公开(公告)号：US07059049B2

公开(公告)日：2006-06-13

申请号：US10253725

申请日：2002-09-24

Applicant: Donald S. Farquhar ,  James D. Herard ,  Michael J. Klodowski ,  David Questad ,  Der-jin Woan

Inventor： Donald S. Farquhar ,  James D. Herard ,  Michael J. Klodowski ,  David Questad ,  Der-jin Woan

IPC: H01K3/10

CPC classification number: H05K3/4641 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/068 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.

Abstract translation: 电子封装和形成方法。 提供具有第一和第二相对表面的导热层。 第一电介质层在加压下被层压在导热层的第一相对表面上，温度在最低温度T 1 1MIN和最高温度T 1MAX之间。 在层压之后，T 1MAX 3将第一介电层的延展性约束至少为D 1。 T 1MAX取决于D 1和在由第一介电层组成的第一电介质材料上。 在加压下将第二电介质层在导热层的第二相对表面上，在最低温度T 2 M 2 N 2和最大温度T 2 MAX之间的温度下层压。 在层压之后，T 2MAX 2将第二介电层的延展性约束为至少D 2。 T 2MAX取决于D 2和在由第二介电层组成的第二电介质材料上。

公开(公告)号：US20060112543A1

公开(公告)日：2006-06-01

申请号：US10532949

申请日：2003-07-15

Applicant: Atsushi Ishikawa ,  Osamu Deguchi ,  Katsuyoshi Kameyama ,  Makoto Nagaoka ,  Akihiro Kimura

Inventor： Atsushi Ishikawa ,  Osamu Deguchi ,  Katsuyoshi Kameyama ,  Makoto Nagaoka ,  Akihiro Kimura

IPC: H05K3/36 ,  B23P19/00

CPC classification number: H05K13/0069 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/09909 ,  H05K2203/016 ,  Y10S269/903 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/5313 ,  Y10T29/53265

Abstract: A jig for holding and conveyance having a weak-adherence adhesive pattern on a plate surface on which a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate is placed and held. The weak-adherence adhesive pattern is formed by being restricted to a position corresponding to non-conductive portion. A jig for holding and conveyance is also disclosed which has a fluorine-based resin layer on a plate surface on which a printed circuit board having a conductive pattern on the surface of an insulating substrate is placed and held. On the fluorine-based resin layer, the printed circuit board is held so that the conductor pattern surface of the printed circuit board is approximately parallel to the plate surface. A jig for holding and conveyance can be provided which is capable of reducing manufacturing defects in a step of connecting electronic components or the like on the surface of a thin printed circuit board or in a step of manufacturing the printed circuit board, and which is capable of low-cost production.

Abstract translation: 在其上放置并保持在绝缘基板的表面上具有导电部分和非导电部分的印刷电路板的板表面上具有弱粘附性图案的保持和传送夹具。 弱粘附性粘合剂图案通过限制在与非导电部分相对应的位置而形成。 还公开了一种用于保持和输送的夹具，在其上放置并保持在绝缘基板的表面上具有导电图案的印刷电路板的板表面上具有氟基树脂层。 在氟系树脂层上，印刷电路板被保持为使得印刷电路板的导体图案表面大致平行于板表面。 可以提供一种用于保持和传送的夹具，其能够减少在薄印刷电路板的表面上连接电子部件等或在制造印刷电路板的步骤中的步骤中的制造缺陷，并且其能够 的低成本生产。

公开(公告)号：US20060082952A1

公开(公告)日：2006-04-20

申请号：US10968605

申请日：2004-10-19

Applicant: Toshiaki Ogiwara

Inventor： Toshiaki Ogiwara

IPC: H01G9/04

CPC classification number: H01B1/22 ,  C09D5/24 ,  C09D127/12 ,  H05K1/095 ,  H05K2201/015

Abstract: An electroconductive paste composition characterized in that an electroconductive powder with a mean grain size of 1 μm or less and a copolymer binder composed of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride are dispersed in a solvent. The present invention provides an electroconductive paste. composition that can be cured at low temperatures and can be endowed with low resistivity as a result of using a conventional mixing technique without the need for particularly expensive materials or techniques.

