公开(公告)号：US06853091B2

公开(公告)日：2005-02-08

申请号：US10627710

申请日：2003-07-28

Applicant: Yoshiyuki Miyajima

Inventor： Yoshiyuki Miyajima

IPC: B23K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01K23/48

CPC classification number: H05K1/116 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/0201 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/062 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/0989

Abstract: A printed circuit board having circuit patterns printed thereon has a plurality of composite lands each including a first land having a terminal hole formed at its center for inserting the terminal of a selected electric or electronic part or device, and a plurality of second lands each being contiguous to and extending outwards from the first land. The areas contiguous to the contours of the first and second lands have no conductive foils, such as copper foils, thereon such that the substrate surface of the printed circuit board is exposed in these areas. The exposed areas are effective to confine the thermal energy in the limited areas for soldering. And the composite land shape defines a ridged cone-like solder lump, which can fixedly grip the terminal of the part or device.

Abstract translation: 具有印刷电路图案的印刷电路板具有多个复合凸台，每个复合凸台包括第一凸台，该第一凸台具有形成在其中心的端子孔，用于插入所选择的电气或电子部件或装置的端子，以及多个第二凸台 与第一个土地相邻并向外延伸。 与第一和第二焊盘的轮廓相邻的区域在其上没有导电箔，例如铜箔，使得印刷电路板的衬底表面暴露在这些区域中。 暴露的区域有效地将热能限制在有限的焊接区域。 并且复合平台形状限定了脊状的锥形焊料块，其可以固定地夹持部件或装置的端子。

公开(公告)号：US06841862B2

公开(公告)日：2005-01-11

申请号：US09894123

申请日：2001-06-29

Applicant: Katsumi Kikuchi ,  Tadanori Shimoto ,  Koji Matsui ,  Kazuhiro Baba

Inventor： Katsumi Kikuchi ,  Tadanori Shimoto ,  Koji Matsui ,  Kazuhiro Baba

IPC: H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K3/00 ,  H05K3/06 ,  H05K3/20 ,  H05K3/40 ,  H05K3/44 ,  H05K3/46 ,  H01L23/02 ,  H05K1/03

CPC classification number: H01L21/4857 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/20 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/44 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/0376 ,  H05K2203/061 ,  H05K2203/1536 ,  H01L2924/00

Abstract: A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.

Abstract translation: 用于安装半导体芯片的半导体封装板包括具有用于在其中接收半导体芯片的开口的金属基体和层叠在金属基底上的多层布线膜。 将半导体芯片倒装芯片接合到设置在开口内的多层布线膜上的金属焊盘上。 金属基体的表面与容纳在开口中的半导体芯片的顶表面齐平。 所得的半导体器件在不使用加强件的情况下具有较大数量的外部引脚和较小的变形。

公开(公告)号：US06839965B2

公开(公告)日：2005-01-11

申请号：US10360575

申请日：2003-02-06

Applicant: Scott Patrick Terrell ,  Clifton Jay Seusy ,  Robert Calhoun Cannon ,  Darrell Kent Mason ,  Brandon Chad Bailey ,  Douglas G. Hastings

Inventor： Scott Patrick Terrell ,  Clifton Jay Seusy ,  Robert Calhoun Cannon ,  Darrell Kent Mason ,  Brandon Chad Bailey ,  Douglas G. Hastings

IPC: H01R13/24 ,  H05K1/11 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/32 ,  H05K3/42 ,  H01K3/10

CPC classification number: H01R13/2414 ,  H05K1/113 ,  H05K3/062 ,  H05K3/108 ,  H05K3/243 ,  H05K3/247 ,  H05K3/325 ,  H05K3/326 ,  H05K3/427 ,  H05K2201/0314 ,  H05K2201/035 ,  H05K2201/0969 ,  H05K2201/0979 ,  H05K2201/10378 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method for making electrical interposers which includes the use of a stencil which is thicker than designated lower contact pads and which defines a stencil passage corresponding to each lower contact pad of each interposer. The stencil is attached to a bottom surface of an insulative layer and a conductive elastomeric material is applied to the stencil, so that the stencil passages are filled with said conductive elastomeric material. When this material has been adequately placed within the stencil passages the stencil is removed thus leaving each lower conductive pad with an attached conductive elastomeric pad.

