公开(公告)号：US11623813B2

公开(公告)日：2023-04-11

申请号：US17435198

申请日：2020-02-06

Applicant: NAMICS CORPORATION

Inventor： Hiroki Myodo ,  Masaaki Hoshiyama

IPC: B65D83/00

Abstract: There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

公开(公告)号：US20230013549A1

公开(公告)日：2023-01-19

申请号：US17782211

申请日：2020-09-25

Applicant: NAMICS CORPORATION

Inventor： Pawel Czubarow ,  Daisuke Hashimoto ,  Yoshitaka Kamata ,  Toshiyuki Sato

IPC: H01C7/10 ,  H01C7/102 ,  H01C17/065

Abstract: Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).

公开(公告)号：US20220144531A1

公开(公告)日：2022-05-12

申请号：US17435198

申请日：2020-02-06

Applicant: NAMICS CORPORATION

Inventor： Hiroki MYODO ,  Masaaki HOSHIYAMA

IPC: B65D83/00

Abstract: There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

公开(公告)号：US20180358484A1

公开(公告)日：2018-12-13

申请号：US15579815

申请日：2016-06-03

Applicant: NAMICS CORPORATION

Inventor： Seiya KONNO

IPC: H01L31/0224 ,  C03C8/18 ,  H01B1/22 ,  H01L21/288 ,  H01L31/0272

Abstract: An electro-conductive paste which includes an electro-conductive powder, a multiple oxide containing tellurium oxide, and an organic vehicle. The electro-conductive paste contains 0.1 parts by weight to 10 parts by weight of the multiple oxide based on 100 parts by weight of the electro-conductive powder, and the content ratio of the tellurium oxide in 100% by weight of the multiple oxide as TeO2 is 3% by weight to 30% by weight.

公开(公告)号：US20170335090A1

公开(公告)日：2017-11-23

申请号：US15528739

申请日：2015-09-01

Applicant: NAMICS Corporation

Inventor： Tomoya YAMAZAWA ,  Haruyuki YOSHII

IPC: C08K9/06 ,  C08K3/22 ,  H01L23/31 ,  H01L23/00 ,  H01L23/29

CPC classification number: C08K9/06 ,  C08K3/22 ,  C08K2003/2227 ,  C08L63/00 ,  C09J163/00 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13147 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73204 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/05432

Abstract: Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).

公开(公告)号：US09795040B2

公开(公告)日：2017-10-17

申请号：US15130167

申请日：2016-04-15

Applicant: Namics Corporation

Inventor： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

IPC: H05K3/38 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K3/385 ,  H05K1/09 ,  H05K3/389 ,  H05K3/4652 ,  H05K2203/1157 ,  Y10T156/10

Abstract: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

公开(公告)号：US20170243849A1

公开(公告)日：2017-08-24

申请号：US15519719

申请日：2015-10-22

Applicant: NAMICS CORPORATION

Inventor： Koji SASAKI ,  Noritsuka MIZUMURA

IPC: H01L23/00 ,  C08K3/08 ,  H01B1/22 ,  C09J167/00 ,  C09J11/06 ,  C09J9/02 ,  C08L67/00

Abstract: A conductive composition, which can form bonded portions and is capable of maintaining a thickness of the bonded portions and bonding strength, and which includes: (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent, and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart, determined by a measurement using a differential scanning calorimeter, within a range of 80° C. to 170° C.

公开(公告)号：US09574091B2

公开(公告)日：2017-02-21

申请号：US14436565

申请日：2013-10-18

Applicant: NAMICS CORPORATION

Inventor： Yoshiaki Yoshii

IPC: H01B1/20 ,  H01B1/22 ,  C09D5/24 ,  C09D7/12 ,  C09D201/00 ,  H05K1/09 ,  H01B1/16 ,  H05K1/18 ,  H05K3/10

CPC classification number: C09D5/24 ,  C09D7/40 ,  C09D201/00 ,  H01B1/16 ,  H01B1/22 ,  H05K1/092 ,  H05K1/18 ,  H05K3/10 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/12

Abstract: A conductive paste including: (A) a silver powder; (B) a glass frit; (C) an organic binder; and (D) a powder containing copper, tin, and manganese.

Abstract translation: 导电浆料，包括：（A）银粉; （B）玻璃料; （C）有机粘合剂; 和（D）含有铜，锡和锰的粉末。

公开(公告)号：US20170022356A1

公开(公告)日：2017-01-26

申请号：US15039231

申请日：2014-11-28

Applicant: NAMICS CORPORATION

Inventor： Tomoya YAMAZAWA ,  Kazuyuki KOHARA ,  Kodai OKOSHI ,  Nobuyuki ABE

IPC: C08L63/00 ,  C08G59/50 ,  H01L23/29 ,  C08G59/62 ,  H01L23/31 ,  C08G59/24 ,  C08G59/42

CPC classification number: C08L63/00 ,  C08G59/24 ,  C08G59/245 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08G59/5033 ,  C08G59/621 ,  C08K3/36 ,  C08L2203/206 ,  H01L21/563 ,  H01L23/29 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3142 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83102 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/01048 ,  H01L2924/00012 ,  H01L2924/014

Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 2 μm or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.

Abstract translation: 环氧树脂组合物包括：（A）环氧树脂; （B）固化剂; （C）0.1〜10质量％的平均粒径为10nm以上且100nm以下的二氧化硅填料; （D）47〜75质量％的平均粒径为0.3μm以上且2μm以下的二氧化硅填料; 和（E）0.1〜8质量％的弹性体，其中成分（C）和成分（D）总计含有50.1〜77质量％。

公开(公告)号：US20160280845A1

公开(公告)日：2016-09-29

申请号：US15034726

申请日：2014-12-12

Applicant: NAMICS CORPORATION

Inventor： Kazuyoshi YAMADA

IPC: C08G59/42 ,  C08L63/00 ,  C08G59/50

Abstract: To provide a technique for producing an epoxy resin cured product having toughness and elasticity. (A) the amine curingagent (B) an epoxy resin curing agent characterized in that the acrylic block copolymer is dissolved.

Abstract translation: 提供一种具有韧性和弹性的环氧树脂固化物的制造技术。 （A）胺固化剂（B）环氧树脂固化剂，其特征在于所述丙烯酸系嵌段共聚物溶解。