公开(公告)号：US5661267A

公开(公告)日：1997-08-26

申请号：US404530

申请日：1995-03-15

Applicant: Harlan R. Isaak

Inventor： Harlan R. Isaak

IPC: H01L25/065 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/0094 ,  H01L25/0655 ,  H05K1/113 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2203/121 ,  H05K3/4053 ,  Y10S29/022 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: An alignment board for interfacing arrays of infrared detectors to a multi-layer module concerns an insulating board having a multiplicity of conductive vias with insulating sealing plugs and enlarged metallic pads that are attached to the ends of the vias. Preferably, an insulating layer is formed on opposing sides of the board. Openings are delineated in the layer coinciding with the metallic pads, and preferably solder contacts are deposited in the openings. A multi-layer module may be attached to one side of the alignment board using reflow solder processes. Then, arrays of infrared detectors may be attached to the opposing side of the alignment board using a lower-temperature reflow soldering process. The alignment board facilitates the interfacing and assembly of the focal plane of infrared detection systems.

Abstract translation: 用于将红外检测器阵列连接到多层模块的对准板涉及具有多个导电通孔的绝缘板，绝缘板具有连接到通孔端部的绝缘密封塞和扩大的金属垫。 优选地，在所述板的相对侧上形成绝缘层。 在与金属垫重合的层中描绘开口，并且优选地在开口中沉积焊接触点。 可以使用回流焊接工艺将多层模块附接到对准板的一侧。 然后，使用低温回流焊接工艺将红外检测器阵列附接到对准板的相对侧。 对准板有助于红外检测系统的焦平面的接口和组装。

公开(公告)号：US5646826A

公开(公告)日：1997-07-08

申请号：US601671

申请日：1996-02-15

Applicant: Roman Katchmar

Inventor： Roman Katchmar

IPC: H01L23/40 ,  H01L23/433 ,  H05K1/02 ,  H05K3/40 ,  H05K7/20

CPC classification number: H01L23/433 ,  H01L23/4006 ,  H05K7/20463 ,  H05K7/20509 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/0209 ,  H05K2201/066 ,  H05K2201/0949 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K3/4069

Abstract: Making a heat sink and printed circuit board assembly by providing a heat exchange element on the heat sink which lies in heat exchange contact with the heat sink and passes therethrough. After locating the board and heat sink in relative positions apart and with the heat exchange element aligned with an electronic component on the board, a settable thermally conductive compound is injected through a hole in the heat exchange element to bond it to the electrical component. The heat sink is detachable from the heat exchange element to expose the side of the board carrying the components so that maintenance or repair may be performed. Subsequently the heat sink is returned into its position in the assembly.

Abstract translation: 通过在散热器上提供热交换元件与散热器进行热交换接触并通过其中来制造散热器和印刷电路板组件。 在将板和散热器相对位置定位并且热交换元件与板上的电子部件对准之后，通过热交换元件中的孔将可固化的导热化合物注入到电组件中。 散热器可从热交换元件拆卸以暴露出承载部件的板的侧面，从而可进行维护或修理。 随后，散热器返回到组件中的位置。

公开(公告)号：US5415555A

公开(公告)日：1995-05-16

申请号：US200037

申请日：1994-02-22

Applicant: Mohi Sobhani

Inventor： Mohi Sobhani

IPC: H01R12/71 ,  H01R43/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09

CPC classification number: H05K3/4007 ,  H01R12/714 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/0959 ,  H05K2201/09745 ,  H05K2203/167 ,  H05K3/0094 ,  Y10T29/49155

Abstract: A pair of electrical circuits (20, 22), which may be both flexible or one flexible and one rigid, are interconnected by projections, such as bumps (24) and rings (26) . The projections are formed from substantially inelastic dielectric material, such as an epoxy defining bumps (34) and rings (36), which are plated with copper (38). Projections (24, 26) of one circuit are disposed to interconnect with mating projections on the other circuit, the interconnection being bump to bump, bump to ring, or bump to pad. The projections may be formed on a copper-clad substrate (42) or on plated-through holes (72) on a printed wiring board (70). Alternately, polygonal pads (94) on a circuit (90) may be joined to a projection. Further, a plurality of bump projections (106), electrically connected to the same or different circuits, may collectively interconnect with a single oval ring projection (108).