Abstract translation: 一种制造电插入件的方法，其包括使用比指定的下接触焊盘厚的模板，并且限定对应于每个插入件的每个下接触焊盘的模板通道。 模板附接到绝缘层的底表面，并且将导电弹性体材料施加到模板，使得模板通道填充有导电弹性体材料。 当这种材料已经被充分放置在模板通道内时，去除模板，从而使每个下部导电垫具有附着的导电弹性垫。

公开(公告)号：US06796028B2

公开(公告)日：2004-09-28

申请号：US10266847

申请日：2002-10-07

Applicant: Syed Sajid Ahmad

Inventor： Syed Sajid Ahmad

IPC: H01K310

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/06136 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/0272 ,  H05K3/4641 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2203/1178 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of making and using such interconnecting substrates. In one aspect of the invention, an interconnecting substrate comprises a first external layer having a first external surface, a second external layer having a second external surface, and a conductive core between the first and second external layers. The conductive core can have at least a first conductive stratum between the first and second external layers, and a dielectric layer between the first conductive stratum and one of the first or second external layers. The conductive core can also include a second conductive stratum such that the first conductive stratum is on a first surface of the dielectric layer and the second conductive stratum is on a second surface of the dielectric layer. The interconnecting substrate also has at least one vent through at least one of the first conductive stratum, the second conductive stratum, and/or the dielectric layer. The vent is configured to direct moisture away from the dielectric layer, and thus the vent can be a moisture release element that allows moisture to escape from the dielectric layer during high temperature processing.

Abstract translation: 用于制造微电子器件和印刷电路组件的互连衬底，具有互连衬底的封装的微电子器件，以及制造和使用这种互连衬底的方法。 在本发明的一个方面，互连衬底包括具有第一外表面的第一外层，具有第二外表面的第二外层和在第一和第二外层之间的导电芯。 导电芯可以在第一和第二外部层之间具有至少第一导电层，以及在第一导电层与第一或第二外部层之一之间的介电层。 导电芯还可以包括第二导电层，使得第一导电层位于电介质层的第一表面上，而第二导电层位于电介质层的第二表面上。 互连衬底还具有穿过第一导电层，第二导电层和/或介电层中的至少一个的至少一个通气孔。 排气口构造成将水分引导离开介电层，因此排气口可以是一种湿度释放元件，其允许水分在高温处理期间从电介质层逸出。

公开(公告)号：US06784526B1

公开(公告)日：2004-08-31

申请号：US09120117

申请日：1998-07-22

Applicant: Tsutomu Mezawa

Inventor： Tsutomu Mezawa

IPC: H01L2940

CPC classification number: H05K1/0233 ,  H01L2924/0002 ,  H05K1/0225 ,  H05K1/0248 ,  H05K1/0253 ,  H05K1/181 ,  H05K3/244 ,  H05K2201/086 ,  H05K2201/09254 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/10689 ,  H05K2203/1572 ,  H01L2924/00

Abstract: According to the present invention, for a module in which a plurality of integrated circuit devices are mounted in parallel, the inductance generated by the unit length of a branched signal line on a motherboard is so set that it is smaller for a branched signal line a longer distance from its branching point to its distal end, and is so set that it is larger for a branched signal line having a shorter distance from its branching point to its distal end, so that the time required for transmission of a signal from the branching point to the distal end of each branched signal line is the same.

