公开(公告)号：US09157579B2

公开(公告)日：2015-10-13

申请号：US14309836

申请日：2014-06-19

Applicant: HUGA OPTOTECH INC. ,  Interlight Optotech Corporation

Inventor： Hong-Zhi Liu ,  Tzu-Chi Cheng

IPC: F21K99/00 ,  F21V19/00 ,  H01L25/075 ,  F21Y101/02 ,  F21Y103/00 ,  F21Y111/00 ,  H01L33/62 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36

CPC classification number: F21K9/00 ,  F21K9/232 ,  F21K9/90 ,  F21V19/003 ,  F21Y2103/10 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H05K1/117 ,  H05K3/285 ,  H05K3/326 ,  H05K3/3405 ,  H05K3/366 ,  H05K2201/09481 ,  H05K2201/10674 ,  H01L2924/00014

Abstract: Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate, LED chips, and first and second electrode plates. The transparent substrate comprises first and second surfaces facing to opposite orientations respectively. The transparent substrate has a via hole tunneling therethrough, which is formed with conductive material to provide a conductive via. The LED chips are mounted on the first surface. The first and second electrode plates are formed on the first and second surfaces respectively. The light emitting diode chips and the conductive via are electrically connected in series between the first and second electrode plates.

Abstract translation: 公开了具有全向光场的LED组件。 LED组件具有透明基板，LED芯片以及第一和第二电极板。 透明基板包括分别面对相反取向的第一表面和第二表面。 透明基板具有穿过其中的通孔，其由导电材料形成以提供导电通孔。 LED芯片安装在第一表面上。 第一和第二电极板分别形成在第一和第二表面上。 发光二极管芯片和导电通孔串联地电连接在第一和第二电极板之间。

公开(公告)号：US20150228706A1

公开(公告)日：2015-08-13

申请号：US14490467

申请日：2014-09-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hee-Kwon Lee

IPC: H01L27/32 ,  G02F1/1368 ,  G02F1/1335 ,  H05K1/02 ,  H05K1/11

CPC classification number: G02F1/1368 ,  G02F1/13452 ,  H01L27/3241 ,  H01L27/3244 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/189 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09672 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: A display device according to an example embodiment of the present invention includes a display panel configured to display an image, the display panel including a plurality of pixels, a chip on film (COF) coupled to the display panel, the COF comprising a driver, a plurality of COF wires and a plurality of COF pads, and a flexible printed circuit board (FPCB) coupled to the COF, the FPCB including a plurality of FPCB wires and a plurality of FPCB pads, wherein the plurality of COF pads are arranged in two rows, and wherein one or more COF pads of the plurality of COF pads in a first row of the two rows are one or more dummy pads.

Abstract translation: 根据本发明的示例性实施例的显示装置包括被配置为显示图像的显示面板，包括多个像素的显示面板，耦合到显示面板的薄膜（COF），包括驱动器的COF， 多个COF线和多个COF垫，以及耦合到COF的柔性印刷电路板（FPCB），所述FPCB包括多个FPCB布线和多个FPCB垫，其中所述多个COF垫布置在 两排，并且其中两行中的第一行中的多个COF焊盘中的一个或多个COF焊盘是一个或多个虚拟焊盘。

公开(公告)号：US20150173183A1

公开(公告)日：2015-06-18

申请号：US14633726

申请日：2015-02-27

Applicant: Metrospec Technology, LLC

Inventor： Henry V. Holec ,  Wm. Todd Crandell

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0293 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01R4/02 ,  H01R9/096 ,  H01R12/523 ,  H01R13/717 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0292 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/113 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K1/147 ,  H05K3/0061 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2201/2027 ,  H05K2203/0228

Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Abstract translation: 在一些实施例中，可互连电路板可以包括以下特征中的一个或多个：（a）位于电路板顶部的第一导电焊盘，（b）导电焊盘上的电镀通孔， 电路板，（c）耦合到电镀通孔的第二导电焊盘; 第二导电焊盘能够电连接到附接到第二可互连电路板的顶部的第三导电焊盘，（d）切割标记，指示用于分离电路板的安全位置，以及（e）与第二导电焊盘相邻的第二切割标记 可以利用第一和第二切割标记之间的区域来进行通过电路板的安全切割的第一切割标记。

公开(公告)号：US09055672B2

公开(公告)日：2015-06-09

申请号：US13725146

申请日：2012-12-21

Applicant: Compagnie Industrielle et Financiere D'Ingenierie “Ingenico”

Inventor： Laurent Mayer ,  Frederic Nguyen ,  Pascal Sulpice ,  Didier Coquelet ,  Franck Robert ,  Caroline Wolff

IPC: H05K1/02 ,  H05K5/02 ,  G06F21/71 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K5/0217 ,  G06F21/71 ,  H05K1/0275 ,  H05K1/11 ,  H05K1/147 ,  H05K2201/09481

Abstract: A device is provided for protecting an electronic printed circuit board. The device includes at least one zone of conductive contact between the printed circuit board and an element for securing the printed circuit board. The device also includes at least one elevating pad for elevating the at least one zone of conductive contact. The element for securing comes into contact with the zone of conductive contact of the printed circuit board by means of a zone of conductive contact of the elevating pad.

