公开(公告)号：US20180158742A1

公开(公告)日：2018-06-07

申请号：US15866586

申请日：2018-01-10

Applicant: SHIN SUNG C&T CO., LTD.

Inventor： Ci Moo SONG ,  Keun Jung YOUN ,  Jeong Sik KANG ,  Yong Kook KIM

IPC: H01L23/053 ,  H01L23/50 ,  H01L23/31 ,  H01L23/48 ,  H01L23/488

CPC classification number: H01L23/053 ,  B81B7/007 ,  B81B2201/0242 ,  B81B2207/096 ,  B81C2203/0109 ,  G01P15/00 ,  H01L23/055 ,  H01L23/10 ,  H01L23/31 ,  H01L23/48 ,  H01L23/481 ,  H01L23/488 ,  H01L23/50 ,  H01L2224/11 ,  H01L2924/16235

Abstract: Provided is a semiconductor package. The semiconductor package comprises: a device substrate having a device pattern formed thereon; a cap substrate overlying the device substrate and comprising a first cavity area; a base substrate underlying the device substrate and comprising a second cavity area formed in the position corresponding to the first cavity area and at least one first through-silicon via that outputs, to the outside, an electrical signal provided from the device pattern or transmits, to the device pattern, an electrical signal provided from the outside; and a circuit substrate underlying the base substrate and electrically connected with the first through-silicon via to process an electrical signal for the device pattern.

公开(公告)号：US20180134544A1

公开(公告)日：2018-05-17

申请号：US15574237

申请日：2016-05-09

Applicant: CAMBRIDGE ENTERPRISE LIMITED

Inventor： ASHWIN SESHIA ,  CUONG DO

IPC: B81B7/00 ,  H03D13/00

CPC classification number: B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  H03D13/003

Abstract: A temperature-compensated resonant MEMS device comprises a first and second oscillator circuits comprising a first and second resonant MEMS devices and providing a first and second oscillator outputs. One of the resonant MEMS devices is a temperature reference for the other. A level-sensitive mixer circuit has first and second inputs coupled to the first and second oscillator outputs and has a mixer output to provide a signal responsive to a level of the first and second oscillator outputs. The mixer output comprises sum and difference frequency components of the first and second oscillator outputs. A low-pass filter is coupled to the mixer output to attenuate the sum frequency component of the mixer output. An output coupled to an output of said low-pass filter provides a signal responsive to the difference frequency component.

公开(公告)号：US09957156B2

公开(公告)日：2018-05-01

申请号：US15080356

申请日：2016-03-24

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Ming Chen ,  Ping-Yin Liu ,  Chung-Yi Yu ,  Yeur-Luen Tu

IPC: H01L29/84 ,  B81B7/00 ,  B81C1/00 ,  H01L23/00

CPC classification number: B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/052 ,  B81C1/00269 ,  B81C1/00357 ,  B81C2201/013 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/036 ,  H01L24/03 ,  H01L24/09 ,  H01L2224/02163 ,  H01L2224/05082 ,  H01L2224/05109 ,  H01L2224/05117 ,  H01L2224/05124 ,  H01L2224/05138 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/1461

Abstract: An embodiment method includes forming a first plurality of bond pads on a device substrate, depositing a spacer layer over and extending along sidewalls of the first plurality of bond pads, and etching the spacer layer to remove lateral portions of the spacer layer and form spacers on sidewalls of the first plurality of bond pads. The method further includes bonding a cap substrate including a second plurality of bond pads to the device substrate by bonding the first plurality of bond pads to the second plurality of bond pads.

公开(公告)号：US09939266B2

公开(公告)日：2018-04-10

申请号：US14692177

申请日：2015-04-21

Applicant: Seiko Epson Corporation

Inventor： Teruo Takizawa

IPC: G01C19/5712 ,  G01C25/00 ,  B81B7/00

CPC classification number: G01C19/5712 ,  B81B7/0041 ,  B81B2201/0242 ,  B81C2203/0145 ,  G01C25/00 ,  Y10T29/4989 ,  Y10T29/4998

Abstract: An electronic device includes a base body, a functional element that is placed on the base body, and a lid body, formed from silicon, that is placed over the base body so as to cover the functional element. A hole portion and a sealing member that closes the hole portion are disposed in the lid body, in the hole portion, the area of a second opening disposed on a side opposite to a first opening is larger than the area of the first opening disposed on the base body side, and the ratio of the volume of the sealing member to the volume of the hole portion is equal to or higher than 35% and is equal to or lower than 87%.

公开(公告)号：US09938134B2

公开(公告)日：2018-04-10

申请号：US15205619

申请日：2016-07-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shiang-Chi Lin ,  Jung-Huei Peng ,  Yu-Chia Liu ,  Yi-Chien Wu ,  Wei Siang Tan

IPC: B81B7/00 ,  B81C1/00 ,  B81B3/00 ,  H01L23/02 ,  H01L21/54 ,  H01L21/322 ,  H01L23/26 ,  H01L29/84 ,  H01L21/50

CPC classification number: B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/04 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00285 ,  B81C2201/013 ,  B81C2201/016 ,  B81C2203/0109 ,  B81C2203/035 ,  B81C2203/0714 ,  B81C2203/0792

Abstract: A microelectromechanical systems (MEMS) package with high gettering efficiency is provided. A MEMS device is arranged over a logic chip, within a cavity that is hermetically sealed. A sensing electrode is arranged within the cavity, between the MEMS device and the logic chip. The sensing electrode is electrically coupled to the logic chip and is a conductive getter material configured to remove gas molecules from the cavity. A method for manufacturing the MEMS package is also provided.

