公开(公告)号：US5419954A

公开(公告)日：1995-05-30

申请号：US70775

申请日：1993-06-03

Applicant: Scott A. Lane ,  Charlie F. Yancey

Inventor： Scott A. Lane ,  Charlie F. Yancey

IPC: B32B5/08 ,  C08F283/01 ,  C08F290/00 ,  C08F290/06 ,  C08G63/91 ,  C08J3/22 ,  H05K1/03 ,  H05K3/18 ,  B32B7/00

CPC classification number: C08J3/226 ,  B32B5/08 ,  C08F283/01 ,  H05K1/0373 ,  C08G63/918 ,  C08J2433/00 ,  C08J2467/00 ,  H05K2201/0236 ,  H05K2203/1157 ,  H05K3/181 ,  Y10S428/901 ,  Y10T442/2934 ,  Y10T442/3407 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/3439 ,  Y10T442/3813 ,  Y10T442/656 ,  Y10T442/658

Abstract: The inventive method provides a simple and economical method of manufacturing a laminate which is catalytically effective for subsequent electroless deposition thereon of metals, such as copper, and which is useful as a substrate for printed circuit boards. Advantageously, the inventive method provides an improved laminate having a substantially uniform distribution of finely divided catalytic metal, Me.sub.(0), within a crosslinked synthetic polymer impregnant. A catalytic metal-polymer complex is formed between a salt of a catalytic metal and a crosslinkable synthetic polymer, optionally containing a monomeric reactive diluent, to provide a concentrate which may be worked up into an impregnating composition for impregnating reinforcing material therewith. The complex is then destroyed and the catalytic metal, such as palladium-II, reduced to elemental metal, such as palladium metal, Pd.sub.(0), during or after crosslinking of the polymer system under conditions effective for crosslinking the polymer system. Preferably destruction and reduction occur during crosslinking. The catalytic metal is a Group IB or Group VIII metal, preferably palladium or nickel. The crosslinkable synthetic polymer is an unsaturated polyester or polyvinyl ester.

Abstract translation: 本发明的方法提供了制造层压板的简单和经济的方法，其对金属（例如铜）的随后的无电沉积具有催化效果，并且其可用作印刷电路板的基板。 有利地，本发明的方法提供了在交联的合成聚合物浸渍剂中具有基本上均匀分布的细分催化剂金属Me（0）的改进的层压体。 催化金属 - 聚合物复合物在催化金属的盐和可交联的合成聚合物之间形成，任选地含有单体反应性稀释剂，以提供可以被加工成浸渍组合物以用于浸渍增强材料的浓缩物。 然后在有效交联聚合物体系的条件下，在聚合物体系交联期间或之后，催化金属（例如钯-II）还原成元素金属，例如钯金属，Pd（0）。 优选在交联过程中发生破坏和还原。 催化金属是IB族或VIII族金属，优选钯或镍。 交联性合成聚合物是不饱和聚酯或聚乙烯酯。

公开(公告)号：US5407622A

公开(公告)日：1995-04-18

申请号：US88909

申请日：1993-07-08

Applicant: Eric J. Cleveland ,  David C. Frisch ,  Wilhelm Weber

Inventor： Eric J. Cleveland ,  David C. Frisch ,  Wilhelm Weber

IPC: C23C18/16 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18 ,  B29C45/00

CPC classification number: C23C18/1641 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/206 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/405 ,  H05K3/0014 ,  H05K3/182 ,  H05K1/0284 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/1476

Abstract: Molded, one-piece articles having selected surfaces suitable for adherent metallization, molded, metallized, one-piece articles and processes for making the articles are disclosed. The molded one-piece articles may be formed by: molding into a first mold cavity a first portion of the article using a first electrically insulating material which is capable of adhesion promotion by an adhesion promotion process and is catalytic for adherent metallization or is capable of being rendered catalytic for adherent metallization by an activating process; inserting the first portion into a second mold cavity; and molding into the second mold cavity a second portion of the article using a second electrically insulating material, leaving selected surfaces of the first portion exposed. The second material is resistant to the adhesion promotion process employed for the first material, or is non-catalytic for, and incapable of being rendered catalytic for, adherent metallization by the activating process employed for the first material. The exposed surfaces of the first portion of the article then may be metallized, for example, by electroless deposition to form the metallized one-piece article.

