公开(公告)号：US09611985B2

公开(公告)日：2017-04-04

申请号：US14118885

申请日：2012-03-22

Applicant: Toshio Hata ,  Makoto Agatani ,  Toyonori Uemura ,  Shinya Ishizaki ,  Hitoshi Matsushita

Inventor： Toshio Hata ,  Makoto Agatani ,  Toyonori Uemura ,  Shinya Ishizaki ,  Hitoshi Matsushita

IPC: F21K99/00 ,  F21V23/00 ,  H05K1/02 ,  H05K1/11 ,  H01L25/075 ,  H01L33/50 ,  F21V3/00 ,  H05K3/28 ,  F21Y101/00 ,  F21K9/232

CPC classification number: F21V3/02 ,  F21K9/232 ,  F21K9/235 ,  F21K9/237 ,  F21K9/60 ,  F21K9/64 ,  F21K9/68 ,  F21V3/00 ,  F21V23/001 ,  F21V29/77 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/508 ,  H01L2224/48137 ,  H01L2924/3025 ,  H05B33/0845 ,  H05B33/0857 ,  H05B37/0272 ,  H05K1/0274 ,  H05K1/11 ,  H05K3/28 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00

Abstract: The light-emitting device (100) includes a substrate (101) and a plurality of light-emitting sections. A first light-emitting section is made up of LED chips (102) and a first fluorescent-substance-containing resin layer (107), and a second light-emitting section is made up of LED chips (102) and a second fluorescent-substance-containing resin layer (108). The first fluorescent-substance-containing resin layer (107) and the second fluorescent-substance-containing resin layer (108) are provided in a plurality of locations such that the fluorescent-substance-containing resin layers for the different light-emitting sections are adjacently arranged.

公开(公告)号：US09549466B2

公开(公告)日：2017-01-17

申请号：US14977658

申请日：2015-12-22

Applicant: Wistron Corporation

Inventor： Jui-Yun Fan ,  Hui-Lin Lu ,  Howard Huang ,  Zheng-Wei Wu

IPC: H05K1/00 ,  H05K1/11 ,  H01K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/34

CPC classification number: H05K1/0298 ,  H05K1/115 ,  H05K3/0073 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3484 ,  H05K3/4664 ,  H05K2201/09909 ,  H05K2203/04 ,  H05K2203/0588 ,  Y10T29/49165

Abstract: A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask.

Abstract translation: 电路板包括电路板板，导电环，焊接掩模和至少一个绝缘垫。 电路板板包括表面和穿过表面的导电通孔和电路板板，其中导电通孔具有布置在其壁上的导电层。 表面上的导电环围绕表面上的导电通孔的开口并与导电层电连接。 焊接掩模设置在表面上。 导电环暴露在焊料掩模的外部。 绝缘垫具有厚度。 绝缘垫的第一表面适于接触焊料掩模或表面并位于导电环的周边。 绝缘垫的第二表面适于间隔焊料涂覆工具和焊接掩模之间的距离。

公开(公告)号：US09532447B2

公开(公告)日：2016-12-27

申请号：US14754796

申请日：2015-06-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroyuki Ohata

IPC: C08J3/28 ,  H05K1/03 ,  C09K19/38 ,  H05K3/46 ,  B32B37/06 ,  B32B37/10 ,  B32B37/04 ,  B32B38/00

CPC classification number: H05K1/0353 ,  B32B37/04 ,  B32B37/06 ,  B32B37/10 ,  B32B38/145 ,  B32B2305/55 ,  B32B2457/202 ,  C08J3/28 ,  C08J2300/00 ,  C08J2367/00 ,  C09K19/38 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/09881 ,  H05K2201/09909

Abstract: A multi-layer resin substrate is a multi-layer resin substrate integrated by stacking and thermocompression bonding a plurality of resin layers each composed of a thermoplastic resin as a main material and having a main surface. The plurality of resin layers include a resin layer having a pattern member arranged on the main surface. A surface of at least some resin layers of the plurality of resin layers has a paint layer, which is obtained by applying a thermoplastic resin paint to a region corresponding to a region insufficient in thickness as a stack as a whole during a process for stacking and thermocompression bonding the plurality of resin layers. The pattern member is provided, for example, by a conductor pattern.

