公开(公告)号：US6073856A

公开(公告)日：2000-06-13

申请号：US146536

申请日：1998-09-03

Applicant: Norio Takahashi

Inventor： Norio Takahashi

IPC: G06K19/073 ,  G06K19/077 ,  H05K1/00 ,  H05K3/40 ,  G06K7/06 ,  G06K19/06

CPC classification number: G06K19/07749 ,  G06K19/073 ,  G06K19/07726 ,  H05K1/0293 ,  H01H2231/05 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/3025 ,  H05K1/0275 ,  H05K2201/0305 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/4084

Abstract: A noncontact IC card is provided with an antenna coil, an IC chip and a short-circuiting circuit formed on a base card. The noncontact IC card is kept inoperative unless the short-circuiting circuit is opened and the noncontact IC card is rendered operative when the short-circuiting circuit is opened. The short-circuiting circuit is formed to extend across a main part and a removable identification part included in the base card. The short-circuiting circuit can be opened by removing the identification part from the base card.

Abstract translation: 非接触IC卡设置有形成在基卡上的天线线圈，IC芯片和短路电路。 非接触式IC卡不起作用，除非短路电路断开，并且当短路电路断开时非接触式IC卡工作。 短路电路形成为延伸穿过基座中的主要部分和可拆卸的识别部件。 通过从基卡中取出识别部件可以打开短路电路。

公开(公告)号：US5155378A

公开(公告)日：1992-10-13

申请号：US361872

申请日：1989-06-05

Applicant: Osamu Takagi ,  Naoko Ezaki ,  Kiyohiko Tsutsumi

Inventor： Osamu Takagi ,  Naoko Ezaki ,  Kiyohiko Tsutsumi

IPC: G06F13/14 ,  G06K19/077 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0266 ,  G06K19/07745 ,  H05K1/0293 ,  H01L2924/0002 ,  H05K1/029 ,  H05K1/118 ,  H05K2201/09127 ,  H05K2203/0228 ,  H05K2203/175

Abstract: A printed circuit board includes at least one code establishing section which is readily removable or separated from the board and also includes printed wiring connected to a voltage source and to a ground. When the code establishing section is removed, the level of an output signal from the voltage source is inverted from the level of the output signal prior to removal of the code establishing section in order to establish a desired unique code. A second arrangement of the apparatus includes a main portion and two removable portions of the board with a pair of voltage sources on the main portion and a ground connection on one of the two removable portions. The method of establishing a unique address code is accomplished by removing one of the removable portions to provide an output signal of a level that is inverted from the level of an original signal. Subsequent removal of the other removable portion provides an output signal of a level that is the same level as the original signal.

Abstract translation: 印刷电路板包括至少一个代码建立部分，其易于从板上移除或分离，并且还包括连接到电压源和地面的印刷线路。 当代码建立部分被去除时，来自电压源的输出信号的电平在去除代码建立部分之前从输出信号的电平反转，以建立期望的唯一代码。 该装置的第二布置包括主体部分和主体部分上的一对电压源的两个可拆卸部分，以及两个可拆卸部分之一上的接地连接。 建立唯一地址码的方法是通过去除一个可移动部分来提供与原始信号的电平相反的电平的输出信号来实现的。 随后移除另一可移除部分提供与原始信号相同电平的电平的输出信号。

公开(公告)号：US4800459A

公开(公告)日：1989-01-24

申请号：US119674

申请日：1987-11-12

Applicant: Horshi Takagi ,  Yoshiaki Mori ,  Yukio Sakabe

Inventor： Horshi Takagi ,  Yoshiaki Mori ,  Yukio Sakabe

IPC: H01L23/498 ,  H01L23/64 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/46 ,  H01G4/10

CPC classification number: H05K1/186 ,  H01L23/49822 ,  H01L23/647 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09127 ,  H05K2201/10636 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4629 ,  Y02P70/611

Abstract: A circuit substrate (1) comprises a ceramic laminated structure (10) which has a plurality of ceramic layers (2-7) including ceramic layers (3-6) having cavities (44-49). Chip-like electronic components such as a laminated ceramic capacitor (26, 27) and a resistor (28) are received in the cavities. The chip-like electronic components are formed with external terminal electrodes (29-34) respectively. Conductors (15-20) are formed in through holes (35-43) provided in the ceramic layers and interfaces between adjacent pairs of the ceramic layers, to be connected to the external terminal electrodes. The external terminal electrodes are prepared from metal which is mainly composed of at least one of nickel, copper and palladium, and the conductors are prepared from metal which is mainly composed of copper.

