公开(公告)号：US20110171785A1

公开(公告)日：2011-07-14

申请号：US13052073

申请日：2011-03-20

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L21/60

CPC classification number: H05K1/021 ,  H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/0061 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then mounting a semiconductor device on the bump opposite a cavity in the bump, wherein a heat spreader includes the bump and a base that includes a portion of the ledge adjacent to the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供凸块和凸缘，将粘合剂安装在凸缘上，包括将凸块插入粘合剂中的开口中，将导电层安装在粘合剂上，包括将凸块与导电 然后使粘合剂在凸起和导电层之间流动，使粘合剂固化，然后提供包括导电层的焊盘，端子和选定部分的导电迹线，然后将半导体器件安装在与空腔相对的凸块上 在凸块中，其中散热器包括凸块和包括邻近凸块的凸缘的一部分的基座，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20110157834A1

公开(公告)日：2011-06-30

申请号：US12898723

申请日：2010-10-06

Applicant: HSIANG-HUA WANG

Inventor： HSIANG-HUA WANG

IPC: H05K7/20 ,  H01R43/00

CPC classification number: H05K1/053 ,  H01L23/142 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/641 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12044 ,  H05K2201/09054 ,  H05K2201/10106 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A heat/electricity discrete metal core-chip on board Module includes a heat dissipation substrate, which has a surface that is recessed to form a carriage zone and a relatively elevated engagement section; a dielectric layer, which is formed of a compound that is formed on the heat dissipation substrate through conversion coating and covers the carriage zone of the heat dissipation substrate, the dielectric layer defining a window like heat conduction zone at a location corresponding to the engagement section of the heat dissipation substrate, so that the heat conduction zone corresponds exactly to the engagement section of the heat dissipation substrate; and an electrical connection layer, which is formed on the dielectric layer. A chip is set on the heat conduction zone and is connected to the electrical connection layer through wire bonding, whereby the paths for heat transfer and electricity transmission are separated.

Abstract translation: 模块上的散热/分散金属芯片模块包括散热基板，其具有凹进的表面以形成滑架区域和相对升高的接合部分; 介电层，其由通过转换涂层形成在散热基板上并覆盖散热基板的滑架区域的化合物形成，电介质层在对应于接合部分的位置处限定窗口状的导热区域 的散热基板，使得导热区域精确地对应于散热基板的接合部分; 以及形成在电介质层上的电连接层。 芯片设置在导热区上，并通过引线接合连接到电连接层，由此分隔用于传热和传输的路径。

公开(公告)号：US20110151626A1

公开(公告)日：2011-06-23

申请号：US13031222

申请日：2011-02-20

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L21/58

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20105 ,  H01L2933/0033 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/445 ,  H05K2201/09054 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives and a base, wherein the first post extends from the base in a first vertical direction into a first opening in the first adhesive and is located within a periphery of the second post, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts, then flowing and solidifying the adhesives, then providing a conductive trace that includes a pad and a terminal, wherein the pad extends beyond the base in the first vertical direction and the terminal extends beyond the base in the second vertical direction, providing a heat spreader that includes the posts and the base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供第一和第二柱，第一和第二粘合剂和基底，其中第一柱从第一垂直方向上的基部延伸到第一粘合剂中的第一开口中并且位于周边 第二柱从第二垂直方向的基部延伸到第二粘合剂中的第二开口，并且基部夹在柱之间并从支柱横向延伸，然后使粘合剂流动并固化，然后提供导电迹线 其包括垫和端子，其中所述垫在所述第一垂直方向上延伸超过所述基部，并且所述端子在所述第二垂直方向上延伸超过所述基部，从而提供包括所述柱和所述基部的散热器，然后安装半导体器件 在第一柱上，将半导体器件电连接到导电迹线上并将半导体器件热连接到该导体 散热器

公开(公告)号：US20110127912A1

公开(公告)日：2011-06-02

申请号：US12956812

申请日：2010-11-30

Applicant: Young Jin LEE ,  Hyung Kun Kim

Inventor： Young Jin LEE ,  Hyung Kun Kim

IPC: H01K1/62 ,  H01L33/62 ,  H01L33/58 ,  H01L33/08 ,  F21V11/00

CPC classification number: H01L33/647 ,  F21S41/147 ,  F21V29/677 ,  F21V29/89 ,  H01L2224/13 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10174 ,  H05K2201/10969

Abstract: Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.

Abstract translation: 公开了一种LED封装，具有该LED封装的LED封装模块及其制造方法以及具有该LED封装模块及其控制方法的头灯模块。 发光二极管封装包括：封装衬底; 安装在所述封装基板的一个表面上的发光二极管芯片; 电极焊盘，形成在所述封装基板的另一个表面上并电连接到所述发光二极管芯片; 以及形成在所述封装基板的另一表面上并与所述电极焊盘电绝缘的散热焊盘。

公开(公告)号：US20110120770A1

公开(公告)日：2011-05-26

申请号：US13055141

申请日：2009-06-23

Applicant: Shinsuke Yokonuma

Inventor： Shinsuke Yokonuma

IPC: H01R4/28

CPC classification number: H05K1/0215 ,  G02F2001/133334 ,  H05K1/118 ,  H05K3/0061 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09054 ,  H05K2201/091

Abstract: Provided is an electronic package wherein a built-in chassis (CS) and an FPC substrate (11) including a ground pattern (12) are mounted on a front bezel (BZ1) and a back bezel (BZ2) formed of a conductive material. A ground pattern (12) is arranged between the back bezel (BZ2) and the built-in chassis (CS), and the back bezel (BZ2) includes a claw section (22) for pressing the ground pattern (12) to the built-in chassis (CS). The claw section (22) has elasticity when the claw section is in a linear state, and presses the ground pattern (12) by a leading end (22T) formed by bending an outer periphery.

