公开(公告)号：US20180198099A1

公开(公告)日：2018-07-12

申请号：US15848511

申请日：2017-12-20

Applicant: Shenzhen Meixin Electronics Co., Ltd.

Inventor： Weibin Chen ,  Zhou Li ,  Xuehao Lin

IPC: H01M2/02 ,  C09K5/14 ,  C09J7/38 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  C09J11/08 ,  B32B7/12 ,  B32B7/02 ,  B32B27/28 ,  B32B27/24 ,  B32B27/32 ,  B32B37/12

CPC classification number: H01M2/0267 ,  B32B7/02 ,  B32B7/12 ,  B32B27/24 ,  B32B27/283 ,  B32B27/325 ,  B32B37/12 ,  B32B2264/105 ,  B32B2264/108 ,  B32B2305/30 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2307/732 ,  B32B2383/00 ,  B32B2386/00 ,  B32B2405/00 ,  C08G77/04 ,  C08K3/04 ,  C08K3/042 ,  C08K3/08 ,  C08K5/0066 ,  C08K2201/001 ,  C09J7/38 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  C09J11/08 ,  C09J157/06 ,  C09J183/04 ,  C09J193/04 ,  C09J201/00 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/33 ,  C09J2205/10 ,  C09J2205/102 ,  C09J2407/00 ,  C09J2421/00 ,  C09J2483/00 ,  C09K5/14 ,  H01M2/0277 ,  H01M2/0285 ,  H01M2/0287 ,  C08L93/00 ,  C09J193/00 ,  C08L101/00

Abstract: The invention discloses an anti-explosive easy-to-disassemble safe adhesive tape and a manufacturing method thereof. The adhesive tape comprises a flame-retardant, current-conducting, heat-conducting and heat-expansion pressure-sensitive adhesive layer, a flame-retardant, current-conducting, heat-conducting and extensible viscosity-losing layer, a flame-retardant, current-conducting, heat-conducting and heat-expansion pressure-sensitive adhesive layer, and a release material layer which are overlapped in sequence. By adopting the adhesive tape disclosed in the invention, a plurality of battery packs can be combined together to increase the capacity or voltage. If an automobile encounters a collision, the material of the adhesive tape is collided and heated, and then expands instantly in order to effectively separate each battery module, and avoid greater damage.

公开(公告)号：US10002813B2

公开(公告)日：2018-06-19

申请号：US14650594

申请日：2014-01-16

Applicant: TORAY INDUSTRIES, INC.

Inventor： Akira Shimada ,  Koichi Aoki

IPC: C09J179/08 ,  H01L23/29 ,  H01L23/495 ,  C09J163/00 ,  C08G59/40 ,  C09J9/00 ,  H01L23/373 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

CPC classification number: H01L23/295 ,  C08G59/4042 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/003 ,  C09J7/28 ,  C09J9/00 ,  C09J163/00 ,  C09J179/08 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2400/163 ,  C09J2479/08 ,  H01L23/293 ,  H01L23/3737 ,  H01L23/49568 ,  H01L2924/0002 ,  Y10T428/2804 ,  Y10T428/31721 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).

公开(公告)号：US20180010017A1

公开(公告)日：2018-01-11

申请号：US15643198

申请日：2017-07-06

Applicant: SHIN-ETSU POLYMER CO., LTD.

Inventor： Sou Matsubayashi ,  Kohei Kanto

IPC: C09J7/02 ,  H01B3/42 ,  H01B1/12 ,  H01B5/14 ,  H01B13/00

CPC classification number: H01B13/0036 ,  C09D5/24 ,  C09D7/40 ,  C09D7/65 ,  C09J7/401 ,  C09J2201/602 ,  C09J2425/005 ,  C09J2467/005 ,  C09J2467/006 ,  C09J2471/005 ,  C09J2481/005 ,  C09J2483/005 ,  H01B1/122 ,  H01B1/127 ,  H01B3/421 ,  H01B5/14 ,  C09D183/04 ,  C08L67/00 ,  C08L65/00 ,  C08L25/18

Abstract: Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

公开(公告)号：US20170238410A1

公开(公告)日：2017-08-17

申请号：US15518970

申请日：2014-10-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaoqing Li ,  Jinjing Jiang ,  Zhiguo Zhang ,  Bin Wang

IPC: H05K1/02 ,  H05K9/00 ,  C09J9/02 ,  H01L23/367

CPC classification number: H05K1/0203 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/326 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0212 ,  H05K9/0009 ,  H05K9/0032 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.