Abstract translation: 多层树脂基板是通过以热塑性树脂作为主要材料并且具有主表面的多个树脂层堆叠并热压接合而形成的多层树脂基板。 多个树脂层包括具有布置在主表面上的图案构件的树脂层。 多个树脂层的至少一些树脂层的表面具有涂料层，其通过在堆叠过程中将热塑性树脂涂料作为整体施加热塑性树脂涂料作为整体的厚度不足的区域， 热压接合多个树脂层。 图案构件例如由导体图案提供。

公开(公告)号：US20160278210A1

公开(公告)日：2016-09-22

申请号：US15070120

申请日：2016-03-15

Applicant: Japan Display Inc.

Inventor： Kazuto TSURUOKA ,  Norio OKU ,  Takuya NAKAGAWA

IPC: H05K1/14

CPC classification number: H05K1/144 ,  H05K1/0353 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/147 ,  H05K3/007 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/042 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/016 ,  H05K2203/0554 ,  H05K2203/107

Abstract: A display device includes a flexible insulating substrate, an insulating layer on the insulating substrate, and a plurality of terminals made of a conductive material on the insulating layer. The insulating layer is disposed outside the area located between the terminals. The insulating substrate has a groove between the terminals.

Abstract translation: 显示装置包括柔性绝缘基板，绝缘基板上的绝缘层，以及在绝缘层上由导电材料制成的多个端子。 绝缘层设置在位于端子之间的区域的外侧。 绝缘基板在端子之间具有凹槽。

公开(公告)号：US09439335B2

公开(公告)日：2016-09-06

申请号：US13980817

申请日：2012-10-19

Applicant: PANASONIC CORPORATION

Inventor： Tadashi Maeda ,  Hiroki Maruo ,  Tsubasa Saeki

IPC: H05K3/34 ,  H05K13/04

CPC classification number: H05K13/0465 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K13/0469 ,  H05K2201/09909 ,  H05K2203/0126 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant.

Abstract translation: 公开了一种电子部件安装线，其中衬底经过焊膏打印，电子部件放置，然后从上游向下游移动，然后回流。 该线包括：基材喂料机; 丝网印刷机，用于将焊膏涂布到基板上; 布置在丝网印刷机的下游的树脂分配机，用于将热固性树脂分配到基板上的至少一个加强位置上; 布置在所述树脂分配机附近和下游的第二电子部件放置机构，用于将第二电子部件放置在所述基板上，使得其周边部分与所述树脂接触; 布置在所述第二电子部件放置机的下游的第一电子部件放置机构，用于将第一电子部件放置在所述基板上; 以及用于将电子部件接合到基板的回流机，通过加热和冷却所得物。

公开(公告)号：US09427582B2

公开(公告)日：2016-08-30

申请号：US14532982

申请日：2014-11-04

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J Greenberg ,  Matthew J McMahon ,  Jordan Matthew Neysmith ,  James S Little ,  Neil Hamilton Talbot ,  Kelly H McClure ,  Brian V Mech

IPC: A61N1/36 ,  A61N1/05 ,  A61N1/372 ,  H05K1/02 ,  H05K3/00 ,  H05K1/11 ,  H05K3/28

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. It is advantageous that the array edges not contact tissue.

Abstract translation: 聚合物材料可用作神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 阵列边缘不接触组织是有利的。

公开(公告)号：US20160242286A1

公开(公告)日：2016-08-18

申请号：US15135638

申请日：2016-04-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota ASAI

IPC: H05K1/11 ,  H05K3/10 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/038 ,  H05K1/09 ,  H05K3/108 ,  H05K3/244 ,  H05K3/28 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/099 ,  H05K2201/09909

Abstract: A wiring board is provided with: an insulating layer; a base electrode layer layered on one primary surface of the insulating layer in predetermined regions; an insulating covering layer layered on one primary surface of the insulating layer in a state covering parts of edges of the base electrode layer; and a surface electrode layer plated on exposed portions of the base electrode layer not covered by the insulating covering layer, the thickness of covered portions of the base electrode layer covered by the insulating covering layer being less than the thickness of the exposed portions. The surface electrode layer is formed only on the exposed portions of the base electrode layer.

