a second substrate, is disclosed. The first substrate has a circuit pattern. The connector, coupling onto the first substrate, has a ring structure, in which a plurality of holes are separated a predetermined distance from one another. The second substrate, coupling onto the second substrate by inserting the connector, has a circuit pattern, which is electrically connected to a circuit pattern formed on the first substrate using the plurality of holes formed on the connector. A multilayer substrate and a method for producing it in accordance with the present invention can shield the EMI generated by a high-speed switching element.

公开(公告)号：US07087846B2

公开(公告)日：2006-08-08

申请号：US10423972

申请日：2003-04-28

Applicant: David Alcoe

Inventor： David Alcoe

IPC: H01R12/04 ,  H05K1/11 ,  H01R9/00 ,  H05K9/00

CPC classification number: H01L23/49838 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/15312 ,  H01L2924/16195 ,  H05K1/113 ,  H05K1/114 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3426 ,  H05K3/4602 ,  H05K2201/09454 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T29/49149 ,  H01L2224/0401

Abstract: An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad to provide reinforced adhesion of the pad to the substrate to substantially prevent cracking, separation, etc. of the pad when the pad has a pin bonded thereto and the package is coupled to an external substrate (e.g., printed circuit board). The reinforced adhesion also prevents pad separation, etc. during periods of package handling, manufacture, etc.

Abstract translation: 一种利用其的电子封装和信息处理系统，其中封装衬底包括耦合到外部焊盘的内部导电层，以便当焊盘具有焊盘时基板防止焊盘的开裂，分离等等 引脚连接到其上并且封装件耦合到外部基板（例如，印刷电路板）。 在包装处理，制造等期间，增强的附着力也防止垫分离等。

公开(公告)号：US20050263887A1

公开(公告)日：2005-12-01

申请号：US10993455

申请日：2004-11-18

Applicant: Chih-An Yang

Inventor： Chih-An Yang

IPC: H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K3/3421 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/15312 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0195 ,  H05K2201/10318 ,  H05K2201/10977 ,  Y02P70/613

Abstract: A circuit carrier adapted for a pin grid array (PGA) package is disclosed. The circuit carrier comprises a substrate, at least one pin pad, at least one solder mask layer, at least one solder layer, at least one pin and a fixing layer. The pin pad is disposed over the surface of the substrate. The solder mask layer is disposed over the surface of the substrate, and exposing at least a portion of the pin pad. The solder layer is disposed over the pin pad. One end of the pin connects to the pin pad through the solder layer. The fixing layer is disposed over the solder mask layer, and covering the solder layer and a portion of a side surface of the pin. When the solder layer melts due to a high process temperature, the fixing layer helps to fix the pin to the pin pad.

Abstract translation: 公开了适用于针格阵列（PGA）封装的电路载体。 电路载体包括衬底，至少一个引脚焊盘，至少一个焊接掩模层，至少一个焊料层，至少一个引脚和固定层。 销垫设置在基板的表面上。 焊料掩模层设置在衬底的表面上，并且暴露至少一部分焊盘。 焊料层设置在引脚焊盘之上。 引脚的一端通过焊料层连接到引脚焊盘。 固定层设置在焊料掩模层之上，并且覆盖焊料层和销的侧表面的一部分。 当焊料层由于处理温度过高而熔化时，固定层有助于将销固定到销焊盘上。

公开(公告)号：US06956174B2

公开(公告)日：2005-10-18

申请号：US09295269

申请日：1999-04-20

Applicant: Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01L23/12 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R4/02 ,  H01R9/00 ,  H01R12/52 ,  H01R33/76 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R12/04 ,  H05K1/11

CPC classification number: H05K7/1069 ,  B23K2101/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at lease a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，所述导电材料层包围细长构件并形成第二紧密结合，至少一部分直接邻近第一紧密接合的导电接触端子。

公开(公告)号：US06947293B2

公开(公告)日：2005-09-20

申请号：US10147138

申请日：2002-05-16

Applicant: Joseph Ted DiBene, II ,  David H. Hartke

Inventor： Joseph Ted DiBene, II ,  David H. Hartke

IPC: G06F1/18 ,  H01L23/427 ,  H01L23/433 ,  H01R4/64 ,  H01R12/16 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20 ,  H05K1/11

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract translation: 公开了一种使用向微处理器供电并同时提供集成热和电磁干扰（EMI）的模块化电路板组件的微处理器封装结构。 所述模块化电路板组件包括具有安装在其上的部件的基板，包括用于向所述部件供电的电路的电路板以及设置在所述基板和所述电路板之间的至少一个导电互连装置，所述导电互连装置配置 以将电路电耦合到组件。

公开(公告)号：US06884707B1

公开(公告)日：2005-04-26

申请号：US10075060

申请日：2002-02-11

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H01L23/495 ,  H01L23/498 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L24/12 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3426 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10825 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general.For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with.For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。 本发明描述了可用于抵消热循环，冲击和振动以及恶劣环境条件的不良影响的手段和方法。 对于有铅器件，引线面向设备的热中心及其与之相互作用的系统。 对于无引线器件，安装元件被处理或准备好以控制沿着元件长度的焊料的迁移，以确保这些元件保持其期望的柔性。