公开(公告)号：US11765815B2

公开(公告)日：2023-09-19

申请号：US17132242

申请日：2020-12-23

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Rashmi Prasad ,  Chandra S. Namuduri ,  Muhammad H. Alvi

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/18 ,  H02P27/06

CPC classification number: H05K1/0257 ,  H02P27/06 ,  H05K1/14 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272

Abstract: A bi-directional solid state switch includes: a first bus bar; a second bus bar; a first solid state switch implemented on a first printed circuit board (PCB), the first solid state switch including: a first control terminal; a first terminal electrically connected to the first bus bar; and a second terminal; and a second solid state switch implemented on a second PCB, the second solid state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid state switch; and a fourth terminal electrically connected to the second bus bar.

公开(公告)号：US20230262887A1

公开(公告)日：2023-08-17

申请号：US18107051

申请日：2023-02-08

Applicant: Lear Corporation

Inventor： Luis Miguel Muñoz Garcia ,  Carlos Ramon Borrego Garcia ,  Joan Ignasi Ferran Palau ,  Gloria Simo Quinonero ,  Oscar Cano Salomo ,  Victor Poblet-Espolet

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0296 ,  H05K3/341 ,  H05K2201/10272

Abstract: An apparatus includes a circuit board and a plurality of bus bars fixed to the circuit board. The plurality of bus bars may include a first bus bar and a second bus bar formed from adjacent portions of a bus bar wire. The first bus bar may include a first bus bar first unplated portion and the second bus bar may include a second bus bar first unplated portion. The first bus bar first unplated portion and the second bus bar first unplated portion may be formed during formation of the first bus bar.

公开(公告)号：US11711887B2

公开(公告)日：2023-07-25

申请号：US17619054

申请日：2020-05-28

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Shungo Hiratani ,  Shinsuke Okumi ,  Arinobu Nakamura

IPC: H05K1/02

CPC classification number: H05K1/0207 ,  H05K1/0209 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10553 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2201/10984

Abstract: An object of the present disclosure is to be able to further reduce the size of a substrate structure including a plurality of elements. The substrate structure includes: a base substrate that includes a first conductive plate and a second conductive plate; a first element connected to the first conductive plate and the second conductive plate; and a second element connected to the first conductive plate and the second conductive plate. The first conductive plate and the second conductive plate are disposed on the same plane on the base substrate in a state of being electrically insulated from each other, the first element is mounted on a first main surface of the base substrate, and the second element is mounted on a second main surface that is on the opposite side to the first main surface relative to the base substrate.

公开(公告)号：US11700715B2

公开(公告)日：2023-07-11

申请号：US17261808

申请日：2019-07-18

Applicant: META SYSTEM S.p.A.

Inventor： Giuseppe Simonazzi ,  Cesare Lasagni

IPC: H05K7/20 ,  H02J7/00 ,  H02M7/00 ,  H05K7/14

CPC classification number: H05K7/20927 ,  H02J7/0042 ,  H02M7/003 ,  H05K7/1432 ,  H05K2201/10272

Abstract: A battery charger for vehicles comprises one outer container, one electronic appliance housed inside the container, operatively connectable to an electric battery of a vehicle and configured for the recharge of the battery, and one cooling circuit of the electronic appliance, wherein the electronic appliance comprises one electronic board provided with an insulated metal substrate associated with the cooling circuit, with a layer of electrically insulating material made on one portion of the insulated metal substrate, and with one electronic circuit made on the layer of electrically insulating material, in which the electronic board comprises one conductive metal bar for the transport and the distribution of current, electrically connected to the electronic circuit and provided with one portion arranged in direct contact with one surface portion of the electronic board, for the cooling of the conductive metal bar by the cooling circuit.

公开(公告)号：US11696417B2

公开(公告)日：2023-07-04

申请号：US17859449

申请日：2022-07-07

Applicant: WOLFSPEED, INC.

Inventor： Matthew Feurtado ,  Brice McPherson ,  Daniel Martin ,  Alexander Lostetter

IPC: H05K7/14 ,  H02M1/088 ,  H02M7/00 ,  H02M7/537 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20 ,  H05K5/00 ,  H05K5/02 ,  H02M1/00

CPC classification number: H05K7/1432 ,  H02M1/088 ,  H02M7/003 ,  H02M7/537 ,  H05K1/0271 ,  H05K1/181 ,  H05K5/0069 ,  H05K5/0247 ,  H05K7/20509 ,  H05K7/20909 ,  H02M1/0054 ,  H05K2201/064 ,  H05K2201/10151 ,  H05K2201/10272

Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.