Abstract translation: 布线板设有：绝缘层; 在预定区域中在绝缘层的一个主表面上层叠的基极层; 在覆盖所述基极电极层的边缘部分的状态下层叠在所述绝缘层的一个主面上的绝缘被覆层; 以及电镀在未被绝缘覆盖层覆盖的基极电极层的露出部分上的表面电极层，由绝缘覆盖层覆盖的基极层的被覆部分的厚度小于露出部分的厚度。 表面电极层仅形成在基极层的露出部分上。

公开(公告)号：US20160116948A1

公开(公告)日：2016-04-28

申请号：US14607500

申请日：2015-01-28

Applicant: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. ,  FIH (HONG KONG) LIMITED

Inventor： WU-ZHENG OU ,  CHANG-HAI GU ,  CHAO-HSUN LIN ,  XIAO-KAI LIU ,  WEI-BEN CHEN

IPC: G06F1/16 ,  H05K5/02 ,  H05K5/04

CPC classification number: G06F1/1698 ,  G06F1/1613 ,  G06F1/1626 ,  H01Q1/2266 ,  H01Q1/243 ,  H01Q1/40 ,  H01Q1/42 ,  H01Q9/0485 ,  H01Q13/10 ,  H05K2201/09909

Abstract: A housing includes a metal base and a non-conductive member. The metal base has an internal surface and at least one gap. The non-conductive member covers at least a portion of the internal surface of the metal base, and the non-conductive member is formed on the bottom of the at least one gap.

Abstract translation: 壳体包括金属基底和非导电构件。 金属基底具有内表面和至少一个间隙。 非导电构件覆盖金属基底的内表面的至少一部分，并且非导电构件形成在至少一个间隙的底部上。

公开(公告)号：US09271404B2

公开(公告)日：2016-02-23

申请号：US14029809

申请日：2013-09-18

Applicant: Wistron Corporation

Inventor： Jui-Yun Fan ,  Hui-Lin Lu ,  Howard Huang ,  Zheng-Wei Wu

IPC: H05K1/00 ,  H05K1/11 ,  H01K3/10 ,  H05K3/34

CPC classification number: H05K1/0298 ,  H05K1/115 ,  H05K3/0073 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3484 ,  H05K3/4664 ,  H05K2201/09909 ,  H05K2203/04 ,  H05K2203/0588 ,  Y10T29/49165

Abstract: A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask.

Abstract translation: 电路板包括电路板板，导电环，焊接掩模和至少一个绝缘垫。 电路板板包括表面和穿过表面的导电通孔和电路板板，其中导电通孔具有布置在其壁上的导电层。 表面上的导电环围绕表面上的导电通孔的开口并与导电层电连接。 焊接掩模设置在表面上。 导电环暴露在焊料掩模的外部。 绝缘垫具有厚度。 绝缘垫的第一表面适于接触焊料掩模或表面并位于导电环的周边。 绝缘垫的第二表面适于间隔焊料涂覆工具和焊接掩模之间的距离。

公开(公告)号：US09252528B2

公开(公告)日：2016-02-02

申请号：US13933288

申请日：2013-07-02

Applicant: GERMANE SYSTEMS, LC

Inventor： Michael Stock ,  Scott Semmler

IPC: H01R13/533 ,  H05K3/00 ,  H05K7/14 ,  H05K1/14 ,  H01R12/70 ,  H05K3/36

CPC classification number: H01R13/533 ,  H01R12/7029 ,  H05K1/141 ,  H05K3/00 ,  H05K3/366 ,  H05K7/1405 ,  H05K2201/09045 ,  H05K2201/09909 ,  H05K2201/10159 ,  H05K2201/10325 ,  H05K2201/10606 ,  Y10T29/49117 ,  Y10T156/1089

Abstract: A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket.

Abstract translation: 要安装在连接器插座中的电路板包括沿着电路板的侧边缘定位的多个电连接器。 保持凸起形成在电路板的第一和第二相对侧上，每个保持凸起从电路板的表面突出并且平行于并邻近电路板的第一边缘延伸。 当电路板的第一边缘插入连接器插座的插槽中时，第一和第二保持凸台的接触表面接触连接器插座的顶部表面，以帮助固定电路板相对于连接器插座。 第一和第二保持凸起的接触表面上的粘合层可以粘附到连接器插座的顶表面，以帮助保持电路板相对于连接器插座不动。