公开(公告)号：US09280247B2

公开(公告)日：2016-03-08

申请号：US14634534

申请日：2015-02-27

Applicant: Japan Display Inc. ,  Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Shinya Hashimoto

IPC: G06F3/041 ,  G06F3/044 ,  H05K1/11 ,  G06F1/16 ,  H05K3/36

CPC classification number: G06F3/0416 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/13439 ,  G06F1/16 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

公开(公告)号：US20150250047A1

公开(公告)日：2015-09-03

申请号：US14602989

申请日：2015-01-22

Applicant: OMRON Coporation

Inventor： Kensuke Nambu

IPC: H05K1/02 ,  F21K99/00 ,  H05K1/11 ,  H01L27/15 ,  H01L33/62

CPC classification number: F21K9/20 ,  H05K1/114 ,  H05K1/189 ,  H05K3/3442 ,  H05K2201/09254 ,  H05K2201/10106 ,  H05K2201/10136 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10522 ,  H05K2203/046 ,  Y02P70/613

Abstract: A flexible printed circuit board on which a first electronic component and a second electronic component are to be mounted adjacent to each other has a first land for soldering a terminal of the first electronic component on a side adjacent to the second electronic component, and a second land for soldering a terminal of the second electronic component on a side adjacent to the first electronic component. The first land and the second land are connected by a wire extending outside of an inter-land region that is an approximately belt-shaped region formed by connecting end portions in a width direction or end portions in a thickness direction of the first land and the second land in a straight line.

Abstract translation: 第一电子部件和第二电子部件彼此相邻安装的柔性印刷电路板具有用于焊接第一电子部件的端子与第二电子部件相邻的一侧的第一焊盘，第二焊盘 用于焊接第二电子部件的端子与第一电子部件相邻的一侧的焊盘。 所述第一焊盘和所述第二焊盘通过沿着所述第一焊盘的厚度方向的宽度方向或端部的端部连接而形成的大致带状区域的区域之间延伸的线连接， 第二个土地在一条直线上。

公开(公告)号：US20150155845A1

公开(公告)日：2015-06-04

申请号：US14412311

申请日：2013-03-28

Applicant: NEC CORPORATION

Inventor： Yoshiaki Kasahara ,  Hiroshi Toyao

IPC: H03H7/01

CPC classification number: H03H7/0161 ,  H01P1/2005 ,  H01P1/203 ,  H01P3/08 ,  H01Q15/0066 ,  H01Q15/008 ,  H03H7/0115 ,  H05K1/0236 ,  H05K1/162 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/09781

Abstract: A second conductor plane (102) is formed in a layer different from a layer in which a first conductor plane (101) is formed, and faces the first conductor plane (101). A first transmission line (104) is formed in a layer different from the layers in which the first conductor plane (101) and the second conductor plane (102) are formed, and faces the second conductor plane (102), and one end thereof is an open end. A conductor via (106) connects the other end of the first transmission line (104) and the first conductor plane (101). An insular conductor (112) is connected to a portion of the first transmission line (104) other than a portion thereof at which the transmission line (104) is attached to the conductor via (106), is located in a layer different from the layer in which the second conductor plane (102) is located, and faces the second conductor plane (102).

Abstract translation: 第二导体平面（102）形成在与形成第一导体平面（101）的层不同的层中，并且面向第一导体平面（101）。 第一传输线（104）形成在与形成第一导体平面（101）和第二导体平面（102）的层不同的层中，并且面向第二导体平面（102），并且其一端 是一个开放的结局。 导体通孔（106）连接第一传输线（104）的另一端和第一导体平面（101）。 绝缘导体（112）连接到第一传输线（104）的除了传输线（104）附接到导体通路（106）的部分之外的部分，位于不同于 层，其中第二导体平面（102）所在，并面向第二导体平面（102）。

公开(公告)号：US09011799B2

公开(公告)日：2015-04-21

申请号：US13572001

申请日：2012-08-10

Applicant: Burkhardt Reichmuth

Inventor： Burkhardt Reichmuth

IPC: G01F19/00 ,  G01L3/02 ,  H05K1/02 ,  G01F11/02 ,  B01L3/02 ,  G01N35/10 ,  H05K1/03

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument with a cable holding space in which a printed circuit board cable device is arranged. The printed circuit board cable device has at least one printed circuit board with first and second sides and, arranged in succession, at least one first circuit board section, at least one second circuit board section and at least one third circuit board section, and with a number of conductor tracks arranged in parallel with respect to one another and extending from a first track section arranged in the first circuit board section, via the second circuit board section to the third circuit board section, in which a second track section is arranged, wherein, in the second circuit board section, at least one conductor track is arranged on the first side of the board and at least one track is arranged on the second side.

