公开(公告)号：US09153886B2

公开(公告)日：2015-10-06

申请号：US13661457

申请日：2012-10-26

Applicant: Catalin Nastasa ,  Jacobo Barraza-Rubio

Inventor： Catalin Nastasa ,  Jacobo Barraza-Rubio

IPC: H01R9/00 ,  H01R13/42 ,  H01R43/16 ,  H01R12/58 ,  H05K3/34

CPC classification number: H01R12/585 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2201/2036 ,  Y10T29/49204 ,  Y10T156/1062

Abstract: Improved pin header assemblies, printed circuit board assemblies and methods of forming the same are disclosed. In an aspect, a method of forming a pin header assembly for use with a printed circuit board is provided. The method includes the step of providing a base formed of an electric insulator. The method further includes the step of forming a plurality of openings through the base. The method further includes the step of inserting a plurality of conductive pins through the openings, wherein a press fit is formed between the conductive pins and the base, and the conductive pins extend from opposite sides of the base.

Abstract translation: 公开了改进的针头组件，印刷电路板组件及其形成方法。 在一方面，提供了一种形成用于印刷电路板的针头组件的方法。 该方法包括提供由电绝缘体形成的基座的步骤。 该方法还包括通过基底形成多个开口的步骤。 所述方法还包括通过所述开口插入多个导电针的步骤，其中在所述导电针和所述基座之间形成压配合，并且所述导电针从所述底座的相对侧延伸。

公开(公告)号：US20150156874A1

公开(公告)日：2015-06-04

申请号：US14470022

申请日：2014-08-27

Applicant: FUJITSU LIMITED

Inventor： Takumi HASEGAWA ,  Hidehiko FUJISAKI

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/00

CPC classification number: H05K1/115 ,  H05K3/325 ,  H05K3/427 ,  H05K3/4623 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2203/061 ,  Y10T156/1064

Abstract: A method of manufacturing a laminated substrate, the method includes: forming a first diameter hole to a first surface of a first substrate so as not to penetrate the first substrate; forming a second diameter hole to a second surface of the first substrate so as to communicate with the first diameter hole; plating the first substrate to block the second diameter hole without blocking the first diameter hole; and laminating a second substrate on the second surface of the first substrate.

Abstract translation: 一种层叠基板的制造方法，其特征在于，在第一基板的第一面上形成第一直径孔，使其不穿透第一基板; 向所述第一基板的第二表面形成第二直径孔，以与所述第一直径孔连通; 电镀第一基板以阻挡第二直径孔而不阻塞第一直径孔; 以及在所述第一基板的所述第二表面上层压第二基板。

公开(公告)号：US08992267B2

公开(公告)日：2015-03-31

申请号：US12980115

申请日：2010-12-28

Applicant: Reinhold Bayerer

Inventor： Reinhold Bayerer

IPC: H01R13/42 ,  H05K3/30 ,  H01R12/58

CPC classification number: H05K3/308 ,  H01L2924/0002 ,  H01R12/585 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10856 ,  Y10T29/49117 ,  H01L2924/00

Abstract: A connecting system for electrically connecting electronic devices includes an electrically conductive first connector, an electrically conductive second connector and a clip element. The first connector is insertable in the second connector. The first connector or the second connector has a first opening into which the clip element can be inserted. In the inserted state, the clip element generates a contact pressure due to which the first connector and the second connector are pressed against one another so that an electrical contact between the first connector and the second connector is safeguarded.

Abstract translation: 用于电连接电子设备的连接系统包括导电的第一连接器，导电的第二连接器和夹子元件。 第一连接器可插入第二连接器。 第一连接器或第二连接器具有可插入夹子元件的第一开口。 在插入状态下，夹子元件产生接触压力，由此第一连接器和第二连接器彼此挤压，从而保护第一连接器和第二连接器之间的电接触。

公开(公告)号：US08901434B2

公开(公告)日：2014-12-02

申请号：US13422328

申请日：2012-03-16

Applicant: Akihiro Yasuo ,  Koji Kuroda

Inventor： Akihiro Yasuo ,  Koji Kuroda

IPC: H05K1/11 ,  H05K1/16 ,  H05K1/00 ,  H01R13/73 ,  H05K3/30 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K3/308 ,  H05K1/0243 ,  H05K3/429 ,  H05K2201/10325 ,  H05K2201/1059 ,  Y10T29/49153

Abstract: A board unit includes a board that has a through hole penetrating the board from a first side of the board to a second side of the board and having a conductive inner wall surface a first electronic component that has a first connection pin to be press-fitted in the through hole from the first side of the board, and a conductive member that is disposed in the through hole to connect the inner wall surface of the through hole to the first connection pin.

