公开(公告)号：US09680273B2

公开(公告)日：2017-06-13

申请号：US13843274

申请日：2013-03-15

Applicant: David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

Inventor： David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

IPC: H01R43/16 ,  H01R12/70 ,  H01R12/73 ,  H01R12/71 ,  H01R13/24 ,  H05K3/28 ,  H05K3/40

CPC classification number: H01R43/16 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/73 ,  H01R13/2407 ,  H01R13/2442 ,  H05K3/281 ,  H05K3/285 ,  H05K3/4015 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/2036 ,  Y10T29/49208

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.

公开(公告)号：US09674950B1

公开(公告)日：2017-06-06

申请号：US14268775

申请日：2014-05-02

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/03 ,  H05K3/32

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more metal foils, one metal foil coupled to one electrical connection point on an electronic component. The metal foil is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the metal foil.

公开(公告)号：US09585248B2

公开(公告)日：2017-02-28

申请号：US14988085

申请日：2016-01-05

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroharu Inoue ,  Shingo Yoshioka

IPC: B32B15/08 ,  B32B15/09 ,  B32B15/092 ,  B32B15/098 ,  B32B27/04 ,  C09J163/00 ,  H05K1/03 ,  C08L63/00 ,  C08J5/24 ,  C08L79/08 ,  C09D163/00 ,  C09D179/08 ,  C08G59/24 ,  C08G59/62

CPC classification number: H05K1/0373 ,  B32B2311/00 ,  B32B2457/08 ,  C08G59/245 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/08 ,  C08J2433/00 ,  C08L63/00 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/03 ,  C09D163/00 ,  C09D179/08 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/0162 ,  H05K2201/09136 ,  Y10T156/10 ,  Y10T428/31529 ,  C08L33/08

Abstract: A resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

Abstract translation: 通过以999μm/分钟拉伸，当应变量从0％增加到0.3％时，成为表现出力响应性能使得由拉伸应力 - 应变曲线f1（x）包围的面积的固化产物的树脂组合物 而当x轴上的应变量和y轴上的拉伸应力也被x轴包围时，大于应变应变曲线f2（x）所包围的面积，当应变量减小时 0.3％，并且在施加拉伸应力之前和之后，由x轴包围，拉伸应力为0时的应变量的变化量为0.05％以下。

公开(公告)号：US09554463B2

公开(公告)日：2017-01-24

申请号：US14638272

申请日：2015-03-04

Applicant: Rogers Corporation

Inventor： Murali Sethumadhavan ,  Ani Shere ,  Mike White

IPC: H01L29/18 ,  H05K1/03 ,  H01L25/075 ,  H01L33/48 ,  H01L33/60 ,  H05K1/02 ,  D21H13/00

CPC classification number: H05K1/0366 ,  D21H13/00 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/038 ,  H05K2201/0141 ,  H05K2201/0162 ,  H05K2201/0191 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T428/2495 ,  H01L2924/00

Abstract: A dielectric substrate comprises a resin composition impregnated with non-woven fibrous mat material having a thickness of 5 mils (127 micrometers), wherein the fibrous mat material comprises fibers, having a diameter of 1 nm to 10 μm, that have been extruded through one or more openings to produce fibers that have been collected in the form of a fibrous non-woven mat, and wherein the fibers exhibit a multi-directional orientation in the non-woven mat material. The dielectric substrate is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent electrical and mechanical properties.

Abstract translation: 电介质基材包括浸渍有5密耳（127微米）厚度的无纺纤维垫材料的树脂组合物，其中纤维垫材料包括直径为1nm至10μm的纤维，其已经通过一个挤出 或更多的开口以产生以纤维无纺毡的形式收集的纤维，并且其中所述纤维在所述无纺毡材料中呈现多方向取向。 电介质基片在电路材料，电路和多层电路中是有用的，经济地制造，并具有优良的电气和机械性能。

公开(公告)号：US09470395B2

公开(公告)日：2016-10-18

申请号：US13834599

申请日：2013-03-15

Applicant: ABL IP HOLDING LLC

Inventor： Craig Eugene Marquardt ,  Jie Chen ,  Daniel Aaron Weiss

IPC: F21V7/00 ,  F21V5/04 ,  F21V23/00 ,  H05K1/02 ,  F21V13/04 ,  F21V5/00 ,  F21Y101/02 ,  H05K3/28

CPC classification number: F21V5/048 ,  B29D11/00807 ,  B29K2083/00 ,  B29K2105/253 ,  F21V5/007 ,  F21V5/008 ,  F21V5/04 ,  F21V7/22 ,  F21V13/04 ,  F21V19/002 ,  F21V23/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/10106 ,  H05K2203/1327 ,  Y10T29/49124

Abstract: Disclosed are optics over a light source, such as, but not limited to, an LED on a circuit board. The optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED. The optic may include a lens and may conform to the shape of the circuit board.