Abstract translation: 本发明涉及具有电缆保持空间的实验室样品仪器，其中布置有印刷电路板电缆装置。 印刷电路板电缆装置具有至少一个具有第一和第二侧面的印刷电路板，并且连续地布置有至少一个第一电路板部分，至少一个第二电路板部分和至少一个第三电路板部分，并且具有 多个导体轨道相对于彼此平行布置并且从布置在第一电路板部分中的第一轨道部分经由第二电路板部分延伸到布置有第二轨道部分的第三电路板部分， 其中，在所述第二电路板部分中，至少一个导体轨道布置在所述板的第一侧上，并且至少一个轨道布置在所述第二侧上。

公开(公告)号：US08998450B2

公开(公告)日：2015-04-07

申请号：US13384541

申请日：2010-06-16

Applicant: Thomas Preuschl

Inventor： Thomas Preuschl

IPC: F21S4/00 ,  F21V21/14 ,  H05K1/03 ,  H05K3/20 ,  H05K1/18 ,  F21Y111/00 ,  F21S8/08 ,  F21W131/103 ,  F21Y101/02 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/189 ,  F21S8/08 ,  F21W2131/103 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/09254 ,  H05K2201/0969 ,  H05K2201/10106 ,  Y10T29/49128 ,  Y10T156/10 ,  Y10T156/1002

Abstract: A light module (1; 14), comprising a carrier (8, 10) for mounting at least one semiconductor source (5), in particular a light emitting diode, wherein: the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is bonded face-to face to at least one base plate, (8) and the carrier (8, 10) can be bent along at least one predetermined bending line (3; 3a-3e), the base plate (8) can be bent along the at least one bending line, (3; 3a-3e), the base plate (8) has at least one cutout (9) along the bending line (3; 3a-3e) and the flexible printed circuit board (10) has at least one strip (11; 15) which crosses at least one of the cutouts (9).

Abstract translation: 一种光模块（1; 14），包括用于安装至少一个半导体源（5）的载体（8,10），特别是发光二极管，其中：所述载体（8,10）具有柔性印刷电路板 （10）中，柔性印刷电路板（10）面对至少一个基板（8）接合，并且载体（8,10）可以沿着至少一个预定弯曲线（3; 3a）弯曲 -3e），所述基板（8）可以沿着所述至少一条弯曲线（3,3a-3e）弯曲，所述基板（8）沿着所述弯曲线（3; 3a-3e）具有至少一个切口（9） 3a-3e）和柔性印刷电路板（10）具有至少一个穿过至少一个切口（9）的条带（11; 15）。

公开(公告)号：US08994682B2

公开(公告)日：2015-03-31

申请号：US14056504

申请日：2013-10-17

Applicant: Japan Display Inc. ,  Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Shinya Hashimoto

IPC: G06F3/041 ,  G06F3/044 ,  H05K1/11 ,  H05K3/36

CPC classification number: G06F3/0416 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/13439 ,  G06F1/16 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

Abstract translation: 显示装置包括显示面板和与显示面板重叠形成的静电电容式触摸面板。 多个X电极和与X电极交叉的多个Y电极。 第一信号线向X电极提供信号，第二信号线向Y电极提供信号，并且第一信号线和第二信号线形成在柔性印刷电路板上。 在每个X电极和Y电极的电极部分的电极部分附近形成虚拟电极，虚拟电极不与X电极和Y电极重叠，并且虚拟电极不与第一和第二信号电连接 线条。

公开(公告)号：US20150084167A1

公开(公告)日：2015-03-26

申请号：US14460694

申请日：2014-08-15

Applicant: Kabushiki Kaisha Toshiba

Inventor： Tadahiro SASAKI ,  Hiroshi YAMADA

IPC: H05K1/02 ,  H01L23/48 ,  H05K1/03 ,  H01L23/552 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0236 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/24137 ,  H01L2924/1531 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0225 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0242 ,  H05K1/0243 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09254 ,  H05K2201/0969 ,  H05K2201/09727

Abstract: An EBG structure of an embodiment includes an electrode plane, a first insulating layer provided on the electrode plane, a first metal patch provided on the first insulating layer, a second metal patch provided on the first insulating layer, a second insulating layer provided on the first and second metal patches, an interconnect layer provided on the second insulating layer, a third insulating layer provided on the interconnect layer, a first via connected to the electrode plane and the first metal patch, and a second via connected to the electrode plane and the second metal patch. The second metal patch is separately adjacent to the first metal patch. The interconnect layer has a first opening and a second opening. The first via penetrates through the first opening. The second via penetrates through the second opening.