Abstract translation: 可以是柔性的或一个柔性的，一个刚性的一对电路（20,22）通过诸如凸块（24）和环（26）的突起互连。 突起由基本上非弹性的电介质材料形成，例如镀有铜（38）的环氧树脂定义凸块（34）和环（36）。 一个电路的投影（24,26）被布置成与另一个电路上的配合突起相互连接，互连件碰撞，碰撞到环或撞击到焊盘。 突起可以形成在覆铜基板（42）上或印刷电路板（70）上的电镀通孔（72）上。 或者，电路（90）上的多边形焊盘（94）可以连接到突起。 此外，电连接到相同或不同电路的多个凸起突起（106）可以与单个椭圆形环形突起（108）共同互连。

公开(公告)号：US5229550A

公开(公告)日：1993-07-20

申请号：US847122

申请日：1992-03-31

Applicant: Perminder S. Bindra ,  Dennis A. Canfield ,  Voya Rista Markovich ,  Jeffrey McKeveny ,  Robert E. Ruane ,  Edwin L. Thomas

Inventor： Perminder S. Bindra ,  Dennis A. Canfield ,  Voya Rista Markovich ,  Jeffrey McKeveny ,  Robert E. Ruane ,  Edwin L. Thomas

IPC: H05K3/00 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/445 ,  H05K1/0272 ,  H05K2201/0305 ,  H05K2201/0373 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/054 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/36 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4076 ,  H05K3/423 ,  H05K3/428

Abstract: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

Abstract translation: 公开了一种用于制造高密度电路板的结构和方法。 在电路化电源核心上使用光敏或其他电介质材料，通孔和焊盘被打开，填充有接合金属并与下一级对齐，从而消除了建立高密度复合材料的主要配准问题，并减少了 制造工艺。

公开(公告)号：US5055637A

公开(公告)日：1991-10-08

申请号：US434427

申请日：1989-11-13

Applicant: George R. Hagner

Inventor： George R. Hagner

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/08 ,  H05K3/10 ,  H05K3/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K3/20 ,  H05K1/111 ,  H05K1/183 ,  H05K3/08 ,  H05K3/107 ,  H05K3/3473 ,  H05K2201/0129 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/0959 ,  H05K2201/09845 ,  H05K2201/09981 ,  H05K2201/10636 ,  H05K2201/10681 ,  H05K2203/0117 ,  H05K2203/0278 ,  H05K2203/042 ,  H05K2203/0726 ,  H05K2203/0769 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/184 ,  H05K3/244 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/426 ,  Y02P70/611

Abstract: Circuit boards with imbedded traces, which may form grooves or trenches are provided. The traces may be at least partially filled with a reflowable conductive material such as solder. The grooves may be selectively furnished with solder while other regions may be empty or void of solder. In assembling electronic components, with or without extended leads, such as surface mount integrated circuits or chips, to the solder core circuit boards, the leads may be placed within the regions of the grooves without solder (contact regions) and then the circuit board may be heated selectively or as a whole to reflow the solder to the bonding or contacting regions to bond the traces to the leads upon cooling. Circuit boards having surface mount devices on both sides may be formed in this manner. Further, tape automated bonded or TAB mounted devices may be directly placed into and bonded to the traces or solder core circuit boards with minimum exposure of the excised TAB leads prior to assembly. In one form, the grooves are plated with copper before they are filled with solder. Alternatively, the solder may be present only in cavities or pockets next to the contact regions where the component lead will connect with the conductive material pattern.

Abstract translation: 提供具有嵌入痕迹的电路板，其可以形成凹槽或沟槽。 迹线可以至少部分地填充有可回流的导电材料，例如焊料。 凹槽可以选择性地装备有焊料，而其它区域可能是空的或者没有焊料。 在组装电子部件的情况下，将带有或不具有延伸引线（例如表面贴装集成电路或芯片）的电子部件组装到焊料芯电路板上，可以将引线放置在槽的区域内而不用焊料（接触区域），然后电路板可以 被选择性地或作为整体加热以将焊料回流到接合或接触区域，以在冷却时将迹线结合到引线。 可以以这种方式形成具有两侧表面安装装置的电路板。 此外，胶带自动粘合或TAB安装的装置可以在组装之前以最小的切割的TAB导线的暴露直接放置到轨迹或焊芯电路板中并结合到轨迹或焊芯电路板。 在一种形式中，在填充有焊料之前，将槽镀铜。 或者，焊料可以仅存在于部件引线将与导电材料图案连接的接触区域旁边的腔或袋中。

