公开(公告)号：US11968815B2

公开(公告)日：2024-04-23

申请号：US17457285

申请日：2021-12-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi Nomura

IPC: H05K9/00 ,  H05K1/18

CPC classification number: H05K9/0026 ,  H05K1/181 ,  H05K2201/10075 ,  H05K2201/10371 ,  H05K2201/1056

Abstract: A module comprises: a wiring board; a first component, a second component and a third component mounted on a first main surface; a shield structure mounted on the first main surface; a first sealing resin that seals the first component and the like; and a shield film that covers an upper surface of the first sealing resin and the like, the shield structure including a top side portion and at least one sidewall portion bent from the top side portion and thus extending therefrom, the top side portion including the top side portion's conductive layer and a magnetic layer therein, the sidewall portion including the sidewall portion's conductive layer therein, the top side portion's conductive layer and the sidewall portion's conductive layer being electrically connected to a ground conductor, the magnetic layer in the top side portion being located over the first component.

公开(公告)号：US20240023246A1

公开(公告)日：2024-01-18

申请号：US18374420

申请日：2023-09-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Phillip A. Criminale ,  Zhiqiang Guo ,  Andrew Myles ,  Martin Perez-Guzman

IPC: H05K1/18 ,  H01L21/67 ,  H01L21/66 ,  H01L21/687 ,  G05B13/02

CPC classification number: H05K1/183 ,  H01L21/67253 ,  H01L22/34 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/67259 ,  G05B13/024 ,  H05K2201/10371 ,  H05K2201/10151

Abstract: A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber. The method further includes generating, by at least one non-contact sensor of the diagnostic disc, sensor data of a component disposed within the processing chamber. The method further includes storing the sensor data in a memory of the diagnostic disc. The method further includes wirelessly transmitting the sensor data to the computing system, using the wireless communication circuit. The method further includes terminating the secure wireless connection with the computing system and clearing the sensor data from the memory of the diagnostic disc.

公开(公告)号：US20230380764A1

公开(公告)日：2023-11-30

申请号：US18205813

申请日：2023-06-05

Applicant: ENDOTRONIX, INC.

Inventor： Harry ROWLAND ,  Michael NAGY ,  Balamurugan SUNDARAM ,  Suresh SUNDARAM

IPC: A61B5/00 ,  A61B5/0215 ,  A61B5/07 ,  G01L19/06 ,  G01L9/00 ,  H05K9/00 ,  B81B3/00 ,  G01L19/00 ,  B81C1/00

CPC classification number: A61B5/686 ,  A61B5/0215 ,  A61B5/076 ,  G01L19/0618 ,  G01L9/0042 ,  H05K9/0024 ,  B81B3/0035 ,  G01L19/0038 ,  B81C1/00261 ,  A61B2562/0247 ,  A61B2562/168 ,  B81C2203/0109 ,  H05K2201/10151 ,  H05K2201/10371 ,  B81B2201/0264 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/075

Abstract: A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

公开(公告)号：US20230380120A1

公开(公告)日：2023-11-23

申请号：US18366008

申请日：2023-08-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kunitoshi HANAOKA

IPC: H05K9/00 ,  H03H9/00 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/64 ,  H03H9/72 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K9/0022 ,  H03H9/0009 ,  H03H9/02913 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/1085 ,  H03H9/6483 ,  H03H9/725 ,  H05K1/181 ,  H05K1/023 ,  H05K2201/10053 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10371

Abstract: The radio frequency module includes a mounting board, a first metal member, and a second metal member. The first metal member and the second metal member are disposed on the mounting board. The first metal member has a longitudinal direction along a first direction in plan view from a thickness direction of the mounting board. The second metal member has a longitudinal direction along a second direction in plan view from the thickness direction of the mounting board. The first or second metal member is placed between a first electronic component and a second electronic component. The first metal member has a first recessed portion. The second metal member has a through hole and a second recessed portion. The through hole passes through the second metal member in the direction intersecting with the second direction. The second recessed portion faces and is in contact with the first recessed portion.

公开(公告)号：US20230344460A1

公开(公告)日：2023-10-26

申请号：US18342743

申请日：2023-06-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masanari MIURA ,  Kiyoshi AIKAWA ,  Hiroyuki NAGAMORI ,  Takanori UEJIMA ,  Yuji TAKEMATSU ,  Takahiro YAMASHITA ,  Ryo WAKABAYASHI ,  Yoshihiro YOSHIMURA ,  Takashi HIROSE

IPC: H04B1/40 ,  H05K1/18 ,  H05K9/00 ,  H01L25/16 ,  H01L23/552

CPC classification number: H04B1/40 ,  H05K1/181 ,  H05K9/0022 ,  H01L25/16 ,  H01L23/552 ,  H05K2201/1006 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10371

Abstract: A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.