Abstract translation: 提供一种用于保护电子印刷电路板的装置。 该装置包括印刷电路板和用于固定印刷电路板的元件之间的导电接触的至少一个区域。 该装置还包括至少一个用于升高至少一个导电接触区域的升降垫。 用于固定的元件借助于升降垫的导电接触区域与印刷电路板的导电接触区域接触。

公开(公告)号：US09012782B2

公开(公告)日：2015-04-21

申请号：US13960287

申请日：2013-08-06

Applicant: Harris Corporation

Inventor： Anders P. Pedersen ,  Daniel A. Robison ,  Alan W. Mast

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/144 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/117 ,  H05K1/142 ,  H05K3/301 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2201/10446

Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.

Abstract translation: 一种制造印刷电路板（PWB）组件的方法。 该方法可以包括形成具有多个第一导电焊盘的第一PWB，形成第二PWB，第二PWB包括在第二PWB的边缘表面上具有暴露端的多个导电迹线，并且用第二PWB的边缘表面覆盖第二PWB的边缘表面 导电层。 该方法还可以包括选择性地去除导电层的部分以限定电连接到导电迹线的相应的暴露端的多个第二导电焊盘，以及将第一和第二PWB组合在一起，使得第一和 第二导电焊盘电耦合在一起以限定PWB组件。

公开(公告)号：US08993892B2

公开(公告)日：2015-03-31

申请号：US13353527

申请日：2012-01-19

Applicant: Toru Yamashita

Inventor： Toru Yamashita

IPC: H05K1/00 ,  B05D5/12 ,  H05K1/11 ,  H05K3/28 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/28 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/09481 ,  H05K2201/0969 ,  H05K2201/099

Abstract: A wiring board includes: a substrate; first connection electrode portions which are disposed on a surface of the substrate and which are to be connected to individual-electrode connection terminals of an actuator via first bumps; first wires having electrical continuity with the first connection electrode portions; a second connecting electrode portion which is disposed on the surface of the substrate and which is to be connected to the a common-electrode connection terminal of the actuator via a second bump; and a second wire having electrical continuity with the second connection electrode portion. The second connecting electrode portion is located in an edge portion of the substrate. The second wire has a conducive-material absent portion that is located between an edge of the substrate and the second connecting electrode portion.

Abstract translation: 布线基板包括：基板; 第一连接电极部，其设置在基板的表面上，并且经由第一凸块与致动器的各个电极连接端子连接; 与第一连接电极部分具有电连续性的第一布线; 第二连接电极部，其设置在所述基板的表面上，并且经由第二凸块与所述致动器的公共电极连接端子连接; 以及与所述第二连接电极部分具有导电性的第二导线。 第二连接电极部位于基板的边缘部。 第二线具有位于基板的边缘和第二连接电极部分之间的导电材料缺失部分。

公开(公告)号：US08982112B2

公开(公告)日：2015-03-17

申请号：US13345842

申请日：2012-01-09

Applicant: Sung Gyu Kim ,  Jae Mo Jung

Inventor： Sung Gyu Kim ,  Jae Mo Jung

IPC: G06F3/038 ,  G09G5/00 ,  G02F1/1345 ,  H05K3/36 ,  H05K1/11 ,  H05K3/32

CPC classification number: G02F1/13452 ,  G02F1/13458 ,  H05K1/11 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09481 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10128

Abstract: Embodiments may be directed to a display panel includes a base substrate including a display region having a plurality of pixels and a non-display region adjacent to the display region, a connecting line in the non-display region and including at least a first input pad, a second input pad, and an output pad, and an insulating layer on the connecting line. The insulating layer includes at least one first contact hole exposing at least a portion of the first input pad, at least one second contact hole exposing at least a portion of the second input pad, and at least one third contact hole between the first contact hole and the second contact hole. A first contact electrode, a second contact electrode, and a dummy contact electrode are disposed at the first, second and third contact holes, respectively.

Abstract translation: 实施例可以涉及一种显示面板，包括：基底基板，包括具有多个像素的显示区域和与显示区域相邻的非显示区域;非显示区域中的连接线，并且至少包括第一输入焊盘 ，第二输入焊盘和输出焊盘，以及连接线上的绝缘层。 绝缘层包括暴露第一输入焊盘的至少一部分的至少一个第一接触孔，暴露第二输入焊盘的至少一部分的至少一个第二接触孔以及第一接触孔之间的至少一个第三接触孔 和第二接触孔。 第一接触电极，第二接触电极和虚拟接触电极分别设置在第一，第二和第三接触孔处。

公开(公告)号：US20150009645A1

公开(公告)日：2015-01-08

申请号：US14308853

申请日：2014-06-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kentaro KANEKO ,  Katsuya FUKASE

IPC: H05K1/11

CPC classification number: H05K3/4682 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106 ,  H05K1/112 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/381 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/2072 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/1184 ,  H05K2203/308

Abstract: A wiring substrate includes an insulating layer that is an outermost layer of the wiring substrate and includes an external exposed surface, a pad forming part formed on a side of the external exposed surface, and a pad that projects from the external exposed surface. The pad forming part includes a recess part recessed from the external exposed surface, and a weir part that projects from the external exposed surface and encompasses the recess part from a plan view. The pad includes a pad body formed within the recess part and the weir part, and an eave part formed on the weir part. The pad body includes an end part that projects to the weir part. The eave part projects in a horizontal direction from the end part of the pad body. The end part of the pad body includes a flat surface.