公开(公告)号：US5047262A

公开(公告)日：1991-09-10

申请号：US568072

申请日：1990-08-16

Applicant: John H. deVries ,  Walter K. McCall

Inventor： John H. deVries ,  Walter K. McCall

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/24 ,  H05K3/28

CPC classification number: H05K3/0091 ,  H05K3/243 ,  H05K1/117 ,  H05K2201/0959 ,  H05K2203/0126 ,  H05K2203/0723 ,  H05K2203/1509 ,  H05K3/0094 ,  H05K3/28

Abstract: A printed circuit panel is selectively coated to protect circuits which may be exposed to deleterious chemicals during the electroplating of connector tabs. The apparatus has a mechanism for gripping and transporting the circuit panels through multiple stations including cleaning, drying, coating and curing in a vertical position at variable speeds. The coating station has multiple wipers movable in a vertical plane to apply a polymer to the circuit panel at a controlled volume on various levels. The wipers each have a leading edge in contact with the panel surface to be coated and an adjustable back edge spaced apart from the panel surface to be coated with the polymer flowing to the panel between the two edges.

Abstract translation: 印刷电路板被选择性地涂覆以保护在连接器突片的电镀期间可能暴露于有害化学物质的电路。 该设备具有用于通过多个站夹持和传送电路板的机构，包括在可变速度下的垂直位置的清洁，干燥，涂覆和固化。 涂布站具有可在垂直平面中移动的多个刮水器，以各种水平的受控体积将聚合物施加到电路板。 刮水器各自具有与待涂覆的面板表面接触的前缘和与面板表面间隔开的可调节的后边缘，以涂覆在两边缘之间流向面板的聚合物。

公开(公告)号：US4911796A

公开(公告)日：1990-03-27

申请号：US172199

申请日：1988-03-23

Applicant: Ronald G. Reed

Inventor： Ronald G. Reed

IPC: H05K3/00 ,  H05K3/06 ,  H05K3/42

CPC classification number: H05K3/0008 ,  H05K3/061 ,  H05K2201/0355 ,  H05K2201/0959 ,  H05K2201/09981 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/0763 ,  H05K2203/082 ,  H05K3/0047 ,  H05K3/424 ,  H05K3/427

Abstract: A process of forming plates through-holes in a printed circuit board involves placing a film of fluid ink having electrically conductive properties on a side wall of the hole, curing the film to a solid and electroplating a layer of metal on the conductive ink film. The conductive ink preferably is a composition including conductive particles such as carbon and silver flakes. The ink also preferably includes a thermosetting or radiation curable binder and a thinner. The film of ink is cured before the layer of metal is electroplated thereon. The plated through-hole is protected from the etchant when the conductors are etched by placing a radiation curable putty material into the hole, curing it, and then depositing a layer of resist on top of the cured putty and a conductive sheet clad to the substrate of the circuit board.

Abstract translation: 在印刷电路板中形成板通孔的工艺包括将具有导电性能的流体油墨膜放置在孔的侧壁上，将该膜固化并在导电油墨膜上电镀一层金属。 导电油墨优选是包含导电颗粒如碳和银薄片的组合物。 油墨还优选包含热固性或可辐射固化的粘合剂和稀释剂。 在金属层电镀之前，油墨膜被固化。 当通过将放射线可固化的油灰材料放入孔中进行蚀刻，使其固化，然后在固化的油灰的顶部上沉积抗蚀剂层，并将覆盖在基底上的导电片 的电路板。

公开(公告)号：US4685210A

公开(公告)日：1987-08-11

申请号：US719560

申请日：1985-03-13

Applicant: Michael M. King ,  Helen J. Walter

Inventor： Michael M. King ,  Helen J. Walter

IPC: H01Q1/38 ,  H05K1/02 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K3/462 ,  H01Q1/38 ,  H05K3/368 ,  H05K1/0237 ,  H05K1/0272 ,  H05K2201/015 ,  H05K2201/0379 ,  H05K2201/0715 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0278 ,  H05K3/0094 ,  H05K3/328 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: An electrically and mechanically sound conductive bond between layers of a multi-layer plated through hole circuit board is produced by depositing a layer of noble metal over the surfaces to be joined, juxtaposing the noble metal coated layers and subjecting them to a combination of pressure and heat for a sufficient period of time. Excellent results have been obtained in a multi-layer circuit board for a microstrip microwave antenna with 0.002 inch thick polished silver layers at bonding pressures of 490 to 575 psi and temperatures of 560 to 580 degrees F. for time periods of 20 to 30 minutes.