Abstract translation: 板单元包括板，其具有从板的第一侧穿过板的通孔到板的第二侧，并且具有导电内壁表面的第一电子部件，第一电子部件具有要被压配的第一连接销 在从该板的第一侧的通孔中，以及设置在通孔中以将该通孔的内壁表面连接到该第一连接销的导电构件。

公开(公告)号：US08859907B2

公开(公告)日：2014-10-14

申请号：US13599984

申请日：2012-08-30

Applicant: Jan Hendrik Berkel

Inventor： Jan Hendrik Berkel

IPC: H05K1/02 ,  F28F21/00 ,  H05K3/30 ,  H01L23/367 ,  H01L23/36 ,  H05K3/00 ,  H01L23/00 ,  H01L25/065

CPC classification number: H05K1/0201 ,  F28F21/00 ,  H01L23/36 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K3/30 ,  H05K2201/068 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2201/1059 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein is a method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein, in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or into a component associated with the circuit board and wherein at least one semiconductor die of a semiconductor component is applied onto the inserted flange insert in a subsequent application step.

Abstract translation: 本文公开了一种用于组装电路板的方法，该电路板在一个或两个侧面上具有至少一层铜包层或设置有导体轨道，其中在一个组装步骤中，至少一个刚性凸缘插入件插入到相关联的凹部中 电路板或与电路板相关联的部件，并且其中半导体部件的至少一个半导体管芯在随后的施加步骤中被施加到插入的法兰插入件上。

公开(公告)号：US20140190005A1

公开(公告)日：2014-07-10

申请号：US13736696

申请日：2013-01-08

Applicant: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC

Inventor： Stephen McGarry Hatch

IPC: H01R13/40 ,  H05K3/22 ,  H05K1/02

CPC classification number: H05K3/22 ,  G01R1/0416 ,  G01R27/02 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/193 ,  H01R13/24 ,  H01R13/41 ,  H01R2201/20 ,  H05K1/184 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10962 ,  Y10T29/49124

Abstract: An electrical contact assembly includes an electrically nonconductive base, a first electrical contact supported by the base and a second electrical contact supported by the base such that the first contact and the second contact are separated by a space. The first electrical contact is configured to engage a first external conductive circuit element and the a second electrical contact is configured to engage a second external conductive circuit element. The first contact and the second contact are configured such that a portion of the first contact and a portion of the second contact converge as the base moves in a first direction relative to the first and second external conductive circuit elements and diverge as the base moves in a second direction relative to the first and second external conductive circuit elements.

Abstract translation: 电接触组件包括非导电基座，由基座支撑的第一电触点和由基座支撑的第二电触头，使得第一触点和第二触点被空间隔开。 第一电触点被配置为接合第一外部导电电路元件，并且第二电触点被配置为接合第二外部导电电路元件。 第一触点和第二触点构造成使得当基座的一部分相对于第一和第二外部导电电路元件在第一方向上移动时，第一触点的一部分和第二触点的一部分会聚，并且随着基部移动 相对于第一和第二外部导电电路元件的第二方向。

公开(公告)号：US20130337697A1

公开(公告)日：2013-12-19

申请号：US13495671

申请日：2012-06-13

Applicant: Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

Inventor： Daniel J. Buschel ,  Wai Mon Ma ,  James E. Tersigni ,  Raymond D. Birchall

IPC: H01R24/20

CPC classification number: H01R12/58 ,  H01R12/718 ,  H05K1/141 ,  H05K3/325 ,  H05K2201/049 ,  H05K2201/1059 ,  H05K2201/10946

Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.

Abstract translation: 用于将表面安装部件附接到印刷电路板的表面安装部件适配器，组件和相关方法。 表面安装部件适配器包括衬底，衬底上的表面安装部件保持器和柔性引线，每个柔性引线都具有附接到表面安装部件保持器的基端，以及被配置为接合电路板上的电镀通孔的自由端。 表面安装部件保持器构造成接合表面安装部件的电触点。 表面贴装组件将表面安装适配器与表面贴装组件相结合。 在表面安装部件方法中，形成表面安装组件，并且柔性引线的自由端附接到电路板上相应数量的电镀通孔。

公开(公告)号：US20130322045A1

公开(公告)日：2013-12-05

申请号：US14000376

申请日：2011-02-25

Applicant: Igor Perez-Uria ,  Ola Arvidsson

Inventor： Igor Perez-Uria ,  Ola Arvidsson

IPC: H05K7/06 ,  H01R43/00

CPC classification number: H05K7/06 ,  H01R43/00 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10871 ,  H05K2203/0195 ,  Y10T29/49218

Abstract: A connection pin for mounting in a through-hole of a component carrier, comprising an anchoring part adapted for insertion into said through-hole with a non press fit, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The anchoring part is provided an internal cavity and the anchoring part comprises a wall surrounding the internal cavity, which wall has at least two wall portions forming deformation zones and adapted to be located in the through-hole when the anchoring part is inserted in the through-hole, such that, upon exertion of a force on a free end of the anchoring part of the pin when the anchoring part is inserted in the through-hole, the deformation zones are deformed within the through-hole to press fit the connection pin in the through-hole.