公开(公告)号：US20190208617A1

公开(公告)日：2019-07-04

申请号：US16327143

申请日：2017-08-21

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Yukinori KITA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H02G3/16 ,  H05K1/181 ,  H05K7/06 ,  H05K2201/10272

Abstract: Provided is a conductive member including a busbar having a through hole, and a metal member fixed to the busbar, the metal member including a shaft portion passed through the through hole, and a first head portion at one end portion of the shaft portion, the first head portion having an outer diameter larger than the diameter of the through hole. Since the metal member includes the first head portion, it is possible to increase the heat capacity of the metal member as compared with that achieved with a conventional conductive member that does not include the first head portion. Accordingly, it is possible to further increase the heat dissipation of the conductive member using a simple configuration.

公开(公告)号：US20180310394A1

公开(公告)日：2018-10-25

申请号：US15771687

申请日：2016-10-28

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Takehito Kobayashi

IPC: H05K1/02 ,  H05K1/18 ,  H02G3/16 ,  H02G3/03

CPC classification number: H05K1/0203 ,  H02G3/03 ,  H02G3/16 ,  H05K1/181 ,  H05K7/20 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: A circuit structure that includes: an insulating heat transfer member that transfers heat from a bus bar to a heat dissipating member, is insulating, and is provided between the bus bar and the heat dissipating member; and a restricting member that restricts movement of the insulating heat transfer member that is caused by an increase in the temperature of the insulating heat transfer member, and is provided between the bus bar and the heat dissipating member. The restricting member is provided with heat transfer openings for bringing the insulating heat transfer member into contact with the bus bar, and, the insulating heat transfer member 80 has a smaller area than an opening area of the heat transfer openings, in a state of being in contact with the bus bar.

公开(公告)号：US10057974B2

公开(公告)日：2018-08-21

申请号：US15343512

申请日：2016-11-04

Applicant: Hamilton Sundstrand Corporation

Inventor： Debabrata Pal

IPC: H05K1/02 ,  H01H1/62 ,  H05K7/20 ,  H02G5/08 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0203 ,  H01H1/62 ,  H01H50/048 ,  H01H50/12 ,  H01R25/162 ,  H02B1/056 ,  H02B1/56 ,  H02G5/08 ,  H05K1/181 ,  H05K3/303 ,  H05K7/20254 ,  H05K2201/10053 ,  H05K2201/10272 ,  H05K2201/10295 ,  H05K2201/10409

Abstract: An electrical contactor assembly is provided including: an electrical contactor; an electrical bus bar; a panel; at least one post protruding through the panel and in contact with the electrical bus bar, the post being constructed from an electrically and thermally conductive material, wherein a first end of the at least one post is configured to electrically and thermally connect to the electrical contactor; and a liquid cooled heat sink thermally connected to a second end of the at least one post through the electrical bus bar, wherein the liquid cooled heat sink in operation circulates liquid coolant through the liquid cooled heat sink to absorb heat.

公开(公告)号：US10017133B2

公开(公告)日：2018-07-10

申请号：US15355149

申请日：2016-11-18

Applicant: YAZAKI CORPORATION

Inventor： Mitsunori Tsunoda ,  Gaku Ito ,  Tomoaki Sasaki ,  Shuji Kimura ,  Taku Furuta ,  Shoichi Nomura

IPC: B60R16/02 ,  H05K3/26 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/04 ,  H05K3/24

CPC classification number: B60R16/02 ,  B60R16/0215 ,  H05K1/0265 ,  H05K1/0284 ,  H05K1/181 ,  H05K3/043 ,  H05K3/045 ,  H05K3/125 ,  H05K3/247 ,  H05K3/26 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/09036 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10053 ,  H05K2201/10272 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K2203/0545

Abstract: An instrument panel as a vehicular panel includes a panel body on a surface side of which key tops are installed, a printed wiring section arranged on the surface side of the panel body, and an insulation outer layer arranged on the surface side of the panel body so as to cover the printed wiring section.

公开(公告)号：US09961758B1

公开(公告)日：2018-05-01

申请号：US15289426

申请日：2016-10-10

Applicant: Nidec Motor Corporation

Inventor： William Pickering ,  Bruce A. Nielsen

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  H05K1/18 ,  H05K5/00 ,  H01L25/07 ,  H05K1/03 ,  H01M10/42

CPC classification number: H05K1/0206 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/49827 ,  H01L23/49844 ,  H01L25/072 ,  H01M10/425 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K5/0008 ,  H05K5/0026 ,  H05K7/1432 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/10037 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10295

Abstract: An electrical device configuration enables heat to be dissipated from a multi-layer printed circuit board (PCB) while handling electrical currents in excess of 200 amps. The semiconductor devices that convert input DC current to output AC current are mounted to a side of the PCB that is opposite the side of the PCB that receives the input DC current. A base plate that acts as a heat sink includes recessed areas to receive the semiconductor devices and enable the PCB to be positioned close to the base plate. Thermal vias are provided in the PCB to conductive heat from the semiconductor devices to the side of the PCB that receives the input current. Also, the busbars for receiving the input current are positioned to provide short resistive paths to the current to reduce the generation of heat by the current flowing in the PCB.