公开(公告)号：US20170200694A1

公开(公告)日：2017-07-13

申请号：US15427875

申请日：2017-02-08

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Robert Neuman

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H05K3/32 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49883 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2224/85801 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

公开(公告)号：US09706645B2

公开(公告)日：2017-07-11

申请号：US14428358

申请日：2015-01-07

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Hu He

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/05

CPC classification number: H05K1/028 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/05 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10553

Abstract: A L-Bending PCB includes a straight portion and a bending portion connecting to the straight portion, the straight portion has a metal substrate bottom, an insulation layer, a conductive layer and a protective layer. The insulation layer is disposed on a partial surface of the metal substrate bottom, the conductive layer is disposed on the insulation layer and the protective layer is disposed on the conductive layer.

公开(公告)号：US09698563B2

公开(公告)日：2017-07-04

申请号：US13883354

申请日：2011-10-27

Applicant: Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin Il Agcaoili Narag ,  James R. White ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney ,  Nathan P. Kreutter ,  Qihong Nie ,  Jian Xia Gao

Inventor： Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin Il Agcaoili Narag ,  James R. White ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney ,  Nathan P. Kreutter ,  Qihong Nie ,  Jian Xia Gao

IPC: H01L29/22 ,  H01S5/024 ,  H01L33/64 ,  H01L33/48 ,  H05K1/18 ,  H01L23/00

CPC classification number: H01S5/024 ,  H01L24/32 ,  H01L33/486 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/183 ,  H05K1/189 ,  H05K2201/10106 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.

公开(公告)号：US20170175961A1

公开(公告)日：2017-06-22

申请号：US15382091

申请日：2016-12-16

Applicant: Applied Electronic Materials, LLC

Inventor： Tom Martin

IPC: F21S8/04 ,  F21V23/06 ,  F21S4/28 ,  B05D7/00 ,  F21V29/74 ,  F21V19/00 ,  B05D3/02 ,  B05D1/28 ,  F21V29/89 ,  F21V21/005

CPC classification number: F21S8/04 ,  E04B9/00 ,  F21S4/28 ,  F21S8/026 ,  F21V19/003 ,  F21V21/005 ,  F21V23/06 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/05 ,  H05K1/092 ,  H05K3/1216 ,  H05K2201/10106

Abstract: Lighting systems are provided for use in building interiors or for exterior lighting. The lighting systems include a light module formed of a heat conductive structural substrate, together with a lighting configuration formed directly on an exposed surface of the substrate via thick film printing techniques. The substrate is a highly heat conductive material such aluminum or aluminum alloy, and includes an electrically insulating layer printed and cured directly on an exposed surface of the substrate, a circuit layer printed and cured directly on the insulating layer, and a plurality of LEDs electrically attached to the circuit layer. In this manner, each light module is formed as a single-component, packaged construct for easy installation, and facilitates conductive transfer of heat away from the LEDs for enhanced power efficiency. The ceiling modules provide electrical and mechanical connectivity to form a self-supporting, integrated ceiling grid.

公开(公告)号：US20170170152A1

公开(公告)日：2017-06-15

申请号：US15376888

申请日：2016-12-13

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae WI ,  Byungjoon RHEE ,  Bongchu SHIM

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/38 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/0753 ,  G06F1/1652 ,  H01L24/29 ,  H01L24/32 ,  H01L24/95 ,  H01L27/156 ,  H01L33/38 ,  H01L33/385 ,  H01L33/504 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2933/0091 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/10106

Abstract: A display device including a substrate including a wiring electrode; a conductive adhesive layer including an anisotropic conductive medium, and disposed to cover the wiring electrode; and a plurality of semiconductor light emitting devices adhered to the conductive adhesive layer and electrically connected to the wiring electrode through the anisotropic conductive medium. Further, the conductive adhesive layer includes a first layer disposed on the substrate; a second layer deposited on the first layer and including the anisotropic conductive medium; and a third layer deposited on the second layer, to which the semiconductor light emitting devices are adhered. Further, at least one of the second layer and the third layer includes a white pigment configured to reflect light emitted by the semiconductor light emitting device.