Abstract translation: 电路基板（1）包括陶瓷层叠结构（10），该陶瓷层叠结构（10）具有包括具有空腔（44-49）的陶瓷层（3-6）的多个陶瓷层（2-7）。 诸如层叠陶瓷电容器（26,27）和电阻器（28）的片状电子部件被容纳在空腔中。 芯片状电子部件分别由外部端子电极（29-34）形成。 导体（15-20）形成在陶瓷层中设置的通孔（35-43）中，并且在相邻的陶瓷层对之间形成与外部端子电极连接的接口。 外部端子电极由主要由镍，铜和钯中的至少一种构成的金属制成，导体由主要由铜构成的金属制成。

公开(公告)号：US4338149A

公开(公告)日：1982-07-06

申请号：US204660

申请日：1980-11-06

Applicant: Wolfgang Quaschner

Inventor： Wolfgang Quaschner

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/46 ,  B32B31/18

CPC classification number: H05K3/4691 ,  H05K2201/0355 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K3/0032 ,  H05K3/3452 ,  Y10S428/901 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A process for forming a circuit board having rigid and flexible areas which includes the steps of severing an area corresponding to the board area which is to be flexible, from a rigid layer material, leaving the severed rigid layer area in place coplanar and contiguous with the remainder of the rigid layer material, laminating a covering layer to one surface of said rigid material and said rigid layer area, laminating a flexible layer material to the other surface of the rigid material without lamination to the surface of the rigid layer area and, after said circuit board has been completed, severing said covering layer around said severed rigid layer area and removing said severed covering layer and said severed rigid layer area from said board.

Abstract translation: 一种用于形成具有刚性和柔性区域的电路板的方法，其包括以下步骤：从刚性层材料切割对应于要柔性的板区域的区域，将切断的刚性层区域合并在一起，与 剩余的刚性层材料，将覆盖层层压到所述刚性材料和所述刚性层区域的一个表面上，将柔性层材料层压到刚性材料的另一表面，而不与刚性层区域的表面层压，并且之后 所述电路板已经完成，在所述切断的刚性层区域周围切断所述覆盖层，并从所述板上去除所述切断的覆盖层和所述切断的刚性层区域。

公开(公告)号：US3780431A

公开(公告)日：1973-12-25

申请号：US3780431D

申请日：1972-09-25

Applicant: BOWMAR ALI INC

Inventor： FEENEY J

IPC: G06F15/02 ,  G09F9/30 ,  H05K3/00 ,  H05K3/34 ,  H05K3/30

CPC classification number: H05K3/0052 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/1034 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/53174

Abstract: In a process for producing calculator printed circuit boards, a pallet consisting of a plurality of printed circuit boards are interconnected by snapaway perforated edges at the adjacent side of the boards, so that the pallet consisting of plural boards is processible as a whole. Electrical elements or components have their terminals received through openings in the printed circuit board, which insertion is by machine utilizing a pantographic locating principle. Components are also assembled on the board by hand insertion. After inserting selected electrical components at the desired locations, and masking other locations, the electrical connections are then treated by fountain soldering to form electrical connections between the leads and the printed circuit. The soldering occurs to the pallet as a whole. The individual boards are then snapped apart and the board has enough dimensional stability so that it is rigidly clamped on a fixture and passed over a routing blade at a predetermined slight clearance therefrom so that all of the excess lead sections are trimmed from the subsurface of the printed circuit substrate. Further electrical devices can then be added and soldered in place and the printing circuit board together with its electrical components can then be positioned within a container for a computer application. The described process incorporates minimal handling and incorporates high speed machine assembly techniques wherein multiple operations occur simultaneously or repetitively at high speed.

Abstract translation: 在制造计算机印刷电路板的过程中，由多个印刷电路板组成的托板在板的相邻侧面处通过快速切割的多孔边缘相互连接，使得由多个板组成的托盘作为整体是可加工的。 电气元件或部件的端子通过印刷电路板中的开口接收，该插入通过机器利用缩放定位原理。 组件也通过手插入组装在板上。 在所选位置插入所选择的电气元件并遮盖其他位置后，电连接将通过喷泉焊接进行处理，从而在引线和印刷电路之间形成电连接。 整个焊盘发生在托板上。 然后单独的板被分开，并且板具有足够的尺寸稳定性，使得其刚性地夹紧在固定装置上，并以预定的轻微的间隙从布线刀片上经过，使得所有过剩的引线部分从 印刷电路基板。 然后可以将另外的电气设备添加到位并将其焊接在一起，并且印刷电路板与其电气部件一起可以被定位在用于计算机应用的容器内。 所描述的过程包括最小的处理并且包括高速机器组装技术，其中多个操作以高速同时或重复地发生。

公开(公告)号：US20190045631A1

公开(公告)日：2019-02-07

申请号：US16075044

申请日：2017-03-14

Applicant: SUMITOMO WIRING SYSTEMS, LTD.