Abstract translation: 一种导电糊组合物，其特征在于将平均粒径为1μm以下的导电粉末和由四氟乙烯，六氟丙烯和偏二氟乙烯组成的共聚物粘合剂分散在溶剂中。 本发明提供导电浆料。 组合物可以在低温下固化，并且由于使用常规的混合技术而不需要特别昂贵的材料或技术，可以赋予低电阻率。

公开(公告)号：US07026032B2

公开(公告)日：2006-04-11

申请号：US10702754

申请日：2003-11-05

Applicant: Yueh-Ling Lee ,  Gary Min

Inventor： Yueh-Ling Lee ,  Gary Min

IPC: B32B27/06 ,  B32B5/14

CPC classification number: B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  C08G73/10 ,  C08L27/18 ,  C08L79/08 ,  C09K19/38 ,  C09K2219/03 ,  C09K2219/11 ,  H01L2924/0002 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/281 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/24 ,  Y10T428/249921 ,  Y10T428/31721 ,  C08L2666/20 ,  H01L2924/00

Abstract: The present invention is a polymeric composite comprising a polyimide component and a fluoropolymer component derived from a micro powder. The fluoropolymer micro powder has a melt point between 250 and 375° C. The fluoropolymer micro powder has an average particle size between 20 and 5000 nanometers (5.0 microns).The polyimide component and the fluoropolymer component are inter-mixed at a high dispersion level where the fluoropolymer component is present in a weight ratio from 10 to 60 percent. The polymeric composite of these two components is particularly useful in the form of a thin film used in high-speed digital circuitry or high signal integrity for low loss of a digital signal. The film can also be used as a wire wrap, or as a coverlay or base film substrate for flexible circuitry laminates.

Abstract translation: 本发明是一种聚合物复合材料，其包含聚酰亚胺组分和衍生自微粉末的含氟聚合物组分。 含氟聚合物微粉末的熔点在250和375℃之间。含氟聚合物微粉末的平均粒径为20-5000纳米（5.0微米）。 聚酰亚胺组分和含氟聚合物组分以高分散水平相互混合，其中含氟聚合物组分以10至60重量％的重量比存在。 这两种组分的聚合物复合材料在用于高速数字电路或高信号完整性的薄膜的形式中特别有用，用于低损耗的数字信号。 该膜还可以用作电线包装，或用作柔性电路层压板的覆盖层或基底膜基材。

公开(公告)号：US06994896B2

公开(公告)日：2006-02-07

申请号：US10663375

申请日：2003-09-16

Applicant: Murali Sethumadhavan ,  Richard T. Traskos ,  Michael E. St. Lawrence ,  Sankar K. Paul ,  Luis D. Borges ,  Allen F. Horn, III

Inventor： Murali Sethumadhavan ,  Richard T. Traskos ,  Michael E. St. Lawrence ,  Sankar K. Paul ,  Luis D. Borges ,  Allen F. Horn, III

IPC: C09K19/00 ,  B32B3/00 ,  H05K1/00

CPC classification number: B32B15/04 ,  B32B7/12 ,  B32B15/20 ,  B32B27/12 ,  B32B27/20 ,  B32B27/365 ,  B32B37/153 ,  B32B2037/243 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/704 ,  B32B2311/12 ,  B32B2369/00 ,  B32B2457/00 ,  C08K3/36 ,  C08L27/18 ,  C08L67/00 ,  C09K19/38 ,  C09K19/54 ,  C09K2219/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/1086 ,  Y10T428/1095 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/252 ,  Y10T428/254 ,  C08L2666/04

Abstract: A liquid crystalline composite comprising a liquid crystalline polymer, particulate filler, and fibrous web. Further disclosed is a method for forming the liquid crystalline polymer composite. The liquid crystalline polymer composite is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent flame retardant properties.