Abstract translation: 根据本发明，对于并联安装多个集成电路器件的模块，由母板上的分支信号线的单位长度产生的电感被设定为使分支信号线a 从其分支点到其远端的距离更长，并且被设定为对于从其分支点到其远端具有较短距离的分支信号线较大，使得从分支点传输信号所需的时间 指向每条分支信号线的末端是相同的。

公开(公告)号：US20040144562A1

公开(公告)日：2004-07-29

申请号：US10740459

申请日：2003-12-22

Applicant: Fujitsu Limited

Inventor： Kiyoshi Ishikawa

IPC: H05K007/06

CPC classification number: H05K1/025 ,  H05K1/0237 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/117 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/094 ,  H05K2201/0969 ,  H05K2201/09845

Abstract: To provide a printed wiring board where the impedance between pads through which differential signals pass has been set to a predetermined standard value. The printed wiring board includes a first conductor layer extending over an area excluding a hole formed for each pad group and filled with a dielectric, and a second conductor layer extending over an area containing areas facing the hole. The hole encompasses a plurality of areas facing predetermined respective pads which are adjacent to each other and which form the pad group from among the plurality of pads.

Abstract translation: 为了提供印刷电路板，其中差分信号通过的焊盘之间的阻抗已经被设置为预定的标准值。 印刷布线板包括在除了为每个焊盘组形成并填充有电介质的孔之外的区域上延伸的第一导体层，以及在包含面向孔的区域的区域上延伸的第二导体层。 该孔包围面对预定相应焊盘的多个区域，这些区域彼此相邻并且从多个焊盘中形成焊盘组。

公开(公告)号：US06767252B2

公开(公告)日：2004-07-27

申请号：US10267443

申请日：2002-10-09

Applicant: James L. McGrath ,  James P. Capadona ,  Daniel B. McGowan ,  Augusto P. Panella

Inventor： James L. McGrath ,  James P. Capadona ,  Daniel B. McGowan ,  Augusto P. Panella

IPC: H01R2370

CPC classification number: H05K1/117 ,  H01R12/721 ,  H01R13/6585 ,  H05K1/0219 ,  H05K2201/093 ,  H05K2201/0949 ,  H05K2201/0969 ,  H05K2201/09709 ,  H05K2201/09727

Abstract: A differential signal connector that is used for edge card application has a plurality of differential signal terminals and associated ground terminals arranged in “triplets”, i.e., distinct sets of three conductive terminals, each such triplet including a pair of differential signal terminals and one associated ground terminal. The ground terminal is flanked by the two differential signal terminals and each triplet is spaced apart from an adjacent triplet by a spacing which is greater than any single spacing between adjacent terminals within a triplet. Circuit boards to which such a connector is mounted are also disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.

Abstract translation: 用于边缘卡应用的差分信号连接器具有多个差分信号端子和以“三联体”排列的相关联的接地端子，即，三组导电端子的不同组合，每个这样的三联组件包括一对差分信号端子和一个相关联的 接地端。 接地端子侧面是两个差分信号端子，每个三极管与相邻的三通线隔开一个间隔，该间隔大于三线态内的相邻端子之间的任何单个间隔。 还公开了安装这种连接器的电路板，并且它们具有特定的端接迹线图案，通常采用延伸穿过电路板的电镀通孔的形式。 这些通孔被布置成三角形图案，并且电路板的接地参考平面设置有空隙，一个空隙相关联并且包围一对单个三端口的差分信号通路。 这减小了信号通路的电容，从而增加了发射区域内的电路板的阻抗，以减少连接器 - 电路板接口中的阻抗不连续性。