Abstract translation: 公开了具有适于粘附金属化的选定表面的模制的单件制品，模制的，金属化的，单件的制品和用于制造制品的方法。 模制的单件制品可以通过以下方式形成：使用第一电绝缘材料将制品的第一部分模制成第一模腔，所述第一电绝缘材料能够通过粘附促进过程促进粘附，并且用于粘附金属化或能够 通过活化过程催化粘附金属化; 将第一部分插入第二模腔中; 以及使用第二电绝缘材料将所述制品的第二部分模制到所述第二模腔中，从而使所述第一部分的选定表面露出。 第二种材料耐受用于第一种材料的粘合促进方法，或者对于通过用于第一种材料的活化方法而不是催化用于粘附金属化而不能进行催化。 然后，制品的第一部分的暴露表面可以被金属化，例如通过无电沉积来形成金属化的单件制品。

公开(公告)号：US5338567A

公开(公告)日：1994-08-16

申请号：US979481

申请日：1992-11-20

Applicant: Thomas S. Kohm

Inventor： Thomas S. Kohm

IPC: C23C18/16 ,  C23C18/20 ,  H05K1/03 ,  H05K3/18 ,  H05K3/42 ,  C23C26/00

CPC classification number: H05K1/0373 ,  C23C18/206 ,  C23C18/30 ,  H05K3/181 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0239 ,  H05K2201/0245

Abstract: This invention concerns a method of manufacturing printed wiring boards by electrolessly plating copper on a precatalyzed base material which contains a polymeric resin, woven glass cloth reinforcement and a noble metal catalyst on clay support to precatalyze the base material for electrolessly depositing copper. The improvement comprises providing in the polymeric resin, a phenolic resin component and a silicate filler. The silicate filler is present in an amount between 30 and 100 part per hundred parts of the polymeric resin, and in an amount sufficient to provide a take time for the initiation of electroless copper deposition at least two times faster than a comparable precatalyzed base material without the silicate filler and phenolic resin.

Abstract translation: 本发明涉及一种制造印刷线路板的方法，该方法是通过在含有聚合物树脂，织物玻璃织物增强物和贵金属催化剂的预催化基材上无电镀铜来预先沉积用于无电沉积铜的基底材料的铜。 该改进包括在聚合物树脂中提供酚醛树脂组分和硅酸盐填料。 硅酸盐填料以每100份聚合树脂30-100份的量存在，并且其用量足以提供无电沉积铜的起始时间至少比可比较的预分解基材快两倍，而没有 硅酸盐填料和酚醛树脂。

公开(公告)号：US5309632A

公开(公告)日：1994-05-10

申请号：US970925

申请日：1992-11-02

Applicant: Hiroshi Takahashi ,  Shin Takanezawa ,  Masao Kanno ,  Yorio Iwasaki ,  Toshirou Okamura ,  Akishi Nakaso ,  Kiyoshi Hasegawa

Inventor： Hiroshi Takahashi ,  Shin Takanezawa ,  Masao Kanno ,  Yorio Iwasaki ,  Toshirou Okamura ,  Akishi Nakaso ,  Kiyoshi Hasegawa

IPC: H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H01K3/10

CPC classification number: H05K3/181 ,  H05K3/184 ,  H05K3/426 ,  H05K1/0373 ,  H05K2201/0236 ,  H05K2201/0344 ,  H05K2203/0709 ,  H05K2203/1407 ,  H05K2203/1415 ,  H05K3/387 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.