Abstract translation: 包含液晶聚合物，颗粒填料和纤维网的液晶复合材料。 进一步公开了形成液晶聚合物复合材料的方法。 液晶聚合物复合材料在电路材料，电路和多层电路中是有用的，制造经济，并且具有优异的阻燃性能。

公开(公告)号：US06972371B2

公开(公告)日：2005-12-06

申请号：US10648351

申请日：2003-08-27

Applicant: Sean Kelly Summers

Inventor： Sean Kelly Summers

IPC: H05K1/14 ,  H05K3/28 ,  H05K5/06 ,  H05K7/06

CPC classification number: H05K5/065 ,  H05K1/14 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/055 ,  H05K2203/0191 ,  H05K2203/1316

Abstract: An electronic component includes a circuit board assembly having a thin polymer sheet having no electronic function located within the assembly, the circuit board assembly and the thin polymer sheet encapsulated in a potting material. A method of preventing damage to circuit boards in an electronic component encapsulated in potting material due to cracks in the potting material includes a) providing plural circuit boards for assembly into the component; b) during assembly, inserting a thin polymer film at least between adjacent ones of the plural circuit boards, said polymer film having no electronic function; c) completing the assembly of the component; and d) encapsulating the component in a potting material.

公开(公告)号：US20050250249A1

公开(公告)日：2005-11-10

申请号：US11182167

申请日：2005-07-15

Applicant: Lisa Jimarez ,  Miguel Jimarez ,  Voya Markovich ,  Cynthia Milkovich ,  Charles Perry ,  Brenda Peterson

Inventor： Lisa Jimarez ,  Miguel Jimarez ,  Voya Markovich ,  Cynthia Milkovich ,  Charles Perry ,  Brenda Peterson

IPC: H01L21/44 ,  H01L21/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract translation: 提供电子封装和制造电子封装的方法。 电介质材料层位于包括多个导电触点的衬底的第一表面上。 至少一个通孔形成在电介质材料层中，与多个导电触点中的至少一个对准。 导电材料位于基本上填充通孔的至少一个通孔中。 至少一个导电构件定位在通孔中的导电材料上并与导电材料电接触。 该电子封装提高了组件的现场使用寿命，该组件包括附接到衬底的第二表面的半导体芯片和附着到导电构件的印刷线路板。

公开(公告)号：US06942756B2

公开(公告)日：2005-09-13

申请号：US10207890

申请日：2002-07-31

Applicant: Takanori Suzuki ,  Hajime Tsuda

Inventor： Takanori Suzuki ,  Hajime Tsuda

IPC: B32B15/12 ,  B32B7/00 ,  B32B15/08 ,  B32B15/082 ,  B32B15/14 ,  B32B27/30 ,  D21H13/10 ,  D21H13/12 ,  D21H13/14 ,  D21H13/36 ,  D21H13/40 ,  D21H17/35 ,  D21H25/04 ,  D21H27/12 ,  D21H27/30 ,  H01B3/52 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/02

CPC classification number: B32B15/14 ,  B32B15/20 ,  B32B2262/0253 ,  B32B2262/101 ,  B32B2305/026 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2457/08 ,  D21H13/14 ,  D21H13/40 ,  D21H17/35 ,  H05K1/024 ,  H05K1/034 ,  H05K3/022 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0278 ,  Y10T428/12903 ,  Y10T428/12986 ,  Y10T428/24917

Abstract: The invention provides fluororesin fiber paper excellent in adhesion to a copper foil, heat resistance, chemical resistance, low water absorption and electric insulation and capable of being used as a substrate of a printed board suitable for use in high frequency, of which a low dielectric loss is required. The fluororesin fiber paper is a porous sheet obtained by forming a slurry comprising fluororesin fiber into a sheet by a wet paper making method and sintering the resultant sheet and has an average pore diameter of 0.5 to 50 μm and a maximum pore diameter of at most 250 μm. A copper-clad laminate for printed board is produced by laminating the fluororesin fiber paper and a copper foil having a ten point mean height of surface roughness profile (Rz) of 0.5 to 8.0 μm on each other by means of vacuum hot pressing.