公开(公告)号：US20170167663A1

公开(公告)日：2017-06-15

申请号：US15316396

申请日：2015-05-20

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Ya-Kuang HSIAO ,  Chanjuan WU

IPC: F21K9/232 ,  F21V3/00 ,  F21K9/237 ,  F21V21/14 ,  F21K9/90 ,  F21S4/24

CPC classification number: F21K9/232 ,  F21K9/237 ,  F21K9/90 ,  F21S4/22 ,  F21S4/24 ,  F21V3/00 ,  F21V3/02 ,  F21V21/14 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2107/30 ,  F21Y2107/70 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/10106

Abstract: Disclosed is a lighting device (100) comprising a plurality of solid state lighting (SSL) elements (20) such as LEDs that can be manufactured in a cost-effective manner and that emulates the appearance of an incandescent lighting device. The lighting device has a luminous arrangement comprising opposing tubular portions (12, 14) in between which strip-shaped portions (16) that carry the SSL elements radially extend. The luminous arrangement is mounted on a support structure (30) fitted inside a transmissive body (1 10) of the lighting device. A luminaire including the lighting device, a method of manufacturing the luminous arrangement and a method of manufacturing the lighting device are also disclosed.

公开(公告)号：US20170159916A1

公开(公告)日：2017-06-08

申请号：US15042264

申请日：2016-02-12

Applicant: FEIT ELECTRIC COMPANY, INC.

Inventor： Shen Yanwei

IPC: F21V19/00 ,  F21V29/89 ,  F21V17/10 ,  F21V23/00 ,  F21V29/70

CPC classification number: F21V19/0025 ,  F21V17/101 ,  F21V19/005 ,  F21V23/005 ,  F21V29/70 ,  F21V29/89 ,  F21Y2101/00 ,  H05K1/056 ,  H05K1/142 ,  H05K3/005 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10545

Abstract: Various embodiments provide a light emitting diode (LED) module. In one embodiment, the LED module comprises a circuit board; a peripheral metal board abutting and about said circuit board; an electrical insulation layer on both a first surface and a second surface of said circuit board and said peripheral metal board; electrical traces on said electrical insulation layer; and one or more LEDs mounted on said electrical traces and said electrical insulation layer over said peripheral metal board.

公开(公告)号：US09657922B2

公开(公告)日：2017-05-23

申请号：US13838198

申请日：2013-03-15

Applicant: CREE, INC.

Inventor： Gerald Negley ,  Praneet Athalye ,  Shaow B. Lin

IPC: H01J19/38 ,  F21V15/00 ,  F21K9/90 ,  F21V25/02 ,  F21K9/232 ,  F21K9/60 ,  C09D183/04 ,  C08L33/08 ,  C08L75/04 ,  C08L75/16 ,  H05K3/28 ,  F21Y115/10 ,  F21Y107/30

CPC classification number: F21V15/00 ,  C08L33/08 ,  C08L75/04 ,  C08L75/16 ,  C09D183/04 ,  F21K9/232 ,  F21K9/60 ,  F21K9/90 ,  F21V25/02 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/287 ,  H05K2201/10106 ,  Y10T29/49117 ,  Y10T29/49146 ,  H01L2924/00

Abstract: The present disclosure discloses a method for providing protective coatings onto an energizable LED component coupled to an electrical path. More particularly, the present disclosure relates to LED lamps comprising transparent dielectric coatings and LED lamps and devices made thereby.

公开(公告)号：US20170135215A1

公开(公告)日：2017-05-11

申请号：US15346847

申请日：2016-11-09

Applicant: The University of Memphis Research Foundation

Inventor： Bashir I. Morshed

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03 ,  H05K3/12 ,  H05K1/09 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/181 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/0393 ,  H05K1/097 ,  H05K1/113 ,  H05K1/118 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/125 ,  H05K3/303 ,  H05K3/4007 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0759 ,  H05K2203/1131

Abstract: A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.

公开(公告)号：US09644832B2

公开(公告)日：2017-05-09

申请号：US13951800

申请日：2013-07-26

Applicant: Seoul Semiconductor Co., Ltd.

Inventor： Mi Ra Yun

IPC: F21V21/00 ,  F21V7/00 ,  F21V29/83 ,  F21S8/04 ,  F21V23/00 ,  F21W131/40 ,  H05K1/02 ,  F21Y101/00 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: F21V29/83 ,  F21S8/04 ,  F21V7/005 ,  F21V23/005 ,  F21W2131/40 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K2201/09063 ,  H05K2201/10106

Abstract: Disclosed is a lighting apparatus that can be provided in a warehouse and driven by using an industrial power source and has superior light efficiency and long life span.The disclosed lighting apparatus is provided in a warehouse and driven by an industrial power source, and comprises a main body having a plurality of concave portions and a plurality of convex portions; and a plurality of light emitting modules disposed in the concave portions of the main body, thereby having low power consumption and long life span.