公开(公告)号：US20130033825A1

公开(公告)日：2013-02-07

申请号：US13527305

申请日：2012-06-19

Applicant: Andrew Simon Hall Brooks ,  Timothy Allan Von Werne

Inventor： Andrew Simon Hall Brooks ,  Timothy Allan Von Werne

IPC: H05K1/00 ,  H05K3/22

CPC classification number: H05K3/284 ,  H05K2201/015 ,  H05K2201/09872 ,  H05K2201/10121 ,  H05K2203/095

Abstract: An electrical or electro-optical assembly comprising a substrate comprising an insulating material, at least one conductive track present on at least one surface of the substrate, at least one electrical or electro-optical component connected to at least one of the at least one conductive track, and a continuous coating comprising one or more plasma-polymerized polymers completely covering the at least one surface of the substrate, the at least one conductive track and the at least one electrical or electro-optical component.

Abstract translation: 一种电气或电光学组件，包括包括绝缘材料的衬底，存在于衬底的至少一个表面上的至少一个导电轨道，至少一个电或电光学部件，其连接到至少一个导电 轨道和连续涂层，其包含完全覆盖基底的至少一个表面，所述至少一个导电轨道和至少一个电或电光部件的一个或多个等离子体聚合的聚合物。

公开(公告)号：US20130021131A1

公开(公告)日：2013-01-24

申请号：US13185583

申请日：2011-07-19

Applicant: KEVIN J. FITZPATRICK ,  RYAN K. ROTH

Inventor： KEVIN J. FITZPATRICK ,  RYAN K. ROTH

IPC: H01H85/04

CPC classification number: H05K1/0256 ,  A47L15/46 ,  H01H85/04 ,  H01H85/463 ,  H01R12/7088 ,  H05K1/0263 ,  H05K2201/012 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09872 ,  H05K2201/10181 ,  H05K2201/10189

Abstract: A printed circuit board to which corresponding wiring connectors such as power wiring connectors, may be connected to couple electrical components and a power supply to the printed circuit board and a control housing, which may be used for operably storing such a printed circuit board.

Abstract translation: 可以将诸如电力布线连接器的相应布线连接器连接到其上的印刷电路板，以将电气部件和电源耦合到印刷电路板和控制壳体，其可用于可操作地存储这种印刷电路板。

公开(公告)号：US20120308762A1

公开(公告)日：2012-12-06

申请号：US13574626

申请日：2011-01-21

Applicant: Filip Legein ,  Anthony Vanlandeghem ,  Peter Martens

Inventor： Filip Legein ,  Anthony Vanlandeghem ,  Peter Martens

IPC: C23C16/50 ,  B32B3/02 ,  C23C16/30

CPC classification number: H05K3/284 ,  B05D1/62 ,  B05D3/0493 ,  B05D3/142 ,  B05D5/083 ,  B05D2506/10 ,  H01J37/32541 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K3/282 ,  H05K2201/015 ,  H05K2201/09872 ,  H05K2203/095 ,  Y10T428/239 ,  H01L2924/00

Abstract: The invention relates to a conformal nanocoating applied by a low pressure plasma process. The invention also relates to a method for making such a conformal nanocoating on a three-dimensional nanostructure, in particular a three-dimensional structure containing electrically conductive and non-conductive elements.

Abstract translation: 本发明涉及通过低压等离子体工艺应用的共形纳米涂层。 本发明还涉及一种用于在三维纳米结构上制造这种共形纳米涂层的方法，特别是包含导电和非导电元件的三维结构。

公开(公告)号：US08071160B2

公开(公告)日：2011-12-06

申请号：US12115874

申请日：2008-05-06

Applicant: Jeffrey D. Chinn ,  Robert W. Ashurst ,  Adam N. Anderson

Inventor： Jeffrey D. Chinn ,  Robert W. Ashurst ,  Adam N. Anderson

IPC: B05D5/12 ,  H05K3/00 ,  C23C16/00

CPC classification number: H05K3/284 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09872 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24388 ,  Y10T428/24405 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/269 ,  Y10T428/2839 ,  H01L2924/00

Abstract: A method of forming a film is provided. Nanoparticles are deposited on a surface of a substrate using a liquid deposition process. The nanoparticles are linked to each other and to the surface using linker molecules. A coating having a surface energy of less than 70 dyne/cm is deposited over the film to form a coated film. The coated film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than 70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.