Abstract translation: 实施例的EBG结构包括电极平面，设置在电极平面上的第一绝缘层，设置在第一绝缘层上的第一金属贴片，设置在第一绝缘层上的第二金属贴片，设置在第一绝缘层上的第二绝缘层 第一和第二金属贴片，设置在第二绝缘层上的互连层，设置在互连层上的第三绝缘层，连接到电极平面和第一金属贴片的第一通孔，以及连接到电极平面的第二通孔和 第二个金属贴片。 第二金属贴片与第一金属贴片分开相邻。 互连层具有第一开口和第二开口。 第一个通孔穿过第一个开口。 第二通孔穿过第二开口。

公开(公告)号：US08970791B2

公开(公告)日：2015-03-03

申请号：US14233565

申请日：2012-07-18

Applicant: Toshikazu Yoshida ,  Hideaki Ozawa

Inventor： Toshikazu Yoshida ,  Hideaki Ozawa

IPC: H04N5/50 ,  H04B1/18 ,  H04H20/71 ,  H04J4/00 ,  H03F3/195 ,  H03H7/24 ,  H03H7/48 ,  H05K1/02

CPC classification number: H04N5/50 ,  H03F3/195 ,  H03H7/24 ,  H03H7/48 ,  H05K1/0243 ,  H05K2201/09254

Abstract: Provided a circuit board including an input terminal to which a high-frequency signal is input, a high-frequency amplifier for amplifying the high-frequency signal input to the input terminal, at least one distributor distributing the high-frequency signal, a plurality of high-frequency processing circuits of which transmission path lengths for inputting each of the high-frequency signals distributed by the distributor into signal inputting sections of the plurality of high-frequency processing circuits are different from one another, and a plurality of attenuating devices which are mounted at previous stages of each of the plurality of high-frequency processing circuits and possess amounts of attenuation which increase with decrease of the transmission path lengths.

Abstract translation: 提供一种电路板，包括输入高频信号的输入端子，用于放大输入到输入端子的高频信号的高频放大器，分配高频信号的至少一个分配器，多个 用于将由分配器分配的每个高频信号输入到多个高频处理电路的信号输入部分的传输路径长度彼此不同的高频处理电路，以及多个衰减装置 安装在多个高频处理电路中的每一个的先前阶段，并且具有随着传输路径长度的减小而增加的衰减量。

公开(公告)号：US20150022936A1

公开(公告)日：2015-01-22

申请号：US14336717

申请日：2014-07-21

Applicant: Applied Materials, Inc.

Inventor： Michael S. COX ,  Zheng YUAN

IPC: H01L21/683 ,  H05K3/10

CPC classification number: H01L21/6833 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/285 ,  H05K2201/017 ,  H05K2201/068 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2203/0195 ,  H05K2203/1338 ,  Y10T29/49155

Abstract: Embodiments of the present invention provide a substrate support assembly including an electrostatic chuck with enhanced heat resistance. In one embodiment, an electrostatic chuck includes a support base, an electrode assembly having interleaved electrode fingers formed therein, and an encapsulating member disposed on the electrode assembly, wherein the encapsulating member is fabricated from one of a ceramic material or glass.

Abstract translation: 本发明的实施例提供一种包括具有增强的耐热性的静电卡盘的基板支撑组件。 在一个实施例中，静电卡盘包括支撑基座，其中形成有交错电极指的电极组件和设置在电极组件上的封装构件，其中封装构件由陶瓷材料或玻璃之一制成。

公开(公告)号：US08922029B2

公开(公告)日：2014-12-30

申请号：US13363396

申请日：2012-02-01

Applicant: Atsushi Hiraishi ,  Toshio Sugano ,  Masahiro Yamaguchi ,  Yoji Nishio ,  Tsutomu Hara ,  Koichiro Aoki

Inventor： Atsushi Hiraishi ,  Toshio Sugano ,  Masahiro Yamaguchi ,  Yoji Nishio ,  Tsutomu Hara ,  Koichiro Aoki

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  G11C5/06 ,  G11C5/04 ,  G11C8/14 ,  H05K1/18

CPC classification number: G11C5/063 ,  G11C5/04 ,  G11C8/14 ,  H05K1/181 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/10159 ,  Y02P70/611

Abstract: An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL0 from the data transferring element to a first branch point S1 where a branch line is branched at a shortest distance from the data transferring element is configured to become equal to or greater than a wiring length TL1 from the first branch point S1 to a second branch point S2 where a second branch line is branched. A wiring length TL3 from the second branch point S2 to a third branch point S3 where a third branch line is branched is configured to become greater than the wiring lengths TL0 and TL1.

Abstract translation: 具有短截线结构的地址信号线连接在至少三个存储器元件和数据传输元件之间，并传送存储器元件的地址信号。 数据传送元件的地址端子的阻抗低于地址信号线的特性阻抗。 从数据传送元件到分支线从数据传送元件到最短距离分支的第一分支点S1的布线长度TL0被配置成等于或大于从第一分支点S1到布线长度TL1 第二分支点S2，其中第二支线被分支。 从第二分支点S2到分支第三分支线的第三分支点S3的布线长度TL3被配置为变得大于布线长度TL0和TL1。