Abstract translation: 在多层电镀通孔电路板的层之间通过在待接合的表面上沉积贵金属层而制成电气和机械上的导电结合，并且并列贵金属涂覆层并使它们与压力和 加热一段足够的时间。 在具有0.002英寸厚的抛光银层的微带天线的多层电路板中，在490至575psi的接合压力和560至580华氏度的温度为20至30分钟的时间段内已经获得了优异的结果。

公开(公告)号：US4634039A

公开(公告)日：1987-01-06

申请号：US662916

申请日：1984-10-19

Applicant: Hari N. Banerjee

Inventor： Hari N. Banerjee

IPC: B23K35/22 ,  H05K3/00 ,  H05K3/34 ,  B23K1/20 ,  B23K31/02

CPC classification number: B23K35/224 ,  H05K3/0094 ,  H05K2201/0209 ,  H05K2201/0959 ,  H05K2203/0591 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K3/0076 ,  H05K3/3452

Abstract: A solder resist paste having the feature that it is relatively easily removed is disclosed. The paste is comprised of a liquid polyglycol (e.g. Pluronic 25R2 by BASF) and either Kaoline or talc powder. In operation, the paste is selectively applied to holes in the PCB which it is desired to keep open during a soldering process. The paste is then washed out of the holes, additional components mounted via those holes, and soldered into place.

Abstract translation: 公开了具有相对容易去除的特征的阻焊膏。 糊状物由液体聚乙二醇（例如BASF的Pluronic 25R2）和Kaoline或滑石粉组成。 在操作中，膏被选择性地施加到PCB中的希望在焊接过程中保持打开的孔中。 然后将膏从孔中冲洗出来，通过这些孔安装附加部件，并将其焊接到位。

公开(公告)号：US4529477A

公开(公告)日：1985-07-16

申请号：US490344

申请日：1983-05-02

Applicant: Werner Lundberg ,  Helmut Winzer

Inventor： Werner Lundberg ,  Helmut Winzer

IPC: H05K3/00 ,  H05K3/06 ,  H05K3/12 ,  H05K3/42

CPC classification number: H05K3/0094 ,  H05K2201/0959 ,  H05K3/061 ,  H05K3/1216 ,  H05K3/427

Abstract: The process and device in accordance with the present invention allow the simple and economic manufacture of printed circuit boards, wherein the metal of the conductors as well as the one covering the hole walls is identical with the metal being etched away from the areas between the conductors.According to this process, a one-or two-sided metal-coated base material is used which, upon production of the hole pattern, is provided in a known manner with a metal layer of desired thickness, covering the surface of the metal foil as well as the hole walls. Subsequently, a masking layer is applied by screen printing a positive image of the desired circuit pattern on the surface(s). In the following process step, the holes are filled with an ink by means of a screen printing stencil. In accordance with one embodiment of the invention, the ink used forms an etch-resistant surface film when drying. Upon etching, the masking layer as well as the surface film and the hole fillings are removed with a suitable solvent.The screen printing stencil comprises a carrier screen fixed to a frame, said carrier screen being provided on its side facing the surface to be printed with a metal or plastic foil, said screen and foil being provided with holes at locations in proportion to the hole pattern in the base material.

Abstract translation: 根据本发明的方法和装置允许简单和经济地制造印刷电路板，其中导体的金属以及覆盖孔壁的金属与金属被蚀刻远离导体之间的区域相同 。 根据该方法，使用单面或双面金属涂覆的基材，其在生产孔图案时以已知方式用所需厚度的金属层提供，将金属箔的表面覆盖为 和孔壁一样。 随后，通过在表面上丝网印刷所需电路图案的正像来施加掩模层。 在下面的工艺步骤中，通过丝网印刷模板填充墨水。 根据本发明的一个实施方案，当干燥时，使用的油墨形成耐蚀刻表面膜。 蚀刻后，用合适的溶剂去除掩模层以及表面膜和孔填充物。 丝网印刷模版包括固定到框架的载体屏幕，所述载体屏幕在其面向待印刷的表面的一侧设置有金属或塑料箔，所述屏幕和箔在与孔图案成比例的位置处设置有孔 在基材中。