公开(公告)号：US09718994B2

公开(公告)日：2017-08-01

申请号：US14560188

申请日：2014-12-04

Applicant: AMOGREENTECH CO., LTD.

Inventor： Seung Hoon Lee ,  Yong Sik Jung ,  Yun Mi So

IPC: C09J7/02 ,  C09J9/02 ,  C09J7/04 ,  B32B37/15 ,  H01B1/00 ,  H01B13/32 ,  B32B5/26 ,  B32B7/12 ,  C08K3/04

CPC classification number: C09J7/0289 ,  B32B5/26 ,  B32B7/12 ,  B32B37/15 ,  B32B2250/02 ,  B32B2405/00 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K2201/001 ,  C09J7/20 ,  C09J7/21 ,  C09J7/26 ,  C09J7/29 ,  C09J7/30 ,  C09J9/02 ,  C09J2201/134 ,  C09J2201/602 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2400/263 ,  C09J2467/006 ,  H01B1/00 ,  H01B13/32 ,  Y10T428/1476 ,  Y10T428/249983

Abstract: Provided is a conductive adhesive tape comprising: a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material by a spinning method; and a conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate. Accordingly, thickness of the adhesive tape can be made thin, adhesive strength of the adhesive tape can be enhanced, and the adhesive tape can be precisely attached on even a curved surface. Further, when removing the adhesive tape from components, the adhesive layer can be prevented from remaining on the surface of the components.

公开(公告)号：US09676969B2

公开(公告)日：2017-06-13

申请号：US14236343

申请日：2012-07-30

Applicant: Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

Inventor： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

IPC: H01B1/00 ,  B05D5/12 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/38 ,  C09J7/02 ,  H01B13/00 ,  H05K3/10 ,  H05K1/09 ,  H05K3/12 ,  H05K1/03 ,  C08K3/08 ,  C08K3/22 ,  C08K7/18

CPC classification number: C09J9/02 ,  B05D5/12 ,  C08K3/08 ,  C08K3/22 ,  C08K7/18 ,  C09J7/28 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01B1/22 ,  H01B13/00 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1208 ,  H05K3/1283 ,  H05K3/38 ,  H05K2203/1157 ,  Y10T428/24967 ,  Y10T428/25

Abstract: The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.

公开(公告)号：US09657196B2

公开(公告)日：2017-05-23

申请号：US14605419

申请日：2015-01-26

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Ji Yeon Kim ,  Kyoung Ku Kang ,  Kyoung Soo Park ,  Young Woo Park ,  Byeong Geun Son ,  Kyoung Hun Shin ,  Young Ju Shin ,  Kwang Jin Jung ,  Jae Sun Han ,  Ja Young Hwang

IPC: H01B1/00 ,  C09J7/00 ,  H01L23/00 ,  H05K1/03 ,  H05K1/09 ,  C09J9/02 ,  C09J163/00 ,  H01L23/488

CPC classification number: C09J7/00 ,  C08K2201/001 ,  C08L63/00 ,  C09D163/00 ,  C09J7/10 ,  C09J9/02 ,  C09J163/00 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/488 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2924/0002 ,  H01L2924/066 ,  H01L2924/0665 ,  H05K1/0306 ,  H05K1/0353 ,  H05K1/09 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01006

Abstract: A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80° C. to about 110° C. and a second epoxy resin having an exothermic peak temperature of 120° C. to 200° C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins.