Abstract translation: 公开了光源上的光学元件，例如但不限于电路板上的LED。 光学元件不完全封装LED，而是包括内表面，使得在光学元件和LED之间存在气隙。 光学元件可以包括透镜并且可以符合电路板的形状。

公开(公告)号：US20160172741A1

公开(公告)日：2016-06-16

申请号：US14964635

申请日：2015-12-10

Applicant: Rahul Panat ,  Deuk Hyoun Heo

Inventor： Rahul Panat ,  Deuk Hyoun Heo

IPC: H01P11/00

CPC classification number: B22F3/1055 ,  B22F1/0044 ,  B22F7/08 ,  B22F2003/1058 ,  B22F2999/00 ,  B29C70/882 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y80/00 ,  G06F1/163 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/0206 ,  H01F41/046 ,  H01G4/1218 ,  H01P11/001 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0284 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/097 ,  H05K3/1241 ,  H05K3/14 ,  H05K3/22 ,  H05K3/4644 ,  H05K2201/0162 ,  H05K2201/10098 ,  H05K2203/0126 ,  Y10T29/49016 ,  Y10T29/49124 ,  Y10T29/49155 ,  B22F1/0018 ,  B22F3/008

Abstract: Novel methods for micro-additive manufacturing three dimensional sub-millimeter components are disclosed herein. The methods can include dispensing a dielectric at positions on a substrate so as to provide dielectric structures having an aspect ratio of up to 1:20. The methods can also include in-situ curing of the dielectric structure upon dispensing of the dielectric wherein the dispensing and curing steps provide for three dimensional configurations. Direct printing a metal nanoparticle solution on the dielectric to create conductive traces and thereafter sintering the printed nanoparticle solution so as to cure the conductive traces enables three dimensional conductive (antenna) elements having a length and width scale of down to 1 μm.

Abstract translation: 本文公开了微添加剂制造三维亚毫米部件的新方法。 所述方法可以包括在基板上的位置处分配电介质，以便提供具有高达1:20的纵横比的电介质结构。 所述方法还可以包括在分配电介质时电介质结构的原位固化，其中分配和固化步骤提供三维构型。 在电介质上直接印刷金属纳米颗粒溶液以产生导电迹线，然后烧结印刷的纳米颗粒溶液以固化导电迹线，使能够具有至少1μm的长度和宽度尺度的三维导电（天线）元件。

公开(公告)号：US20160172099A1

公开(公告)日：2016-06-16

申请号：US14964451

申请日：2015-12-09

Applicant: Washington State University

Inventor： Rahul P. Panat ,  Deuk H. Heo

IPC: H01F27/28 ,  H01F41/04 ,  H01F41/02 ,  H01F27/24 ,  H01G4/12

CPC classification number: B22F3/1055 ,  B22F1/0018 ,  B22F3/008 ,  B22F2003/1058 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y80/00 ,  C22C2202/02 ,  G06F1/163 ,  H01F17/0006 ,  H01F17/0033 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/0206 ,  H01F41/046 ,  H01G4/002 ,  H01G4/1218 ,  H01P11/001 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/165 ,  H05K3/14 ,  H05K3/22 ,  H05K3/4644 ,  H05K2201/0162

Abstract: Three-dimensional inductors may comprise a passivation layer disposed on a substrate, a three-dimensional pillar comprising a ferromagnetic material disposed on the substrate or the passivation layer, and a conductive trace wound at least partially around the pillar. Three-dimensional capacitors may comprise a passivation layer disposed on a substrate, at least two support pillars comprising a polymeric material disposed on the passivation layer or the substrate, at least two electrodes disposed between the support pillars, a dielectric disposed between the electrodes, and a metal trace. Methods of manufacturing the three-dimensional passives, such as inductors and capacitors, may comprise direct writing the components and curing them for on-chip applications.