公开(公告)号：US06762503B2

公开(公告)日：2004-07-13

申请号：US10230962

申请日：2002-08-29

Applicant: Teck Kheng Lee

Inventor： Teck Kheng Lee

IPC: H01L2348

CPC classification number: H05K1/112 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/28 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/0969 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A solder ball pad for mounting and connecting of electronic devices and, more particularly, apparatus and methods providing an improved solder ball pad structure on a substrate, such as a printed circuit board (“PCB”) or a semiconductor die, while enabling better use of the spaces between adjacent solder ball pads and at the same time providing increased surface area for bonding to a solder ball. Substrates, electronic device assemblies and systems incorporating the invention are also disclosed. The inventive solder ball pad structure comprises a metal pad layer that is partially exposed by an aperture in an insulative mask layer, but not exposing any surrounding substrate surface, an optional metallic or polymer interface layer formed onto at least a portion of the exposed area of the metal pad layer and onto at least a portion of a sidewall of the solder mask formed by the aperture as well as extending onto the top surface of the solder mask, a copper layer formed onto the interface layer (if used), and extending up the vertical wall and out over the top surface of the solder mask, followed by nickel and gold layers to enhance the wettability of the resulting solder ball pad surface.

Abstract translation: 一种用于安装和连接电子器件的焊球垫，更具体地，在诸如印刷电路板（“PCB”）或半导体管芯之类的衬底上提供改进的焊球焊盘结构的设备和方法，同时能够更好地使用 的相邻焊球之间的空间，并且同时提供用于粘合到焊球的增加的表面积。 还公开了基板，电子装置组件和结合本发明的系统。 本发明的焊球焊盘结构包括金属焊盘层，其通过绝缘掩模层中的孔部分地暴露，但不暴露任何周围的衬底表面，任选的金属或聚合物界面层形成在暴露区域的至少一部分上 所述金属焊盘层并且在由所述孔形成的所述焊料掩模的侧壁的至少一部分上并且延伸到所述焊接掩模的顶表面上，形成在所述界面层上的铜层（如果使用）并且向上延伸 垂直的壁和超过焊接面的顶面，然后是镍和金层，以增强所得到的焊球表面的润湿性。

公开(公告)号：US20040106321A1

公开(公告)日：2004-06-03

申请号：US10719937

申请日：2003-11-21

Inventor： Andrew Harvey Barr ,  Jeremy Ian Wilson ,  Irving McKenzie Birmingham

IPC: H01R012/24

CPC classification number: H05K1/028 ,  H01B7/0009 ,  H01B7/0823 ,  H05K1/0224 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09745

Abstract: An embodiment of a cable system includes a cable that has a conductor, a power layer and dielectric material. The conductor is operative to carry a signal, the dielectric material is located at least partially between the conductor and the power layer, and the power layer is operative as ground. The power layer is formed of a conductive material and includes a first region and an adjacent second region. The first region includes a greater amount of the conductive material than the second region so that the power layer is less resistant to bending along the second region than along the first region. Methods and other systems are also provided.

公开(公告)号：US20040090760A1

公开(公告)日：2004-05-13

申请号：US10239732

申请日：2002-11-13

Inventor： Walter Schmidt

IPC: H05K001/11 ,  H05K001/14

CPC classification number: H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0263 ,  H05K1/0268 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/113 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/162 ,  H05K1/185 ,  H05K3/005 ,  H05K3/0055 ,  H05K3/0061 ,  H05K3/041 ,  H05K3/046 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4084 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09636 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2201/10598 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/163 ,  Y02P70/613 ,  H01L2924/00

Abstract: The electrical connecting element includes an essentially stiff core, essentially mechanically stiff and printed circuit boards and/or high density interconnects with conductor paths serving as interconnects. The core includes two parts (1, 3) that can be fixed to each other. Between the two parts, a cavity (101) can be formed. Components (103) producing a lot of heat or requiring protection from environmental influences can be placed in the cavity.

Abstract translation: 电连接元件包括基本上刚性的芯，基本上机械刚性的印刷电路板和/或具有用作互连的导体路径的高密度互连。 核心包括可以彼此固定的两个部分（1,3）。 在两个部分之间，可以形成空腔（101）。 产生大量热量或需要防止环境影响的部件（103）可以放置在空腔中。