Abstract translation: 布线基板包括绝缘层，其是布线基板的最外层，并且包括外部暴露表面，形成在外部暴露表面侧的焊盘形成部分以及从外部暴露表面突出的焊盘。 衬垫形成部分包括从外部暴露表面凹陷的凹陷部分和从外部暴露表面突出并从俯视图包围凹部的堰部分。 衬垫包括形成在凹部和堰部内的垫体，以及形成在堰部上的檐部。 垫体包括突出到堰部分的端部。 檐部从垫体的端部沿水平方向突出。 垫体的端部包括平坦表面。

公开(公告)号：US08890408B2

公开(公告)日：2014-11-18

申请号：US13745409

申请日：2013-01-18

Applicant: Nokia Corporation

Inventor： Esa-Sakari Maatta

IPC: H01L51/50 ,  H01L51/52 ,  H05K3/32 ,  H05K1/11 ,  H01L23/31 ,  H05B33/02 ,  G02F1/1333

CPC classification number: H05K1/118 ,  G02F1/13452 ,  G02F1/13458 ,  G02F2001/133388 ,  H01L23/3121 ,  H01L23/3128 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/50 ,  H01L2924/0002 ,  H05B33/02 ,  H05K1/028 ,  H05K1/117 ,  H05K1/147 ,  H05K3/32 ,  H05K2201/055 ,  H05K2201/09481 ,  H05K2201/10128 ,  Y10T29/49128 ,  H01L2924/00

Abstract: In accordance with an example embodiment of the present invention, an apparatus includes a substrate having a plurality of conductive traces terminating at a peripheral edge of the substrate. An active display portion is disposed on an upper surface of the substrate and electrically coupled to the conductive traces of the substrate. The peripheral edge of the substrate includes a protruding region that extends beyond a peripheral edge of the active display portion. A plurality of conductive bonding pads are affixed at the protruding region and coupled to the plurality of the conductive traces. A flexible circuit includes a plurality of conductors electrically coupled to the plurality of bonding pads at locations on or below a lower surface of the substrate.

Abstract translation: 根据本发明的示例性实施例，一种设备包括具有终止于基板的周缘的多个导电迹线的基板。 主动显示部分设置在基板的上表面上并电耦合到基板的导电迹线。 衬底的周缘包括延伸超过有源显示部分的周缘的突出区域。 多个导电接合焊盘固定在突起区域并耦合到多个导电迹线。 柔性电路包括在衬底的下表面上或下面的位置处电耦合到多个接合焊盘的多个导体。

公开(公告)号：US20140203703A1

公开(公告)日：2014-07-24

申请号：US13745409

申请日：2013-01-18

Applicant: NOKIA CORPORATION

Inventor： Esa-Sakari Maatta

IPC: H05K1/11 ,  H05K3/32 ,  H05B33/02

CPC classification number: H05K1/118 ,  G02F1/13452 ,  G02F1/13458 ,  G02F2001/133388 ,  H01L23/3121 ,  H01L23/3128 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/50 ,  H01L2924/0002 ,  H05B33/02 ,  H05K1/028 ,  H05K1/117 ,  H05K1/147 ,  H05K3/32 ,  H05K2201/055 ,  H05K2201/09481 ,  H05K2201/10128 ,  Y10T29/49128 ,  H01L2924/00

Abstract: In accordance with an example embodiment of the present invention, an apparatus includes a substrate having a plurality of conductive traces terminating at a peripheral edge of the substrate. An active display portion is disposed on an upper surface of the substrate and electrically coupled to the conductive traces of the substrate. The peripheral edge of the substrate includes a protruding region that extends beyond a peripheral edge of the active display portion. A plurality of conductive bonding pads are affixed at the protruding region and coupled to the plurality of the conductive traces. A flexible circuit includes a plurality of conductors electrically coupled to the plurality of bonding pads at locations on or below a lower surface of the substrate.

Abstract translation: 根据本发明的示例性实施例，一种设备包括具有终止于基板的周缘的多个导电迹线的基板。 主动显示部分设置在基板的上表面上并电耦合到基板的导电迹线。 衬底的周缘包括延伸超过有源显示部分的周缘的突出区域。 多个导电接合焊盘固定在突起区域并耦合到多个导电迹线。 柔性电路包括在衬底的下表面上或下面的位置处电耦合到多个接合焊盘的多个导体。