公开(公告)号：US20100290203A1

公开(公告)日：2010-11-18

申请号：US12762123

申请日：2010-04-16

Applicant: Osamu Nagasaki

Inventor： Osamu Nagasaki

IPC: H05K7/02

CPC classification number: H05K3/3468 ,  G03G15/80 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/111 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09463 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/099 ,  H05K2201/10083 ,  H05K2201/10689 ,  H05K2201/1081 ,  H05K2203/044 ,  H05K2203/046 ,  H01L2924/00

Abstract: An electronic apparatus includes, for example, a circuit board with an electronic component and a piezoelectric element, a reference potential pattern that gives a reference potential to at least one of the electronic component and the piezoelectric element, and a solder land connected to the reference potential pattern. On the circuit board, the electronic component is located on a downstream side in a transport direction of the circuit board during mounting of the piezoelectric element and the electronic component on the solder land, and the piezoelectric element is located on an upstream side in the transport direction.

Abstract translation: 电子设备例如包括具有电子部件和压电元件的电路板，向电子部件和压电元件中的至少一个赋予参考电位的基准电位图形以及连接到基准电极的焊接焊盘 潜在的模式。 在电路板上，电子部件在将压电元件和电子部件安装在焊锡焊盘上时位于电路基板的输送方向的下游侧，压电元件位于输送路径的上游侧 方向。

公开(公告)号：US07823276B2

公开(公告)日：2010-11-02

申请号：US11099453

申请日：2005-04-06

Applicant: Kazumoto Chiba ,  Seigo Sato

Inventor： Kazumoto Chiba ,  Seigo Sato

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H05K1/0269 ,  H05K3/3484 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49899

Abstract: The present invention provides a printed circuit board that can suppress the positional displacement of parts mounted thereon. The printed circuit board includes resist formed on the surface of the printed circuit board, lands for receiving respective parts to be mounted, the lands being arranged off openings free from the resist, and lands for alignment, respectively alignment marks being formed on the land for alignment by means of solder.

Abstract translation: 本发明提供能够抑制安装在其上的部件的位置偏移的印刷电路板。 印刷电路板包括形成在印刷电路板的表面上的抗蚀剂，用于接收待安装的各个部分的焊盘，焊盘从防蚀剂的开口排出，并且用于对准的焊盘，分别在焊盘上形成对准标记 通过焊料对准。

公开(公告)号：US07816608B2

公开(公告)日：2010-10-19

申请号：US12177339

申请日：2008-07-22

Applicant: Guo-Cheng Liao

Inventor： Guo-Cheng Liao

IPC: H05K1/00

CPC classification number: G01B15/02 ,  G01B7/06 ,  H05K1/0269 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/09781

Abstract: A substrate for inspecting a thickness of contacts at least includes a dielectric layer, a first metal layer, and a second metal layer. The first metal layer which includes a circuit region and a testing region is formed on an upper surface of the dielectric layer, and the circuit region has a plurality of contacts. The second metal layer which has a hollowed region is formed on a lower surface of the dielectric layer, and the hollowed region is aligned with the testing region of the first metal layer to avoid the interference when the testing region is inspected.

Abstract translation: 用于检查触点厚度的基板至少包括电介质层，第一金属层和第二金属层。 包含电路区域和测试区域的第一金属层形成在电介质层的上表面上，并且电路区域具有多个触点。 具有中空区域的第二金属层形成在电介质层的下表面上，并且中空区域与第一金属层的测试区域对准，以避免在检查区域时的干扰。

公开(公告)号：US20100252307A1

公开(公告)日：2010-10-07

申请号：US12755390

申请日：2010-04-06

Applicant: Yao-an Mo

Inventor： Yao-an Mo

IPC: H05K1/02

CPC classification number: H05K1/0281 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: A flexible printed circuit board includes a substrate, signal lines, a first reinforcing layer, and a second reinforcing layer. The first surface of the substrate includes a layout zone and a reinforcing zone disposed nearby the layout zone. The signal lines are disposed on the layout zone. The first reinforcing layer is disposed on the reinforcing zone. The second reinforcing layer is disposed on the second surface of the substrate.