Abstract translation: 三维电感器可以包括设置在衬底上的钝化层，包括设置在衬底或钝化层上的铁磁材料的三维柱，以及至少部分地围绕柱体缠绕的导电迹线。 三维电容器可以包括设置在衬底上的钝化层，至少两个支撑柱，其包括设置在钝化层或衬底上的聚合材料，设置在支撑柱之间的至少两个电极，设置在电极之间的电介质和 金属痕迹。 制造三维无源元件（例如电感器和电容器）的方法可以包括直接写入元件并固化它们用于片上应用。

公开(公告)号：US20160167132A1

公开(公告)日：2016-06-16

申请号：US14957849

申请日：2015-12-03

Applicant: Washington State University

Inventor： Rahul Panat

IPC: B22F3/105 ,  B28B17/00 ,  B28B1/00

CPC classification number: B22F3/1055 ,  B22F1/0018 ,  B22F3/1115 ,  B22F2003/1058 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y80/00 ,  G06F1/163 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/0206 ,  H01F41/046 ,  H01G4/1218 ,  H01G11/24 ,  H01M4/13 ,  H01P11/001 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/14 ,  H05K3/22 ,  H05K3/4644 ,  H05K2201/0162 ,  Y02E60/13 ,  Y02P10/295

Abstract: Techniques for additive deposition are disclosed herein. In one embodiment, a method includes depositing a first portion of a precursor material onto a deposition platform, the precursor material including a suspension of nano-particles and forming a first solid structure of the nano-particles on the deposition platform from the deposited first layer of the precursor material. The method can also include depositing a second portion of the precursor material onto the formed first solid structure of the nano-particles and forming a second solid structure on the first solid structure from the deposited second layer of the precursor material. The three dimensional structure thus formed can be partly or fully cured or sintered during deposition or after deposition resulting in a controlled hierarchical porosity at multiple levels, from mesoscale (e.g., about 10 μm to about 250 μm) to nanoscale (e.g., about 900 nm or less) in the same structure.

Abstract translation: 本文公开了用于添加剂沉积的技术。 在一个实施例中，一种方法包括将前体材料的第一部分沉积到沉积平台上，所述前体材料包括纳米颗粒的悬浮液并且在沉积平台上从沉积的第一层形成纳米颗粒的第一固体结构 的前体材料。 该方法还可以包括将前体材料的第二部分沉积到所形成的纳米颗粒的第一固体结构上，并从沉积的前体材料的第二层在第一固体结构上形成第二固体结构。 如此形成的三维结构可以在沉积期间或沉积后部分或完全固化或烧结，从而从中等尺寸（例如约10μm至约250μm）到纳米尺度（例如，约900nm） 或更小）。

公开(公告)号：US09349932B2

公开(公告)日：2016-05-24

申请号：US14240107

申请日：2012-08-20

Applicant: Jianghong Yu

Inventor： Jianghong Yu

IPC: H01L33/64 ,  H05K1/03 ,  H05K1/18

CPC classification number: H01L33/641 ,  H01L2224/48091 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/10272 ,  H05K2201/10287 ,  H01L2924/00014

Abstract: A flexible lighting assembly 100, a luminaire, a method of manufacturing a flexible layer 102 and a use of the flexible layer 102 is provided. The flexible lighting assembly 100 comprises a flexible layer 102 of a flexible polymer and comprises aC light source 108 which is thermally coupled to the flexible layer 102. The flexible layer 102 comprises boron nitride particles 106 that have a hexagonal crystal structure.

Abstract translation: 提供了柔性照明组件100，照明设备，制造柔性层102的方法和柔性层102的用途。 柔性照明组件100包括柔性聚合物的柔性层102，并且包括热耦合到柔性层102的C光源108.柔性层102包括具有六方晶系结构的氮化硼颗粒106。

公开(公告)号：US09338915B1

公开(公告)日：2016-05-10

申请号：US14228021

申请日：2014-03-27

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/16 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H05K3/10

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more plated through holes, through each of which is coupled an electrically conductive wire. The electrically conductive wire is stitched through the plated through hole and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board.

Abstract translation: 可穿戴电子组件包括耦合到可穿戴电子织物的一个或多个电子模块。 一个或多个电子模块中的每一个包括一个或多个电镀通孔，每个电镀通孔中的每一个都连接有导电线。 导电线穿过电镀通孔和连接电子模块的织物。 电子模块可以包括耦合到印刷电路板的一个或多个电子部件。