Abstract translation: 提供一种电子封装，其中包括接地图案（12）的内置底架（CS）和FPC基板（11）安装在由导电材料形成的前挡板（BZ1）和后挡板（BZ2）上。 背面板（BZ2）和内置机壳（CS）之间布置有接地图案（12），背面板（BZ2）包括用于将接地图案（12）按压到内置 - 底盘（CS）。 当爪部处于直线状态时，爪部22具有弹性，并且通过使外周弯曲形成的前端（22T）将接地图案（12）按压。

公开(公告)号：US07939375B2

公开(公告)日：2011-05-10

申请号：US12714494

申请日：2010-02-28

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106 ,  H01L2224/05599

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将基底安装在粘合剂上，包括使柱与基底中的孔对准， 然后将粘合剂在位于柱和基底之间的孔中的间隙中向上流动，固化粘合剂，然后蚀刻柱以在柱中形成空腔，然后将半导体器件安装在柱上，其中散热器 包括柱和基部，并且半导体器件延伸到空腔中，将半导体器件电连接到衬底并将半导体器件热连接到散热器。

公开(公告)号：US20110095310A1

公开(公告)日：2011-04-28

申请号：US12934533

申请日：2009-03-19

Applicant: Satoshi Komatsubara ,  Kenichi Fukuda ,  Shinobu Otao ,  Toru Furuta

Inventor： Satoshi Komatsubara ,  Kenichi Fukuda ,  Shinobu Otao ,  Toru Furuta

IPC: H01L33/46

CPC classification number: H01L33/644 ,  F21K9/00 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/021 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).

Abstract translation: 提供了一种半导体发光模块及其制造方法，其可实现高亮度发光以及轻量且紧凑的特征。 在半导体发光模块（101）中，在金属薄板（102）上形成用作反射部件的突出部（202），以围绕半导体发光元件（104）。 半导体发光元件（104）例如通过使用导线（201）与印刷电路板（103）连接。 突出部（202）通过例如从后表面压入和弯曲金属薄板（102）而形成，以围绕元件并且高于半导体发光元件（104）。

公开(公告)号：US20110089465A1

公开(公告)日：2011-04-21

申请号：US12975429

申请日：2010-12-22

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00 ,  H01L23/552

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/60 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L33/483 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/0104 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base, an ESD protection layer and an underlayer. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace, electrically isolated from the underlayer and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ESD protection layer is sandwiched between the base and the underlayer. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括支柱，基座，​​ESD保护层和底层。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线，与底层电隔离并热连接到散热器。 柱从基部向上延伸到粘合剂中的开口中，基部从柱延伸，并且ESD保护层夹在基部和底层之间。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20110003437A1

公开(公告)日：2011-01-06

申请号：US12876167

申请日：2010-09-06

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L21/50

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a first conductive layer on the adhesive including aligning the post with an aperture in the first conductive layer, then flowing the adhesive between the post and the first conductive layer, solidifying the adhesive, then etching the post to form a first cavity in the adhesive above the post, depositing a second conductive layer into the first cavity to form a second cavity that extends into the first cavity, providing a conductive trace that includes a pad, a terminal and a selected portion of the first conductive layer, providing a heat spreader that includes the post, the base and a flange that includes a selected portion of the second conductive layer that defines the second cavity, mounting a semiconductor device on the flange in the second cavity, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将第一导电层安装在粘合剂上，包括将柱与孔中的孔对准 第一导电层，然后使粘合剂在柱和第一导电层之间流动，固化粘合剂，然后蚀刻柱以在柱上方的粘合剂中形成第一空腔，将第二导电层沉积到第一腔中以形成第二导电层 空腔，其延伸到第一腔中，提供包括衬垫，端子和第一导电层的选定部分的导电迹线，提供包括柱，基座和凸缘的散热器，所述散热器包括所述第一导电层的选定部分 第二导电层，其限定第二腔，将半导体器件安装在第二腔中的凸缘上，电连接半导体器件 导电迹线并将半导体器件热连接到散热器上。

公开(公告)号：US20100327723A1

公开(公告)日：2010-12-30

申请号：US12492238

申请日：2009-06-26

Applicant: Pei-Choa WANG

Inventor： Pei-Choa WANG

IPC: H01J1/02

CPC classification number: F21V29/51 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/021 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10477

Abstract: A light emitting diode (LED) illumination device includes a vapor chamber, a circuit board and at least one LED. At least one protrusion is formed on a surface of the vapor chamber, and a heat conducting tin layer is formed on the protrusion. The circuit board includes at least one through hole for passing the protrusion. The circuit board is formed by sequentially stacking an insulating layer and a heat conducting layer. The LEDs are installed on and contacted with the protrusions respectively, and each LED has two pins electrically connected to the circuit board. The LED device of the present invention is in a direct contact with the protrusion of the LED, such that the heat dissipated from the LED can be conducted to the vapor chamber, and then the vapor chamber carries away the heat quickly.

Abstract translation: 发光二极管（LED）照明装置包括蒸气室，电路板和至少一个LED。 在蒸气室的表面上形成至少一个突起，并且在突起上形成导热锡层。 电路板包括用于使突出部通过的至少一个通孔。 电路板通过依次层叠绝缘层和导热层而形成。 LED分别安装在突起上并与突起接触，并且每个LED具有两个电连接到电路板的引脚。 本发明的LED装置与LED的突起直接接触，使得从LED散发的热量可以传导到蒸气室，然后蒸气室快速传递热量。