Abstract translation: 柔性印刷电路板包括基板，信号线，第一加强层和第二增强层。 基板的第一表面包括设置在布局区附近的布局区和加强区。 信号线布置在布局区域上。 第一加强层设置在加强区上。 第二加强层设置在基板的第二表面上。

公开(公告)号：US20100252303A1

公开(公告)日：2010-10-07

申请号：US12752376

申请日：2010-04-01

Applicant: Chen-Chuan Chang

Inventor： Chen-Chuan Chang

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/02 ,  B23K26/36

CPC classification number: H05K3/007 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/06 ,  H05K3/062 ,  H05K3/108 ,  H05K3/428 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the periphery of the removing area, a second dielectric layer disposed on the first dielectric layer, a circuit layer disposed on the second dielectric layer, a second laser resistant structure disposed on the second dielectric layer and located at the periphery of the removing area, and a third dielectric layer disposed on the second dielectric layer. The second laser resistant structure is insulated from the circuit layer. There is a gap between the second laser resistant structure and the circuit layer, and the vertical projection of the gap on a first surface overlaps the first laser resistant structure. The third dielectric layer exposes the portion of the circuit layer within the removing area.

Abstract translation: 提供具有去除区域的电路板。 所述电路板包括第一介电层，设置在所述第一介电层上并位于所述去除区的外围的第一耐光结构，设置在所述第一介电层上的第二介电层，设置在所述第二介电层上的电路层 设置在所述第二电介质层上并位于所述去除区域周边的第二激光阻挡结构，以及设置在所述第二电介质层上的第三电介质层。 第二个耐光结构与电路层绝缘。 在第二激光电阻结构和电路层之间存在间隙，并且第一表面上的间隙的垂直投影与第一激光结构重叠。 第三电介质层暴露出去除区域内的电路层的部分。

公开(公告)号：US20100243310A1

公开(公告)日：2010-09-30

申请号：US12430131

申请日：2009-04-27

Applicant: YU-CHANG PAI ,  CHIEN-HUNG LIU ,  PO-CHUAN HSIEH

Inventor： YU-CHANG PAI ,  CHIEN-HUNG LIU ,  PO-CHUAN HSIEH

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09718 ,  H05K2201/09781

Abstract: A printed circuit board (PCB) includes a power layer, a ground layer, a through hole, and a conductor. The through hole goes through the power layer and the ground layer. The conductor includes a hollow columnar main body and an extending portion. The main body is formed in a bounding wall of the through hole, and is conductively connected to one of the power layer and the ground layer, and insulated from the other one of the power layer and the ground layer by an insulation area. The extending portion extends out from the circumferential surface of the main body. The extending portion extends into the insulation area and is insulated from the other one of the power layer and the ground layer, to increase an area of the power layer facing the ground layer.

Abstract translation: 印刷电路板（PCB）包括功率层，接地层，通孔和导体。 通孔穿过电源层和接地层。 导体包括中空柱状主体和延伸部分。 主体形成在通孔的边界壁中，并且与功率层和接地层中的一个导电连接，并且通过绝缘区域与功率层和接地层中的另一个绝缘。 延伸部分从主体的圆周表面伸出。 延伸部分延伸到绝缘区域中并与功率层和接地层中的另一个绝缘，以增加面向接地层的功率层的面积。

公开(公告)号：US07804693B2

公开(公告)日：2010-09-28

申请号：US11167858

申请日：2005-06-27

Applicant: Chang-soo Jang ,  Jae-chul Ryu ,  Seong-young Han

Inventor： Chang-soo Jang ,  Jae-chul Ryu ,  Seong-young Han

IPC: H01R9/00

CPC classification number: H01L23/49838 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

Abstract: There are provided a printed circuit board having a structure for relieving a stress concentration on an outer most lead of leads, due to a difference in thermal expansion coefficients between the semiconductor device and the printed circuit board when the semiconductor device is mounted on the printed circuit board. The printed circuit board includes an inner lead portion to be connected to the semiconductor device. The inner lead portion includes a plurality of leads, arranged in parallel with a same pitch in a predetermined area, and additional leads located near both ends of the predetermined area in which the plurality of leads are arranged in parallel, respectively, wherein each of the plurality of leads has a pitch smaller than 30 μm and a width of the additional lead is wider than 20 μm. There are also provided a semiconductor chip package equipped with the printed circuit board according to the present invention.