Abstract translation: 提供了一种形成膜的方法。 使用液体沉积工艺将纳米颗粒沉积在基底的表面上。 使用接头分子将纳米颗粒彼此连接并连接到表面。 表面能小于70达因/厘米的涂层沉积在膜上以形成涂膜。 涂膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。

公开(公告)号：US20110085316A1

公开(公告)日：2011-04-14

申请号：US12777775

申请日：2010-05-11

Applicant: Scott Myers ,  Douglas Weber

Inventor： Scott Myers ,  Douglas Weber

IPC: H05K9/00 ,  H05K3/30

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K9/0024 ,  H05K2201/09872 ,  H05K2203/1311 ,  Y10T29/49146

Abstract: This is directed to an EMI shield constructed from a conformal coating. A circuit board can include electronic components for which EMI shielding is required. To provide such shielding in a space-efficient manner, a first non-conductive conformal coating can be placed over the circuit board and the electronic components. A second conductive conformal coating can then be placed over the first such that at least portions of the second coating around the periphery of the electronic components are electrically coupled to the circuit board.

Abstract translation: 这是针对由保形涂层构成的EMI屏蔽。 电路板可以包括需要EMI屏蔽的电子部件。 为了以空间有效的方式提供这种屏蔽，可以在电路板和电子部件上放置第一非导电保形涂层。 然后可以将第二导电保形涂层放置在第一导电保形涂层上，使得围绕电子部件的周边的第二涂层的至少一部分电耦合到电路板。

公开(公告)号：US20110039050A1

公开(公告)日：2011-02-17

申请号：US12854298

申请日：2010-08-11

Applicant: Andreas Hogg ,  Herbert Keppner ,  Thierry Aellen ,  Juergen Burger

Inventor： Andreas Hogg ,  Herbert Keppner ,  Thierry Aellen ,  Juergen Burger

IPC: B32B3/00 ,  B05D3/00

CPC classification number: A61N1/375 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/09872 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

Abstract: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied by vapour deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets, each set having first, second and third layers. At least one of the first, second and third layers consist essentially of a polymer such as parylene and at least one of the other two layers of the set consist essentially of inorganic material such that each layer differs in at least one diffusion barrier property from the other layers in the set and adds to an overall barrier effect of the coating.

Abstract translation: 一种可植入医疗装置，其包括在基底上的多个部件，以及通过气相沉积施加的生物相容性多层涂层以符合和密封地覆盖部件和/或基底的至少一部分。 涂层涂覆至少两组，每组具有第一层，第二层和第三层。 第一层，第二层和第三层中的至少一层基本上由聚合物如聚对二甲苯组成，并且该组的另外两层中的至少一层基本上由无机材料组成，使得每个层在至少一个扩散阻挡性质与 该组中的其它层并且增加了涂层的整体屏障效应。

公开(公告)号：US20100006988A1

公开(公告)日：2010-01-14

申请号：US12169964

申请日：2008-07-09

Applicant: Jinbang Tang ,  Darrel R. Frear ,  Scott M. Hayes ,  Douglas G. Mitchell

Inventor： Jinbang Tang ,  Darrel R. Frear ,  Scott M. Hayes ,  Douglas G. Mitchell

IPC: H01L23/552 ,  H05K3/10

CPC classification number: H05K1/185 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/05 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2203/0152 ,  H05K2203/1322 ,  H05K2203/1469 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/53548 ,  H01L2224/82 ,  H01L2924/00

Abstract: An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (1) using a double side adhesive tape (2), and then sequentially depositing an insulating layer (15) and a conductive shielding layer (16) before encapsulating the modules with a molding compound (17). After removing the adhesive tape (2) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (100) is formed over the exposed surface, where the circuit substrate includes shielding via structures (101-112) that are aligned with and electrically connected to the conductive shielding layer (16), thereby encircling and shielding the circuit module(s).