Abstract translation: 本发明提供了对铜箔的粘附性优异的氟树脂纤维纸，耐热性，耐化学性，低吸水性和电绝缘性，并且能够用作适用于高频的印刷电路板的基板，其中低介电 需要损失 氟树脂纤维纸是通过湿法造纸法将包含氟树脂纤维的浆料形成片材而获得的多孔片材，并烧结所得片材，其平均孔径为0.5〜50μm，最大孔径为250以下 妈妈 通过真空热压将氟树脂纤维纸和表面粗糙度分布（Rz）的十分平均高度为0.5〜8.0μm的铜箔层叠在一起，制成印刷基板用覆铜层压板。

公开(公告)号：US20050183883A1

公开(公告)日：2005-08-25

申请号：US10782640

申请日：2004-02-19

Applicant: Karl Bois ,  Timothy Michalka

Inventor： Karl Bois ,  Timothy Michalka

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K3/4688 ,  H05K1/024 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09672 ,  H05K2201/09881 ,  Y10T29/49124

Abstract: A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A signal path layer is interposed between the first dielectric material and the second dielectric material. An adhesive layer is interposed between the first dielectric material and the second dielectric material such that the adhesive layer is substantially coplanar relative to the signal path layer.

Abstract translation: 印刷电路板（PCB）基板及其构造方法。 在一个实施例中，第一电介质材料与第一电​​流返回层相关联，并且第二电介质材料与第二电流返回层相关联。 信号通路层介于第一电介质材料和第二电介质材料之间。 粘合剂层介于第一电介质材料和第二电介质材料之间，使得粘合剂层相对于信号路径层基本上是共面的。

公开(公告)号：US20050096429A1

公开(公告)日：2005-05-05

申请号：US10702754

申请日：2003-11-05

Applicant: Yueh-Ling Lee ,  Gary Min

Inventor： Yueh-Ling Lee ,  Gary Min

IPC: C08K3/00 ,  B32B27/08 ,  C08G73/10 ,  C08L27/12 ,  C08L79/08 ,  C09K19/38 ,  H01L21/60 ,  H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  C08F8/30

CPC classification number: B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  C08G73/10 ,  C08L27/18 ,  C08L79/08 ,  C09K19/38 ,  C09K2219/03 ,  C09K2219/11 ,  H01L2924/0002 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/281 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/24 ,  Y10T428/249921 ,  Y10T428/31721 ,  C08L2666/20 ,  H01L2924/00

Abstract: The present invention is a polymeric composite comprising a polyimide component and a fluoropolymer component derived from a micro powder. The fluoropolymer micro powder has a melt point between 250 and 375° C. The fluoropolymer micro powder has an average particle size between 20 and 5000 nanometers (5.0 microns). The polyimide component and the fluoropolymer component are inter-mixed at a high dispersion level where the fluoropolymer component is present in a weight ratio from 10 to 60 percent. The polymeric composite of these two components is particularly useful in the form of a thin film used in high-speed digital circuitry or high signal integrity for low loss of a digital signal. The film can also be used as a wire wrap, or as a coverlay or base film substrate for flexible circuitry laminates.

Abstract translation: 本发明是一种聚合物复合材料，其包含聚酰亚胺组分和衍生自微粉末的含氟聚合物组分。 含氟聚合物微粉末的熔点在250和375℃之间。含氟聚合物微粉末的平均粒径为20-5000纳米（5.0微米）。 聚酰亚胺组分和含氟聚合物组分以高分散水平相互混合，其中含氟聚合物组分以10至60重量％的重量比存在。 这两种组分的聚合物复合材料在用于高速数字电路或高信号完整性的薄膜的形式中特别有用，用于低损耗的数字信号。 该膜还可以用作电线包装，或用作柔性电路层压板的覆盖层或基底膜基材。