公开(公告)号：US5353499A

公开(公告)日：1994-10-11

申请号：US92883

申请日：1993-07-19

Applicant: Hisao Hattori ,  Tomohiko Ihara ,  Hiroshi Yoshino ,  Shosaku Yamanaka

Inventor： Hisao Hattori ,  Tomohiko Ihara ,  Hiroshi Yoshino ,  Shosaku Yamanaka

IPC: H01L21/3205 ,  H01L21/48 ,  H01L21/768 ,  H01L23/12 ,  H01L23/29 ,  H01L23/31 ,  H01L23/522 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  H01K3/10

CPC classification number: H01L23/5386 ,  H01L21/4857 ,  H01L23/5383 ,  H05K1/0224 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0253 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/09018 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K3/4644 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: A method of forming a multilayered wiring board having a multilayered wiring structure includes the steps of forming a first mesh wiring layer having a plurality of holes therein, and forming a second wiring layer having a plurality of wirings undulating up and down so as to descend into the holes formed in the first wiring layer. In another method, the first wiring layer is formed with a plurality of protrusions and the wirings of the second wiring layer are formed between the protrusions. In the wiring boards formed according to the methods of the present invention, crosstalk between the wirings is suppressed.

Abstract translation: 一种形成具有多层布线结构的多层布线板的方法包括以下步骤：在其中形成具有多个孔的第一网状布线层，并形成具有上下波动的多条布线的第二布线层，以便下降 形成在第一布线层中的孔。 在另一方法中，第一布线层形成有多个突起，并且第二布线层的布线形成在突起之间。 在根据本发明的方法形成的布线板中，布线之间的串扰被抑制。

公开(公告)号：US5220488A

公开(公告)日：1993-06-15

申请号：US875561

申请日：1992-04-27

Applicant: Oscar L. Denes

Inventor： Oscar L. Denes

IPC: B29C70/78 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00

CPC classification number: B29C70/78 ,  H05K1/162 ,  H05K1/165 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/007 ,  H05K1/0284 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/0376 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/086 ,  H05K2201/09018 ,  H05K2201/097 ,  H05K2201/09763 ,  H05K2201/09809 ,  H05K2201/0999 ,  H05K2201/2009 ,  H05K2203/0156 ,  H05K2203/1327 ,  H05K3/4691 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916

Abstract: An electrical circuit package wherein a flexible support member having conductive materials and electronic components thereon is fused with a substrate which acts as a support for the film. This results in a unitary packaged circuit. In one embodiment the film is a decal on which certain portions have a substrate fused thereto. In other embodiments, various layers of conductive materials are applied and molded into the substrate to form a variety of electronic functions. The circuit package lends itself to high production and reliability as well as cost savings.

Abstract translation: 一种电路封装，其中在其上具有导电材料和电子部件的柔性支撑构件与用作薄膜支撑体的基底熔合。 这导致整体封装电路。 在一个实施例中，膜是其上某些部分具有与其融合的基底的贴花。 在其它实施例中，各种导电材料层被施加并模制到衬底中以形成各种电子功能。 电路封装本身具有高生产和可靠性以及成本节约。

公开(公告)号：US4858073A

公开(公告)日：1989-08-15

申请号：US170546

申请日：1988-03-21

Applicant: Vernon C. Gregory

Inventor： Vernon C. Gregory

IPC: H01L23/14 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K3/0061 ,  H01L23/142 ,  H05K1/0203 ,  H05K1/056 ,  H05K1/189 ,  H01L2224/32225 ,  H01L2924/13033 ,  H01L2924/3011 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/066 ,  H05K2201/09018 ,  H05K2201/1034 ,  H05K2201/10689 ,  H05K2201/1084 ,  H05K2201/2036 ,  H05K2203/0369 ,  H05K2203/1115 ,  H05K2203/175 ,  H05K2203/302 ,  H05K3/3405 ,  H05K3/341

Abstract: A semiconductor fabrication having thermal characteristics comparable to hybrid ceramic packages comprises a flexible copper foil printed circuit on a thin polyimide film layer thermally laminated to a metal surface, such as aluminum, with a high temperature thermal plastic, such as polyetherimide. A semiconductor die is attached to a relatively thick metal heat spreader which in turn is attached to at least a portion of the copper foil. The resultant structure is a semiconductor package which has a thermal performance comparable to that of typical hybrid ceramic packages.

Abstract translation: 具有与混合陶瓷封装相当的热特性的半导体制造包括在热层压到例如铝的金属表面上的薄聚酰亚胺膜层上的柔性铜箔印刷电路与诸如聚醚酰亚胺的高温热塑性塑料。 半导体管芯附着在较厚的金属散热器上，该散热器又连接至铜箔的至少一部分。 所得结构是具有与典型的混合陶瓷封装相当的热性能的半导体封装。

公开(公告)号：US4399488A

公开(公告)日：1983-08-16

申请号：US289606

申请日：1981-08-03

Applicant: Victor W. Ruwe ,  James A. Kerr ,  Rene F. Sandeau, Jr.

Inventor： Victor W. Ruwe ,  James A. Kerr ,  Rene F. Sandeau, Jr.