Abstract translation: 一种印刷电路板的制造方法，其特征在于，通过无电解电镀形成镍层，通过无电镀形成在其上的铜层，或者通过化学镀在镍层之前形成铜底涂层，可以制造出耐电解质优异的印刷电路板 腐蚀，适合高密度安装。

公开(公告)号：US5260170A

公开(公告)日：1993-11-09

申请号：US461857

申请日：1990-01-08

Applicant: Vernon L. Brown

Inventor： Vernon L. Brown

IPC: G03F7/00 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  G03C5/58

CPC classification number: H05K3/465 ,  G03F7/002 ,  G03F7/0035 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2201/09563 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/0023 ,  H05K3/184

Abstract: A dielectric layered sequentially processed circuit board is disclosed. A first photodefinable resin containing an electroless plating catalyst is disposed on a substrate and portions of the substrate are exposed through the first resin. A second photodefinable resin absent the electroless plating catalyst is disposed on the first resin, and portions coincident with the exposed portions of the substrate as well as portions of the first resin are exposed through the second resin. A conductive material is deposited on the exposed portions of the substrate and the exposed portions of the first resin.

Abstract translation: 公开了一种电介质层状顺序处理电路板。 含有化学镀催化剂的第一光可固化树脂设置在基材上，并且基板的部分通过第一树脂曝光。 没有化​​学镀催化剂的第二光可固化树脂设置在第一树脂上，并且与基板的暴露部分重合的部分以及第一树脂的部分通过第二树脂暴露。 导电材料沉积在基板的暴露部分和第一树脂的暴露部分上。

公开(公告)号：US4946709A

公开(公告)日：1990-08-07

申请号：US395213

申请日：1989-08-17

Applicant: Mitsuyuki Takada ,  Eishi Gofuku ,  Hayato Takasago

Inventor： Mitsuyuki Takada ,  Eishi Gofuku ,  Hayato Takasago

IPC: H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K3/4661 ,  H01L21/481 ,  H01L21/4846 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0116 ,  H05K2201/0236 ,  H05K2201/0347 ,  H05K2203/072 ,  H05K3/184 ,  H05K3/246 ,  H05K3/465 ,  Y10T29/49099

Abstract: A method for fabricating a hybrid IC substrate comprises the steps of: preparing an insulating ceramic substrate having a major surface; baking one or more conductors of a first group formed of high melting point metal or alloy thereof on the major surface; covering the conductors of the first group with a first plated film formed by electroless plating; forming an insulating porous active including a glass component and a small amount of a metal component having a catalytic action for electroless plating on the first plated film; and forming one or more conductors of a second group by electroless plating on the active layer, whereby portions of the active layer sandwiched between the conductors of the first and second groups are rendered conductive.

Abstract translation: 一种制造混合IC基板的方法包括以下步骤：制备具有主表面的绝缘陶瓷基片; 在主表面上烘烤由高熔点金属或其合金形成的第一组的一个或多个导体; 用无电镀形成的第一镀膜覆盖第一组导体; 在所述第一镀膜上形成具有玻璃成分和少量金属成分的绝缘多孔活性物质，所述金属成分具有化学镀的催化作用; 以及通过在有源层上进行化学镀来形成第二组的一个或多个导体，由此夹在第一和第二组的导体之间的有源层的部分变得导电。

公开(公告)号：US4799996A

公开(公告)日：1989-01-24

申请号：US78166

申请日：1987-07-27

Applicant: Robert Cassat

Inventor： Robert Cassat

IPC: C08L61/06 ,  C08G59/00 ,  C08G59/18 ,  C08G85/00 ,  C08L61/00 ,  C08L61/04 ,  C08L63/00 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  D21H1/48

CPC classification number: H05K3/188 ,  H05K1/0373 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0245 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/256

Abstract: Substrate composites, well adopted for the production of metallized printed circuits and facilely prepared by, e.g., papermaking procedures, include a central core layer comprising fibrous cellulosic material or flaked mica within a matrix of a thermosetting resin binder, said central core element having coextensively laminated to at least one of the face surfaces thereof, a lamina of a thermosetting resin comprising non-conductive metal oxide filler material distributed therethrough, and said metal oxide being borohydride reduceable and reactive to form unstable metal hydride intermediates.