公开(公告)号：US20170077055A1

公开(公告)日：2017-03-16

申请号：US15115827

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU ,  Reiji TSUKAO

IPC: H01L23/00 ,  B32B27/38 ,  B32B27/14

CPC classification number: H01L24/29 ,  B32B27/08 ,  B32B27/14 ,  B32B27/18 ,  B32B27/20 ,  B32B27/38 ,  B32B2307/202 ,  B32B2457/00 ,  C08F220/18 ,  C08K2201/001 ,  C09J4/00 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/02 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27848 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83204 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/2021 ,  H01L2924/2064 ,  H01L2924/3511 ,  H01R4/04 ,  H05K3/323 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/066 ,  H01L2924/0675 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/061 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An anisotropic conductive film has a first connection layer and a second connection layer formed on surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of first connection layer on the side of second connection layer, conductive particles for anisotropic conductive connection are arranged in a single layer. A region in which the curing ratio is lower than that of the surface of the first connection layer exists in a direction oblique to the thickness direction of the first connection layer. Alternatively, the curing ratio of a region relatively near another surface of the first connection layer among regions of the first connection layer in the vicinity of the conductive particles is lower than that of the surface of the first connection layer.

Abstract translation: 各向异性导电膜具有形成在第一连接层的表面上的第一连接层和第二连接层。 第一连接层是光聚合树脂层，第二连接层是热阳离子，光阴离子或自由基聚合性树脂层。 在第二连接层一侧的第一连接层的表面上，用于各向异性导电连接的导电颗粒被布置在单层中。 固化比低于第一连接层的表面的区域存在于与第一连接层的厚度方向倾斜的方向上。 或者，导电粒子附近的第一连接层的区域之间的第一连接层的另一个表面的相对接近的区域的固化比率低于第一连接层的表面的硬化率。

公开(公告)号：US09593264B2

公开(公告)日：2017-03-14

申请号：US14236269

申请日：2012-07-10

Applicant: Klaus Keite-Telgenbüscher

Inventor： Klaus Keite-Telgenbüscher

IPC: C09J9/02 ,  C09J7/00 ,  H01B1/22 ,  C09J7/02 ,  C09J5/06 ,  C09J11/04 ,  H05K3/32 ,  C08K7/04 ,  C08K3/04 ,  C08K3/08

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/08 ,  C08K7/04 ,  C09J5/06 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/16 ,  C09J2400/22 ,  H01B1/22 ,  H05K3/321

Abstract: An adhesive film, which can be bonded when heat-activated, comprising a) a polymer-metal blend comprising at least one adhesive which can be bonded when heat-activated, and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.

Abstract translation: 一种粘合膜，其可以在热激活时结合，所述粘合剂膜包括：a）聚合物 - 金属共混物，其包含至少一种可在热活化时结合的粘合剂，以及至少一种金属组分在50℃ 至400℃，和b）至少一种纤维状导电填料，该填料至少部分以与该金属组分结合的纤维网络的形式存在。

公开(公告)号：US20170012014A1

公开(公告)日：2017-01-12

申请号：US15115771

申请日：2015-02-04

Applicant: DEXERIALS CORPORATION

Inventor： Reiji TSUKAO ,  Yasushi AKUTSU

IPC: H01L23/00 ,  B32B3/30 ,  B32B27/06 ,  B32B5/30

CPC classification number: H01L24/27 ,  B32B3/00 ,  B32B3/30 ,  B32B5/30 ,  B32B7/00 ,  B32B7/02 ,  B32B7/04 ,  B32B27/00 ,  B32B27/06 ,  B32B27/08 ,  B32B27/28 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2307/706 ,  C08K2201/001 ,  C08L63/00 ,  C09J4/00 ,  C09J7/10 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/29 ,  H01L2224/27001 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  C08L101/00

Abstract: An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

Abstract translation: 各向异性导电膜具有形成在第一层表面上的第一和第二连接层。 第一连接层是光聚合树脂层，第二连接层是热阳离子或光阳离子或可自由基聚合的树脂层。 在第二连接层侧的第一连接层的表面上，用于各向异性导电连接的导电颗粒是单层。 第一连接层在表面上具有精细的突出和凹陷。 另一方面的各向异性导电膜具有顺序层叠的第一，第二和第三连接层。 由光自由基聚合树脂形成的第一层。 第二层和第三层由热阳离子或热阴离子可聚合树脂，光阳离子或光阴离子可聚合树脂，可热可聚合树脂或光可自由基聚合树脂形成。 在第二连接层侧的第一连接层的表面上，用于各向异性导电连接的导电颗粒是单层。