Inventor： Tsuyoshi SAKITA

IPC: H05K1/14 ,  H01R12/71 ,  H01R4/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/14 ,  H01R4/02 ,  H01R12/716 ,  H05K1/141 ,  H05K1/144 ,  H05K1/18 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/306 ,  H05K3/34 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2203/1484

Abstract: A method of this invention is for manufacturing a circuit board in which terminal fittings and electronic components are provided on a first surface of a main substrate that has the first surface and a second surface, a sub substrate that has a first surface and a second surface is arranged on the second surface side of the main substrate, and the sub substrate and the main substrate are connected by relay terminals. The main substrate and the sub substrate are formed in advance in a state of being connected in the same plane. During the method, the main and sub substrate are initially physical connected, at which time electrical components are attached to at least the main substrate. After physically separating the main and sub substrates, they are electrically connected.

公开(公告)号：US20180372281A1

公开(公告)日：2018-12-27

申请号：US16027660

申请日：2018-07-05

Applicant: Michael A. Tischler

Inventor： Michael A. Tischler

IPC: F21S4/20

CPC classification number: F21S4/20 ,  F21K9/90 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/62 ,  H05K1/00 ,  H05K1/0286 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/09127 ,  H05K2201/10106

Abstract: In accordance with certain embodiments, flexible light sheets are folded to define first and second portions of the light sheet divided by the fold, and the first and second portions of the light sheet may both feature light-emitting elements thereon.

公开(公告)号：US20180340680A1

公开(公告)日：2018-11-29

申请号：US16054655

申请日：2018-08-03

Applicant: Hubbell Incorporated

Inventor： Derek B. Baker ,  Cory A. Passerello ,  Thomas Clawson

IPC: F21V23/00 ,  H05K1/02 ,  F21S8/04 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: F21V23/003 ,  F21S8/04 ,  F21V23/009 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0286 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/10106

Abstract: A light board for a light fixture includes a first portion and a second portion. The first portion includes at least one light emitting element, and the second portion includes at least one light emitting element. A first state is defined by the second portion being coupled to the first portion and a second state is defined by the second portion being detached from the first portion. In the first state, the light emitting elements of the first portion and the second portion are configured to provide an evenly distributed light output along at least the combined length of the first portion and the second portion. In the second state, the at least one light emitting element of the first portion is configured to provide an evenly distributed light output along at least the length of the first portion.

公开(公告)号：US09992880B2

公开(公告)日：2018-06-05

申请号：US14995139

申请日：2016-01-13

Applicant: Multek Technologies Limited

Inventor： Pui Yin Yu ,  Mark Zhang ,  Jiawen Chen

IPC: H05K3/36 ,  H05K3/46

CPC classification number: H05K3/4691 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0228 ,  Y10T29/49126

Abstract: A printed circuit board (PCB) has multiple layers, where select portions of one or more conductive layers, referred to as core circuitry, form a semi-flexible PCB portion that is protected by an exposed prepreg layer. The semi-flexible PCB portion having an exposed prepreg layer is formed using a dummy core process that leaves the exposed prepreg layer smooth and undamaged. The core circuitry is part of a core structure. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The core structure is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.

公开(公告)号：US20170372980A1

公开(公告)日：2017-12-28

申请号：US15633968

申请日：2017-06-27

Applicant: IBIDEN CO., LTD.

Inventor： Naoki KURAHASHI

IPC: H01L23/13 ,  H01L21/48 ,  H01L21/683 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H01L23/498 ,  H01L25/10 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15153 ,  H05K3/0097 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2203/107

Abstract: A method for manufacturing a wiring board includes forming on a first support plate a first laminated wiring portion including conductor and insulating layers such that the first portion has a first surface on first support plate side and a second surface, separating the first portion from the first plate, forming a conductor layer exposed on the first surface and including pads, laminating the first portion on a second support plate such that the second surface of the first portion faces second support plate side, forming on the first surface of the first portion a second laminated wiring portion including conductor and insulating layers such that the second portion has a third surface on second support plate side and a fourth surface, forming cavity in the second portion on the second plate such that the cavity exposes the pads, and separating the first and second portions from the second plate.