Abstract translation: 用于生产金属化印刷电路并通过例如造纸方法容易制备的基材复合材料包括在热固性树脂粘合剂的基体内包含纤维状纤维素材料或薄片状云母的中心芯层，所述中心芯部元件具有共同层压 至少一个其表面，包含分布在其中的非导电金属氧化物填充材料的热固性树脂的层，并且所述金属氧化物是硼氢化物可还原和反应以形成不稳定的金属氢化物中间体。

公开(公告)号：US4281038A

公开(公告)日：1981-07-28

申请号：US102154

申请日：1979-12-10

Applicant: Peter Ambros ,  Hermann Geyer

Inventor： Peter Ambros ,  Hermann Geyer

IPC: C23C18/16 ,  C23C18/28 ,  C23C18/31 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  C08K9/06

CPC classification number: H05K1/0373 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/105 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/259 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2998

Abstract: The disclosure is of a substrate or supporting board for supporting printedircuits and the method of its manufacture. The boards of the invention are preferably made of a high-temperature resistant thermoplastic, sensitized to receive a printed circuit element by the dispersion of coated iron or copper particles in the thermoplastic matrix. The coating is a bonding assistant.

Abstract translation: 本公开是用于支撑印刷电路的基板或支撑板及其制造方法。 本发明的板优选由耐高温热塑性塑料制成，通过涂覆的铁或铜颗粒在热塑性基质中的分散而使印刷电路元件敏感。 涂层是粘合助剂。

公开(公告)号：US4035500A

公开(公告)日：1977-07-12

申请号：US692712

申请日：1976-06-04

Applicant: Robert Vincent Dafter, Jr.

Inventor： Robert Vincent Dafter, Jr.

IPC: C23C18/16 ,  H05K3/18 ,  H05K3/38

CPC classification number: C23C18/1608 ,  H05K3/387 ,  H05K2201/0236 ,  H05K2203/0796 ,  H05K3/181

Abstract: A method of depositing a metal on a surface of a substrate is disclosed. The method comprises forming a dielectric coat containing an activating metal species on the surface of the substrate. The coat is then treated with a reviving agent selected from chromic acid and ceric ammonium nitrate to revive the activating metal species to render the coat capable of participating in an electroless metal deposition.

Abstract translation: 公开了一种在衬底的表面上沉积金属的方法。 该方法包括在基材的表面上形成含有活化金属物质的电介质涂层。 然后用选自铬酸和硝酸铈铵的复活剂处理该涂层，以恢复活化金属物质，使涂层能够参与无电金属沉积。

公开(公告)号：US3674914A

公开(公告)日：1972-07-04

申请号：US3674914D

申请日：1970-03-05

Applicant: PHOTOCIRCUITS CORP

Inventor： BURR ROBERT PAGE

IPC: H05K1/03 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H05K7/06 ,  H05K13/04

CPC classification number: H05K3/103 ,  H01L24/78 ,  H01L2924/00014 ,  H05K1/0373 ,  H05K3/20 ,  H05K3/38 ,  H05K3/386 ,  H05K3/42 ,  H05K3/429 ,  H05K3/46 ,  H05K7/06 ,  H05K13/04 ,  H05K13/043 ,  H05K2201/0236 ,  H05K2201/10287 ,  H05K2201/10977 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The present invention represents a new approach to solving modern electronic packaging problems which combines in one system the best features of discrete wiring techniques and printed circuits. According to this invention, there are provided new and useful procedures whereby a prefabricated organized wire interconnecting device, hereinafter referred to as a wire scribed circuit board, is produced by writing or plotting a predetermined circuit interconnection onto the surface of an insulating base using as the writing medium or ''''ink'''' a continuous wire filament. The wire is fed onto the surface of the base continuously from one side thereof, simultaneously affixed to the base to form the interconnecting pattern, and cut at the finish of each line, to thereby form a written wire image of a predetermined interconnecting pattern on the base. Preferred embodiments of the wire scribed boards include a wire image of a predetermined interconnecting pattern in which wire conductors exhibit inflection points produced solely as a result of the writing technique and/or crossovers in essentially the same plane as the wire, as well as connection terminals to which the written wire lines and/or electrical components may be attached. The boards resemble a printed circuit board in appearance and cubic packing potential, although no art work or graphic processes of any kind are employed in their production. Unlike printed circuit boards, repairs as by conductor additions or deletions or modifications may be readily made.