IPC: H05K1/00 ,  H05K1/14

CPC classification number: H05K1/14 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/0999

Abstract: Packaging of microelectronics utilizing a series of various size cylindershich are assembled and sealed from the environment, providing electrical connections out opposite ends of the cylinders and providing for a center opening in the inner cylinder to allow other structure such as a warhead to be mounted therein are aspects of this invention.

Abstract translation: 使用一系列各种尺寸的气瓶包装微型电池，这些气缸与环境组装和密封，提供电连接到气缸的相对端，并提供内筒中的中心开口以允许其他结构如弹头安装在其中 是本发明的方面。

公开(公告)号：US4106187A

公开(公告)日：1978-08-15

申请号：US649673

申请日：1976-01-16

Applicant: Brian Roger Smith ,  Charles Richard Jarvis ,  Stephen Martin Payne ,  Robert John Potts ,  Frank Wallis

Inventor： Brian Roger Smith ,  Charles Richard Jarvis ,  Stephen Martin Payne ,  Robert John Potts ,  Frank Wallis

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06

CPC classification number: H05K3/022 ,  H05K3/0014 ,  H05K3/0082 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K2203/1572 ,  H05K2203/302 ,  H05K3/06 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A curved printed circuit board is made in accordance with a method which ensures accurate registration between printed circuit patterns carried by the two outer surfaces of the board.

Abstract translation: 弯曲印刷电路板根据确保由电路板的两个外表面承载的印刷电路图案之间的精确对准的方法制成。

公开(公告)号：US3201238A

公开(公告)日：1965-08-17

申请号：US75815958

申请日：1958-08-29

Applicant: DWYER WALTER J

Inventor： DWYER WALTER J

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/0082 ,  H05K1/0284 ,  H05K3/0002 ,  H05K2201/09018 ,  H05K2203/056

公开(公告)号：US3080232A

公开(公告)日：1963-03-05

申请号：US69979657

申请日：1957-11-29

Applicant: SANDERS ASSOCIATES INC

Inventor： GILBODY ROGER W ,  WALKER CLIFFORD R

IPC: H01J9/20 ,  H05K3/00 ,  H05K3/10

CPC classification number: H01J9/20 ,  H05K3/0002 ,  H05K3/0082 ,  H05K3/102 ,  H05K2201/0108 ,  H05K2201/0347 ,  H05K2201/09018 ,  H05K2203/0522 ,  H05K2203/0525 ,  H05K2203/056

公开(公告)号：US11991817B2

公开(公告)日：2024-05-21

申请号：US17207109

申请日：2021-03-19

Applicant: LUX Lighting Systems LLC

Inventor： Jonathan Eric Fay

IPC: H05K1/00 ,  A61L2/10 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0206 ,  A61L2/10 ,  H05K7/20136 ,  H05K7/2039 ,  A61L2202/11 ,  A61L2202/16 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: The disclosure describes an antimicrobial protection device using antibacterial and virucidal electromagnetic energy to provide protection. Electromagnetic energy may be supplied by light source(s) such as LED(s). Lighting apparatus may be configured to project electromagnetic energy in an energy barrier over an individual or portion thereof, such as the individual's airways and eyes. Light source(s) may be constructed or configured to emit electromagnetic energy in wavelengths at about 405 nm and/or between about 200 nm to about 220 nm. Lighting apparatus may be configured in a ring and may be mounted above the user's head such that the lighting apparatus projects a bactericidal and/or virucidal curtain of light around the user's head, killing or inactivating microbes before reaching the user's eyes, nose, or mouth. Apparatus of the present disclosure may be useful for medically fragile children (including those in wheelchairs), medically fragile people, and medical personnel in high-risk infectious areas.

公开(公告)号：US20230363088A1

公开(公告)日：2023-11-09

申请号：US18246953

申请日：2021-09-30

Applicant: VALEO VISION

Inventor： Alexandre VAL ,  Samuel DAROUSSIN ,  Zdravko ZOJCESKI ,  Antoine DE LAMBERTERIE

IPC: H05K1/03 ,  F21S43/14 ,  F21V19/00 ,  H05K1/02 ,  H05K1/14 ,  F21V23/06

CPC classification number: H05K1/0306 ,  F21S43/14 ,  F21V19/001 ,  H05K1/0206 ,  H05K1/147 ,  F21V23/06 ,  H05K2201/09018 ,  H05K2201/10106

Abstract: A lighting module of a motor vehicle signaling device includes a ceramic substrate having opposite first and second faces, and a plurality of selectively activatable light sources mounted on the first face of the ceramic substrate. Each of the first and second faces of the ceramic substrate are provided with at least a first and a second respective interconnection layer. The ceramic substrate comprises a plurality of through holes designed to interconnect the first interconnection layer to the second interconnection layer.

公开(公告)号：US20190200422A1

公开(公告)日：2019-06-27

申请号：US16286666

申请日：2019-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-min KIM ,  Ho-seong SHIN ,  Kyoung-hwan JANG

IPC: H05B33/04 ,  H05B33/10 ,  H05K3/00 ,  H05B33/12 ,  H05K3/28

CPC classification number: H05B33/04 ,  H05B33/10 ,  H05B33/12 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/007 ,  H05K3/284 ,  H05K3/288 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.