Abstract translation: 一种用于安装在部件载体的通孔中的连接销，包括适于以非压配合插入到所述通孔中的锚定部分，适于延伸到所述通孔外部的接触部分和适于 以抵靠所述部件载体并且位于所述锚定部分和所述接触部分之间。 锚定部分设置有内部空腔，并且锚定部分包括围绕内部空腔的壁，该壁具有形成变形区域的至少两个壁部分，并且当锚固部分插入到通孔中时适于定位在通孔中 使得当锚固部分插入到通孔中时，当在锚定部分被插入通孔中时在力的锚固部分的自由端上施加力时，变形区域在通孔内变形以压配合连接销 在通孔中。

公开(公告)号：US08596120B2

公开(公告)日：2013-12-03

申请号：US12737657

申请日：2009-06-09

Applicant: Ronny Ludwig

Inventor： Ronny Ludwig

IPC: G01P1/02

CPC classification number: G01P1/026 ,  G01D11/245 ,  H05K3/202 ,  H05K3/308 ,  H05K3/326 ,  H05K2201/1059

Abstract: An electronic sensor has a sensor housing in which a chip module having a module housing is mounted. The module housing has terminal pins that protrude laterally outward, each having a tapering at its free end. In addition, at least one metallic bearer strip is provided that is fashioned, in a first end area, as a plug contact, and that has in a second end area for at least one terminal pin a respective spring-clamp contact point that forms a flexible press-in zone for the corresponding terminal pin.

Abstract translation: 电子传感器具有安装有模块壳体的芯片模块的传感器外壳。 模块壳体具有横向向外突出的端子销，每个端子在其自由端具有锥形。 另外，提供了至少一个金属承载带，其在第一端部区域中形成为插头接触，并且在第二端部区域中具有用于至少一个端子销的相应的弹簧夹接触点，形成 柔性压入区用于相应的端子销。

公开(公告)号：US08553429B2

公开(公告)日：2013-10-08

申请号：US12679684

申请日：2008-09-24

Applicant: Niall McNamara ,  Brendan Maguire ,  Denis O'Sullivan ,  SeanGearoid McMahon ,  Colm Reidy ,  Michael Crampton

Inventor： Niall McNamara ,  Brendan Maguire ,  Denis O'Sullivan ,  SeanGearoid McMahon ,  Colm Reidy ,  Michael Crampton

IPC: H05K7/02 ,  H05K7/04

CPC classification number: H05K3/301 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/09827 ,  H05K2201/10015 ,  H05K2201/10325 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2201/10606

Abstract: An electrical component mounting assembly is disclosed for attaching a cylindrical electrical component (C1) such as capacitor, diode, or resistor to a mounting member such as a printed circuit board in a horizontal or vertical orientation. The mounting assembly can have a housing (12) and a sleeve (14) placed around the electrical component which cooperates with the housing to retain the electrical component to the housing. A substantially inner cylindrical wall (32) of the housing can taper inward from an entrance (34) end to a rear wall (18) to form a tapering or narrowing chamber (30). The sleeve can have a slit that runs along the entire length of the sleeve and a tapered outer surface (28) that cooperates with the tapered chamber to clamp or compress against the electrical component as the sleeve is inserted into the housing. The lack of appreciable expansion of the housing creates a tight friction fit to secure the sleeve to the housing. The sleeve can also include a plank that is received in an opening in the housing which can be heat staked to reinforce the friction fit taper lock between the housing and sleeve. The housing can be dimensioned to mount more than one electrical component diameter size by varying the dimensions of the sleeve, and in particular the thickness of sleeve.

Abstract translation: 公开了一种用于将诸如电容器，二极管或电阻器的圆柱形电气元件（C1）以水平或垂直取向附接到诸如印刷电路板的安装构件的电气部件安装组件。 安装组件可以具有壳体（12）和围绕电气部件设置的套筒（14），该套件与壳体配合以将电气部件保持在壳体上。 壳体的基本上内圆柱形的壁（32）可以从入口（34）端向后壁（18）向内锥形以形成锥形或变窄的腔室（30）。 套筒可以具有沿套筒的整个长度延伸的狭缝和锥形外表面（28），锥形外表面（28）与套筒插入到壳体中时与锥形室配合以夹紧或压缩电气部件。 外壳缺乏明显的膨胀产生紧密的摩擦配合以将套筒固定到壳体上。 套筒还可以包括容纳在壳体中的开口中的板材，该板材可以被热铆接以加强壳体和套筒之间的摩擦配合锥形锁定。 可以通过改变套筒的尺寸，特别是套筒的厚度来确定外壳的尺寸以安装多于一个电气部件的直径尺寸。