公开(公告)号：US20180086625A1

公开(公告)日：2018-03-29

申请号：US15698604

申请日：2017-09-07

Applicant: The Government of the United States of America, as Represented by the Secretary of the Navy ,  The Charles Stark Draper Laboratory, Inc.

Inventor： Francis J. KUB ,  Karl D. HOBART ,  Eugene A. IMHOFF ,  Rachael L. MYERS-WARD ,  Eugene COOK ,  Jonathan BERNSTEIN ,  Marc WEINBERG

IPC: B81B3/00 ,  B81C1/00 ,  G01C19/5656 ,  G01C19/5621 ,  G01C19/56

CPC classification number: B81B3/0072 ,  B81B7/0016 ,  B81B7/0019 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C1/00666 ,  B81C2201/0132 ,  B81C2203/036 ,  G01C19/56 ,  G01C19/5621 ,  G01C19/5656 ,  G01C19/5783

Abstract: Electromechanical device structures are provided, as well as methods for forming them. The device structures incorporate at least a first and second substrate separated by an interface material layer, where the first substrate comprises an anchor material structure and at least one suspended material structure, optionally a spring material structure, and optionally an electrostatic sense electrode. The device structures may be formed by methods that include providing an interface material layer on one or both of the first and second substrates, bonding the interface materials to the opposing first or second substrate or to the other interface material layer, followed by forming the suspended material structure by etching.

公开(公告)号：US09919919B2

公开(公告)日：2018-03-20

申请号：US15357074

申请日：2016-11-21

Applicant: Robert Bosch GmbH

Inventor： Jens Frey ,  Jochen Reinmuth ,  Mawuli Ametowobla ,  Philip Kappe

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00293 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/019

Abstract: A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a cavity, a pressure prevailing and gas mixture having a chemical composition being enclosed in the cavity. An access opening connecting the to surroundings of the micromechanical component is formed in the substrate or in the cap. The pressure and/or chemical composition are/is adjusted in the cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. A layer is deposited on or grown on a surface of the substrate or of the cap in the area of the access opening for mixing with a material area of the substrate or of the cap, which is converted into a liquid aggregate state.

公开(公告)号：US20180073875A1

公开(公告)日：2018-03-15

申请号：US15814373

申请日：2017-11-15

Applicant: INVENSENSE, INC.

Inventor： Ozan ANAC ,  Joseph SEEGER

IPC: G01C19/5762 ,  G01P15/08 ,  G01C19/5747 ,  B81B3/00 ,  G01C19/5733

CPC classification number: G01C19/5762 ,  B81B3/0051 ,  B81B2201/0242 ,  B81B2203/0163 ,  G01C19/5733 ,  G01C19/5747 ,  G01P15/0802

Abstract: Embodiments for modifying a spring mass configuration are disclosed that minimize the effects of unwanted nonlinear motion on a MEMS sensor. The modifications include any or any combination of providing a rigid element between rotating structures of the spring mass configuration, tuning a spring system between the rotating structures and coupling an electrical cancellation system to the rotating structures. In so doing unwanted nonlinear motion such as unwanted 2nd harmonic motion is minimized.

公开(公告)号：US09914640B2

公开(公告)日：2018-03-13

申请号：US15358733

申请日：2016-11-22

Applicant: Robert Bosch GmbH

Inventor： Mawuli Ametowobla ,  Philip Kappe

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81C1/00325 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/0181

Abstract: A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, includes in a first task, an access opening connecting the first cavity to surroundings of the component is formed in the substrate or cap, in a second task, the first pressure and/or the first chemical composition is adjusted in the first cavity, in a third task, the access opening is sealed by introducing energy or heat into an absorbing part of the substrate or cap with a laser, the introduction of the energy or heat occurring by adjusting the extension of the absorbing part and adjusting the absorption strength in the absorbing part to minimize stresses occurring in the substrate or cap.

公开(公告)号：US09890035B2

公开(公告)日：2018-02-13

申请号：US15401259

申请日：2017-01-09

Applicant: Robert Bosch GmbH

Inventor： Achim Breitling ,  Frank Reichenbach ,  Jochen Reinmuth ,  Julia Amthor

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C1/00285 ,  B81C1/00293 ,  B81C2201/0177 ,  B81C2203/0145

Abstract: A method is provided for manufacturing a micromechanical component including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. A first crystalline layer or a first amorphous layer or a first nanocrystalline layer or a first polycrystalline layer is deposited on or grown on a surface of the substrate or of the cap. A recess is introduced into the substrate or into the cap for accommodating the first crystalline layer or the first amorphous layer or the first nanocrystalline layer or the first polycrystalline layer.