Abstract translation: 通过使用双面胶带（2）将多个模块（30-33）附接到处理载体（1）上而在多个封装模块上形成集成的保形电磁干扰（EMI）和/或电磁辐射屏蔽， 然后在用模塑料（17）封装模块之前依次沉积绝缘层（15）和导电屏蔽层（16）。 在去除粘合带（2）以暴露封装的模块的表面之后，在暴露的表面上形成多层电路基板（100），其中电路基板包括屏蔽通孔结构（101-112） 并且电连接到导电屏蔽层（16），从而环绕和屏蔽电路模块。

公开(公告)号：US20100002401A1

公开(公告)日：2010-01-07

申请号：US12496017

申请日：2009-07-01

Applicant: Hideyuki TSUJIMURA ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Hiroe KOWADA ,  Koso MATSUNO

Inventor： Hideyuki TSUJIMURA ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Hiroe KOWADA ,  Koso MATSUNO

IPC: H05K1/00 ,  H05K3/30

CPC classification number: H05K3/288 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0783 ,  H05K2203/1322 ,  Y10T29/49146 ,  H01L2224/0401

Abstract: The electronic component packaging structure having, as the moisture-proof coating layer, a polymer material that has sufficient moisture-proof performance and can be relatively easily peeled off from a circuit board and/or electronic components when repairing can be provided.The electronic component packaging structure of the invention comprises a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or volubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.

Abstract translation: 作为防湿涂层的电子部件包装结构体可以提供具有充分的防潮性能并且在修理时可以相对容易地从电路板和/或电子部件剥离的聚合物材料。 本发明的电子部件封装结构包括电路板，安装在电路板上的电子部件和覆盖电子部件的防湿涂层。 防潮涂层由具有至少两层下层和上层的聚合物材料涂层构成，并且形成下层的聚合物材料对于所选择的修补溶剂具有较高的溶胀性和/或挥发性 与烃类溶剂相比，形成上层的聚合物材料。

公开(公告)号：US20090202709A1

公开(公告)日：2009-08-13

申请号：US12426572

申请日：2009-04-20

Applicant: Michael Szuch

Inventor： Michael Szuch

IPC: H05K3/28

CPC classification number: H05K3/0091 ,  B05B12/00 ,  B05B12/02 ,  B05B12/06 ,  B05C11/1015 ,  H05K2201/09872 ,  H05K2203/0126

Abstract: A coating system with an applicator that has an air cylinder with a needle valve. A control has a timer that provides a string of electrical pulses to a solenoid. With each pulse, the solenoid applies pressurized air to a cylinder piston, thereby opening the needle valve and permitting coating material to flow past the needle valve. The needle valve is closed for durations of time between pulses, and the coating material is ejected from a dispensing needle in response to closings of the needle valve.

Abstract translation: 具有涂布器的涂布系统，其具有带针阀的气缸。 一个控制器有一个定时器，它向螺线管提供一串电脉冲。 对于每个脉冲，螺线管将加压空气施加到气缸活塞，从而打开针阀并允许涂覆材料流过针阀。 针阀关闭脉冲之间的持续时间，并且响应于针阀的关闭，涂覆材料从分配针喷射。

公开(公告)号：US20090110884A1

公开(公告)日：2009-04-30

申请号：US12115875

申请日：2008-05-06

Applicant: Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

Inventor： Jeff Chinn ,  W. Robert Ashurst ,  Adam Anderson

IPC: B32B27/00 ,  B32B3/10 ,  B32B5/16 ,  H05K1/00 ,  B32B15/02 ,  B32B9/00

CPC classification number: H05K3/284 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/09872 ,  Y10T428/24355 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24388 ,  Y10T428/24405 ,  Y10T428/24413 ,  Y10T428/24421 ,  Y10T428/269 ,  Y10T428/2839 ,  H01L2924/00

Abstract: A composite is provided, comprising a substrate and a film on the substrate. The film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than 70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on the particular environment in which the film is to be used, a durability of 10 to 500 microNewtons may be preferred. A film thickness 3 to 100 times the RMS surface roughness of the film is preferred.

Abstract translation: 提供了一种复合材料，其包括基底和基底上的薄膜。 膜的RMS表面粗糙度为25nm至500nm，膜覆盖率为25％至60％，表面能小于70达因/厘米; 耐久性为10至5000微瓦。 根据使用薄膜的具体环境，可以优选10至500微瓦的耐久性。 膜的厚度为膜的RMS表面粗糙度的3〜100倍是优选的。