公开(公告)号：US20230291090A1

公开(公告)日：2023-09-14

申请号：US18319648

申请日：2023-05-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongwon LEE ,  Dongil SON

IPC: H01Q1/02 ,  H05K1/14 ,  H05K9/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H01Q1/22 ,  H01Q23/00

CPC classification number: H01Q1/02 ,  H05K1/147 ,  H05K9/0024 ,  H05K1/0203 ,  H05K1/112 ,  H05K1/181 ,  H01Q1/2283 ,  H01Q23/00 ,  H05K1/0243 ,  H05K2201/10098 ,  H05K2201/10371 ,  H05K2201/10734

Abstract: Disclosed is an electronic device including a first circuit board including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; a second circuit board including a third surface facing the first direction and a fourth surface facing the second direction; an interposer disposed between the first circuit board and the second circuit board; an antenna disposed at the first surface of the first circuit board; a first electronic component disposed on the second surface of the first circuit board and electrically connected with the antenna; and a thermal interface material (TIM) disposed between the second surface of the first circuit board and the third surface of the second circuit board and contacting a surface of the first electronic component.

公开(公告)号：US20230189490A1

公开(公告)日：2023-06-15

申请号：US18166661

申请日：2023-02-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shota Hayashi ,  Nobuaki Ogawa ,  Yuki Asano ,  Akihiro Muranaka ,  Takanori Uejima ,  Hiromichi Katajima ,  Takahiro Eguchi

IPC: H05K9/00 ,  H01L25/065 ,  H01L25/16 ,  H01L23/552 ,  H01L21/56 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K9/0022 ,  H01L25/0655 ,  H01L25/165 ,  H01L23/552 ,  H05K9/0039 ,  H01L21/56 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2203/025 ,  H05K2203/1316

Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.

公开(公告)号：US20190037718A1

公开(公告)日：2019-01-31

申请号：US16152508

申请日：2018-10-05

Applicant: International Business Machines Corporation

Inventor： Michael J. Shapiro ,  Brian C. Twichell ,  Brent W. Yardley

IPC: H05K5/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K5/0217 ,  H05K1/11 ,  H05K1/181 ,  H05K7/20727 ,  H05K2201/07 ,  H05K2201/10371 ,  H05K2201/2018 ,  H05K2201/2027 ,  Y02P70/611

Abstract: An apparatus includes a particle trap coupled to a first surface of an enclosure, wherein the first surface of the enclosure is opposite a top surface of a circuit board. A particle guard coupled to the top surface on a first side of the circuit board located in the enclosure, wherein the enclosure includes one or more apertures on a second surface of the enclosure where the first side of the circuit board is introduced to an external airflow.

公开(公告)号：US20190037687A1

公开(公告)日：2019-01-31

申请号：US15810295

申请日：2017-11-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  John R. DANGLER ,  Michael J. FISHER ,  David C. LONG

IPC: H05K1/02 ,  G06F21/87 ,  H05K5/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/09 ,  G01N27/04

CPC classification number: H05K1/0275 ,  G01N27/045 ,  G06F21/86 ,  G06F21/87 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10204 ,  H05K2201/10371 ,  H05K2201/10522

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). In addition, the tamper-respondent sensor(s) includes at least one interconnect element associated with one or more conductive lines of the conductive lines forming, at least in part, the tamper-detect network(s). The interconnect element(s) includes at least one interconnect characteristic selected to facilitate obscuring a circuit lay of the at least one tamper-detect network. In operation, the detector monitors the tamper-detect network(s) of the tamper-respondent sensor(s) for a tamper event.

公开(公告)号：US20180358311A1

公开(公告)日：2018-12-13

申请号：US16045868

申请日：2018-07-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  Silvio DRAGONE ,  Michael A. GAYNES ,  Kenneth P. RODBELL ,  William SANTIAGO-FERNANDEZ

IPC: H01L23/00 ,  H05K3/30 ,  H01L21/48 ,  H01L23/08 ,  H05K1/03 ,  H05K1/18 ,  G06F21/87 ,  H01L23/053

CPC classification number: H01L23/576 ,  G06F21/87 ,  H01L21/4803 ,  H01L23/053 ,  H01L23/08 ,  H01L23/573 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/8385 ,  H01L2924/0665 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/16251 ,  H01L2924/16588 ,  H05K1/0275 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/303 ,  H05K3/46 ,  H05K2201/09036 ,  H05K2201/0999 ,  H05K2201/10159 ,  H05K2201/10371

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).