Abstract translation: 由于半导体器件与印刷电路板之间的热膨胀系数不同，当半导体器件安装在印刷电路板上时，提供了一种印刷电路板，该印刷电路板具有用于消除引线外部引线上的应力集中的结构 板。 印刷电路板包括要连接到半导体器件的内引线部分。 内部引线部分包括在预定区域中以相同间距平行布置的多个引线，以及分别位于多个引线平行布置的预定区域的两端附近的附加引线，其中每个引线 多个引线具有小于30μm的间距，并且附加引线的宽度大于20μm。 还提供了一种配备有根据本发明的印刷电路板的半导体芯片封装。

公开(公告)号：US07799603B2

公开(公告)日：2010-09-21

申请号：US12466361

申请日：2009-05-14

Applicant: Chung-Jen Tsai ,  Chia-Cheng Chen ,  Hung-Yi Chang ,  Tung-Yao Kuo ,  Cheng-Hsien Lin

Inventor： Chung-Jen Tsai ,  Chia-Cheng Chen ,  Hung-Yi Chang ,  Tung-Yao Kuo ,  Cheng-Hsien Lin

IPC: H01L21/52

CPC classification number: H05K1/0271 ,  H05K3/0052 ,  H05K3/303 ,  H05K3/341 ,  H05K2201/09127 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.

Abstract translation: 一种用于在印刷电路板上组装电子部件的方法包括以下步骤。 首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。 其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。 第三，电子部件安装在主体部分上并与导电图形电连接。 第五，去除不想要的部分。

公开(公告)号：US20100214039A1

公开(公告)日：2010-08-26

申请号：US12704529

申请日：2010-02-12

Applicant: Pei-Yang Lin ,  Chih-Chung Lin ,  Wen-Lin Yang

Inventor： Pei-Yang Lin ,  Chih-Chung Lin ,  Wen-Lin Yang

IPC: H01P1/203

CPC classification number: H01P1/20345 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09636 ,  H05K2201/09781

Abstract: A filter for filtering noise generated by a differential signal having a specific wavelength transmitted by a first transmission line and a second transmission line is disclosed. The filter includes a multi-layer substrate, a first microstrip line and a second microstrip line. The first and the second transmission lines and the first and the second microstrip lines are disposed at the multi-layer substrate. In addition, one end of the first microstrip line and one end of the second microstrip line are electrically connected to the first and the second transmission lines, respectively, by passing through the vias, and the other end is in a floating state. The impedances of the first and the second microstrip lines match the impedances of the first and the second transmission lines, respectively. Thus, the first and the second microstrip lines may filter the noise generated by the differential signal having the specific wavelength.

Abstract translation: 公开了一种用于滤波由具有由第一传输线和第二传输线传输的特定波长的差分信号产生的噪声。 滤波器包括多层基板，第一微带线和第二微带线。 第一和第二传输线以及第一和第二微带线设置在多层基板上。 此外，第一微带线的一端和第二微带线的一端分别通过穿过通孔而电连接到第一和第二传输线，另一端处于浮置状态。 第一和第二微带线的阻抗分别匹配第一和第二传输线的阻抗。 因此，第一和第二微带线可以滤除由具有特定波长的差分信号产生的噪声。

公开(公告)号：US20100209854A1

公开(公告)日：2010-08-19

申请号：US12706643

申请日：2010-02-16

Applicant: Felix Betschon ,  Markus Halter

Inventor： Felix Betschon ,  Markus Halter

IPC: G03F7/20

CPC classification number: G02B6/42 ,  C23F1/02 ,  G02B6/136 ,  G02B6/4224 ,  G02B6/423 ,  G02B2006/12173 ,  H05K1/0269 ,  H05K1/0274 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/061 ,  H05K2201/09781 ,  H05K2201/09918

Abstract: An electro-optical printed circuit board contains electrical conductor tracks on the one hand and optical waveguide structures on the other hand. The optical waveguide structures comprise a bottom layer, a core layer and a cladding layer. Visible areas are applied to the printed circuit board, and the core layer is applied later both to the bottom layer as well as the visible areas and structured both on the bottom layer as well as the visible areas. This structure is then transferred to the visible areas, e.g. by etching. Reference marks are thus produced which contain the information on the actual position of the optical waveguide structures.

Abstract translation: 另一方面，电光印刷电路板一方面包含电导体轨道和光波导结构。 光波导结构包括底层，芯层和包覆层。 将可见区域应用于印刷电路板，并且将核心层稍后应用于底层以及可见区域，并且在底层以及可见区域上构造。 然后将该结构转移到可见区域，例如， 通过蚀刻。 因此产生包含关于光波导结构的实际位置的信息的参考标记。